公开(公告)号：US20090091947A1

公开(公告)日：2009-04-09

申请号：US12071958

申请日：2008-02-28

Applicant: Wei-Jen Chou ,  Chien-Chung Hsiao ,  Bor-Jyh Pan ,  Chiao-Chih Yang

Inventor： Wei-Jen Chou ,  Chien-Chung Hsiao ,  Bor-Jyh Pan ,  Chiao-Chih Yang

IPC: F21V7/04 ,  G09G3/32

CPC classification number: G02F1/133603 ,  G02F2001/133613 ,  G09G3/3413 ,  G09G2330/02 ,  G09G2360/145

Abstract: A surface light source structure having a circuit board, a first light emitting diode (LED) array, and a second LED array is provided. The first and second LED arrays are assembled on the circuit board. Each LED rows of the two LED arrays has a plurality of LED units connected in series. The LED rows of the first LED array are connected in parallel. The LED rows of the second LED array are connected in parallel. The LED rows of the second LED array are intersected between the LED rows of the first LED array. Positive-to-negative directions of the LED units of the first and second LED array are arranged in opposite directions.

Abstract translation: 提供具有电路板，第一发光二极管（LED）阵列和第二LED阵列的表面光源结构。 第一和第二LED阵列组装在电路板上。 两个LED阵列的每个LED行具有串联连接的多个LED单元。 第一LED阵列的LED行并联连接。 第二LED阵列的LED行并联连接。 第二LED阵列的LED行在第一LED阵列的LED行之间相交。 第一和第二LED阵列的LED单元的正向负方向被布置在相反的方向。

公开(公告)号：US08308317B2

公开(公告)日：2012-11-13

申请号：US12071958

申请日：2008-02-28

Applicant: Wei-Jen Chou ,  Chien-Chung Hsiao ,  Bor-Jyh Pan ,  Chiao-Chih Yang

Inventor： Wei-Jen Chou ,  Chien-Chung Hsiao ,  Bor-Jyh Pan ,  Chiao-Chih Yang

IPC: G09F13/04 ,  G09F13/08 ,  F21V9/00 ,  H05B37/00 ,  H05B39/00 ,  H05B41/00

CPC classification number: G02F1/133603 ,  G02F2001/133613 ,  G09G3/3413 ,  G09G2330/02 ,  G09G2360/145

Abstract: A surface light source structure having a circuit board, a first light emitting diode (LED) array, and a second LED array is provided. The first and second LED arrays are assembled on the circuit board. Each LED rows of the two LED arrays has a plurality of LED units connected in series. The LED rows of the first LED array are connected in parallel. The LED rows of the second LED array are connected in parallel. The LED rows of the second LED array are intersected between the LED rows of the first LED array. Positive-to-negative directions of the LED units of the first and second LED array are arranged in opposite directions.

Abstract translation: 提供具有电路板，第一发光二极管（LED）阵列和第二LED阵列的表面光源结构。 第一和第二LED阵列组装在电路板上。 两个LED阵列的每个LED行具有串联连接的多个LED单元。 第一LED阵列的LED行并联连接。 第二LED阵列的LED行并联连接。 第二LED阵列的LED行在第一LED阵列的LED行之间相交。 第一和第二LED阵列的LED单元的正向负方向被布置在相反的方向。

公开(公告)号：US20080093620A1

公开(公告)日：2008-04-24

申请号：US11841140

申请日：2007-08-20

Applicant: Liang-Chih Lee ,  Chiao-Chih Yang ,  Chien-Min Wang

Inventor： Liang-Chih Lee ,  Chiao-Chih Yang ,  Chien-Min Wang

IPC: H01L33/00

CPC classification number: H01L33/62 ,  H01L24/29 ,  H01L24/83 ,  H01L33/641 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A light emitting diode (LED) package including a carrier, an adhering layer and an LED chip is provided. The adhering layer is disposed on the carrier. The LED chip is disposed on the adhering layer and electrically connected to the carrier. The material of the adhering layer comprises a lead-free tin-based eutectic alloy. Furthermore, a manufacturing method for the LED package is provided.

