公开(公告)号：US20120088117A1

公开(公告)日：2012-04-12

申请号：US12955887

申请日：2010-11-29

Applicant: Chih-Hong Chuang

Inventor： Chih-Hong Chuang

IPC: B32B15/20 ,  B32B15/00 ,  B32B3/10

CPC classification number: H05K3/0097 ,  H05K1/056 ,  H05K3/022 ,  H05K3/06 ,  H05K2203/0169 ,  Y10T428/12361

Abstract: A substrate structure including a first metal substrate, a second metal substrate, a frame fixture, a first conductive layer, a second conductive layer, a first adhesive layer and a second adhesive layer is provided. The second metal substrate is stacked over the first metal substrate. The frame fixture is disposed around the first metal substrate and the second metal substrate. The first adhesive layer is disposed between the first conductive layer and the first metal substrate, and between the first conductive layer and the frame fixture. The first conductive layer is fixed on an upper surface of the frame fixture by the first adhesive layer. The second adhesive layer is disposed between the second conductive layer and the second metal substrate, and between the second conductive layer and the frame fixture. The second conductive layer is fixed on a lower surface of the frame fixture by the second adhesive layer.

Abstract translation: 提供了包括第一金属基板，第二金属基板，框架固定件，第一导电层，第二导电层，第一粘合层和第二粘合剂层的基板结构。 第二金属基板堆叠在第一金属基板上。 框架固定件设置在第一金属基板和第二金属基板周围。 第一粘合剂层设置在第一导电层和第一金属基板之间以及第一导电层和框架固定装置之间。 第一导电层通过第一粘合剂层固定在框架固定件的上表面上。 第二粘合剂层设置在第二导电层和第二金属基板之间，以及第二导电层和框架固定装置之间。 第二导电层通过第二粘合剂层固定在框架固定件的下表面上。

公开(公告)号：US20120007252A1

公开(公告)日：2012-01-12

申请号：US12915514

申请日：2010-10-29

Applicant: TZYY-JANG TSENG ,  Chin-Sheng Wang ,  Chih-Hong Chuang

Inventor： TZYY-JANG TSENG ,  Chin-Sheng Wang ,  Chih-Hong Chuang

IPC: H01L23/34 ,  H01L21/50

CPC classification number: H01L23/498 ,  H01L23/13 ,  H01L23/3677 ,  H01L23/3731 ,  H01L23/3732 ,  H01L23/562 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83001 ,  H01L2224/92247 ,  H01L2924/01019 ,  H01L2924/12042 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A semiconductor package structure includes a dielectric layer, a patterned metal layer, a carrier, a metal layer and a semiconductor die. The dielectric layer has a first surface, a second surface and an opening. The patterned metal layer is disposed on the first surface. The carrier is disposed at the second surface and has a third surface, a fourth surface and at least a through hole. A portion of the third surface and the through hole are exposed by the opening. The metal layer is disposed on the fourth surface and has a containing cavity and at least a heat conductive post extending from the fourth surface and disposed in the through hole. An end of the heat conductive post protrudes away from the third surface, and the containing cavity is located on the end of the heat conductive post. The semiconductor die is located in the containing cavity.

Abstract translation: 半导体封装结构包括电介质层，图案化金属层，载体，金属层和半导体管芯。 电介质层具有第一表面，第二表面和开口。 图案化的金属层设置在第一表面上。 载体设置在第二表面，并具有第三表面，第四表面和至少一个通孔。 第三表面和通孔的一部分由开口露出。 金属层设置在第四表面上，并且具有容纳腔和至少从第四表面延伸并设置在通孔中的导热柱。 导热柱的端部从第三表面突出，并且容纳腔位于导热柱的端部上。 半导体管芯位于容纳腔中。