公开(公告)号：US20120056279A1

公开(公告)日：2012-03-08

申请号：US12906401

申请日：2010-10-18

Applicant: Chun-An Huang ,  Hsin-Yi Liao ,  Shih-Kuang Chiu

Inventor： Chun-An Huang ,  Hsin-Yi Liao ,  Shih-Kuang Chiu

IPC: H01L29/84 ,  H01L21/50

CPC classification number: H01L23/5389 ,  B81B7/007 ,  B81B2201/025 ,  B81B2207/096 ,  H01L24/24 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/73267 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A package structure having an MEMS element includes: a packaging substrate having first and second wiring layers on two surfaces thereof and a chip embedded therein; a first dielectric layer disposed on the packaging substrate and the chip; a third wiring layer disposed on the first dielectric layer; a second dielectric layer disposed on the first dielectric layer and the third wiring layer and having a recessed portion; a lid disposed in the recessed portion and on the top surface of the second dielectric layer around the periphery of the recessed portion, wherein the portion of the lid on the top surface of the second dielectric layer is formed into a lid frame on which an adhering material is disposed to allow a substrate having an MEMS element to be attached to the packaging substrate with the MEMS element corresponding in position to the recessed portion, thereby providing a package structure of reduced size and costs with better electrical properties.

Abstract translation: 具有MEMS元件的封装结构包括：在其两个表面上具有第一和第二布线层的封装基板和嵌入其中的芯片; 设置在所述封装基板和所述芯片上的第一电介质层; 设置在所述第一电介质层上的第三布线层; 设置在所述第一电介质层和所述第三布线层上并具有凹部的第二电介质层; 设置在所述凹部的周围的所述凹部和所述第二电介质层的上表面上的盖，其中，所述第二电介质层的顶表面上的所述盖的部分形成为盖框架， 材料被设置为允许具有MEMS元件的基板被附接到包装基板，其中MEMS元件对应于凹部的位置，从而提供具有更好电气特性的尺寸和成本降低的封装结构。