Abstract translation: 提供了包括载体，粘附层和LED芯片的发光二极管（LED）封装。 粘附层设置在载体上。 LED芯片设置在粘合层上并与载体电连接。 粘合层的材料包括无铅锡基共晶合金。 此外，提供了用于LED封装的制造方法。

公开(公告)号：US09557470B2

公开(公告)日：2017-01-31

申请号：US13848065

申请日：2013-03-21

Applicant: Hsin-Hung Lee ,  Chiao-Chih Yang ,  Wei-Ching Wu ,  Hung-Sen Lin

Inventor： Hsin-Hung Lee ,  Chiao-Chih Yang ,  Wei-Ching Wu ,  Hung-Sen Lin

IPC: F21V7/04 ,  F21V8/00

CPC classification number: G02B6/005 ,  G02B6/0021 ,  G02B6/0043 ,  G02B6/0055 ,  G02B6/0058

Abstract: A light source module including a light guide plate, at least one light emitting device, a light-controlling pattern element, and an absorbing pattern element is provided. The light guide plate has a light emitting surface, a first surface opposite the light emitting surface, and at least one opening. The opening passes through the first surface and extends from the first surface toward the light emitting surface. The at least one light emitting device is disposed in the opening and arranged along an arranging direction. The light-controlling pattern element is disposed on the light emitting surface and covers the opening and the light emitting device. The opening faces towards the absorbing pattern element. The absorbing pattern element is disposed besides one of the at least one light emitting device and extends toward a side wall of the opening. Moreover, another two light source modules are also provided.

Abstract translation: 提供了一种包括导光板，至少一个发光器件，光控制图案元件和吸收图案元件的光源模块。 导光板具有发光表面，与发光表面相对的第一表面和至少一个开口。 开口穿过第一表面并从第一表面延伸到发光表面。 所述至少一个发光器件设置在所述开口中并沿排列方向布置。 光控制图案元件设置在发光表面上并覆盖开口和发光器件。 开口朝向吸收图案元件。 吸收图案元件除了至少一个发光器件中的一个之外设置并且朝向开口的侧壁延伸。 此外，还提供另外两个光源模块。

公开(公告)号：US20110063875A1

公开(公告)日：2011-03-17

申请号：US12881189

申请日：2010-09-14

Applicant: Chiao-Chih Yang ,  Lei-Ken Hung ,  Hsin-Tse Tsai ,  Yi-Yu Tsai

Inventor： Chiao-Chih Yang ,  Lei-Ken Hung ,  Hsin-Tse Tsai ,  Yi-Yu Tsai

IPC: F21V8/00 ,  F21V29/00

CPC classification number: G02B6/0023 ,  G02B6/0085 ,  G02B6/0091

Abstract: A backlight module includes at least one light emitting device capable of emitting a light beam, a light guide plate, and a thermal insulation light guide element. The light guide plate has two surfaces opposite to each other and a side surface connecting the two surfaces. The light emitting device is disposed beside the side surface. The light beam enters the light guide plate through the side surface. The thermal insulation light guide element has a light incident surface and a light emitting surface. The light incident surface having at least one first recess is located in a transmission path of the light beam and between the light emitting device and the side surface. The light emitting surface is disposed between the light incident surface and the side surface. The glass transition temperature of the thermal insulation light guide element is higher than that of the light guide plate.

Abstract translation: 背光模块包括能够发射光束的至少一个发光器件，导光板和保温导光元件。 导光板具有彼此相对的两个表面和连接两个表面的侧表面。 发光装置设置在侧面旁边。 光束通过侧面进入导光板。 保温导光元件具有光入射面和发光面。 具有至少一个第一凹部的光入射表面位于光束的传输路径中，并位于发光器件和侧表面之间。 发光面配置在光入射面和侧面之间。 绝热导光元件的玻璃化转变温度高于导光板的玻璃化转变温度。