SEMICONDUCTOR DEVICE INCLUDING A SUPERLATTICE AND AN ASYMMETRIC CHANNEL AND RELATED METHODS

    公开(公告)号:US20200343380A1

    公开(公告)日:2020-10-29

    申请号:US16853875

    申请日:2020-04-21

    摘要: A semiconductor device may include a substrate and spaced apart first and second doped regions in the substrate. The first doped region may be larger than the second doped region to define an asymmetric channel therebetween. The semiconductor device may further include a superlattice extending between the first and second doped regions to constrain dopant therein. The superlattice may include a plurality of stacked groups of layers, with each group of layers comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions. A gate may overly the asymmetric channel.

    SEMICONDUCTOR DEVICE INCLUDING BODY CONTACT DOPANT DIFFUSION BLOCKING SUPERLATTICE HAVING REDUCED CONTACT RESISTANCE

    公开(公告)号:US20200161430A1

    公开(公告)日:2020-05-21

    申请号:US16193011

    申请日:2018-11-16

    IPC分类号: H01L29/15 H01L27/088

    摘要: A semiconductor device may include a semiconductor layer, spaced apart source and drain regions in the semiconductor layer with a channel region extending therebetween, and a gate on the channel region. The semiconductor device may further include a body contact in the semiconductor layer and comprising a body contact dopant diffusion blocking superlattice extending through the body contact to divide the body contact into a first body contact region and an second body contact region with the second body contact region having a same conductivity and higher dopant concentration than the first body contact region. The body contact dopant diffusion blocking superlattice may include a respective plurality of stacked groups of layers, with each group of layers comprising a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions.

    Method for making CMOS image sensor including pixels with read circuitry having a superlattice

    公开(公告)号:US10529768B2

    公开(公告)日:2020-01-07

    申请号:US15843113

    申请日:2017-12-15

    摘要: A method for making a CMOS image sensor may include forming an active pixel sensor array including pixels, each including a photodiode and read circuitry coupled to the photodiode and including transistors defining a 4T cell arrangement. At least one of the transistors may include a first semiconductor layer and a superlattice on the first semiconductor layer including a plurality of stacked groups of layers, with each group including a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and at least one non-semiconductor monolayer constrained within a crystal lattice of adjacent base semiconductor portions. The transistor(s) may also include a second semiconductor layer on the superlattice, spaced apart source and drain regions in the second semiconductor layer defining a channel therebetween, and a gate comprising a gate insulating layer on the second semiconductor layer and a gate electrode on the gate insulating layer.

    Method for making CMOS image sensor with buried superlattice layer to reduce crosstalk

    公开(公告)号:US10396223B2

    公开(公告)日:2019-08-27

    申请号:US15843044

    申请日:2017-12-15

    摘要: A method for making a CMOS image sensor may include forming a superlattice on a semiconductor substrate having a first conductivity type, with the superlattice including a plurality of stacked groups of layers. Each group of layers may include a plurality of stacked base semiconductor monolayers defining a base semiconductor portion, and a non-semiconductor monolayer(s) constrained within a crystal lattice of adjacent base semiconductor portions. The method may further include forming a plurality of laterally adjacent photodiodes on the superlattice. Each photodiode may include a semiconductor layer on the superlattice and having a first conductivity type dopant and with a lower dopant concentration than the semiconductor substrate, a retrograde well extending downward into the semiconductor layer and having a second conductivity type, a first well around a periphery of the retrograde well having the first conductivity type, and a second well within the retrograde well having the first conductivity type.