Abstract:
A method for fabricating a semiconductor device includes forming an etch target layer over a substrate that includes a cell region and a peripheral region. A first hard mask layer, a second hard mask layer, and an anti-reflective coating layer are formed over the etch target layer. A photosensitive pattern is formed over the anti-reflective coating layer. The anti-reflective coating layer is etched to have a width smaller than the width of the photosensitive pattern. The second hard mask layer is etched. A main etching and an over-etching are performed on the first hard mask layer. The etch target layer is then etched.
Abstract:
A compatible type optical pickup using a wedge type beam splitter that can record and/or reproduce information on/from optical recording media having different formats. The compatible type optical pickup includes: a first light source that generates and emits a first light beam of a predetermined wavelength; a second light source that generates and emits a second light beam having a different wavelength from that of the first light beam; a wedge type beam splitter disposed in an optical path between the first and second light sources, which changes the traveling paths of the first and second light beams to allow the first and second light beams to travel along the same optical path and minimizes aberrations; a main beam splitter disposed in an optical path between the wedge type beam splitter and an optical recording medium, which changes the traveling paths of incident light beams; an objective lens that focuses the first and second light beams entered via the main beam splitter onto the optical recording medium; and a main photodetector that receives the first and second light beams reflected from the optical recording medium detects an information signal and an error signal.
Abstract:
A heat source having a device emitting heat, a case protecting and supporting the device, and a thermoelectric element absorbing the heat emitted from the device and dissipating the heat to an outside.
Abstract:
A method for fabricating a semiconductor device includes: providing a substrate structure including a bit line and a capacitor formed apart from each other at a different level; forming first, second, and third insulation layers over the bit line, the second insulation layer being a first etch stop layer; forming a second etch stop layer over a top electrode of the capacitor; forming a fourth insulation layer over the third insulation layer and the second etch stop layer; and performing a plurality of etch steps to expose an upper surface of the bit line and an upper surface of the capacitor.
Abstract:
A compatible type optical pickup using a wedge type beam splitter that can record and/or reproduce information on/from optical recording media having different formats. The compatible type optical pickup includes: a first light source that generates and emits a first light beam of a predetermined wavelength; a second light source that generates and emits a second light beam having a different wavelength from that of the first light beam; a wedge type beam splitter disposed in an optical path between the first and second light sources, which changes the traveling paths of the first and second light beams to allow the first and second light beams to travel along the same optical path and minimizes aberrations; a main beam splitter disposed in an optical path between the wedge type beam splitter and an optical recording medium, which changes the traveling paths of incident light beams; an objective lens that focuses the first and second light beams entered via the main beam splitter onto the optical recording medium; and a main photodetector that receives the first and second light beams reflected from the optical recording medium detects an information signal and an error signal.
Abstract:
A method and apparatus for compensating tilt. The tilt compensation method includes: obtaining one of a jitter best, an RF envelope, and a focus DC offset (FODC) from a detection signal of the ROM data region and determining whether the obtained value is within a tolerance range; and obtaining an initial skew compensation value using the obtained value when the obtained value is within the tolerance, changing the magnitude of current applied to an actuator designed to perform driving in at least three-axis directions to drive an objective lens of an optical pickup assembly in a radial tilt direction when the obtained value is not within the tolerance range, and repeating the obtaining of one of the jitter best, the RF envelope, and the FODC and changing the magnitude of the current until the obtained value is within the tolerance range.
Abstract:
A harmonic wave generator including a light source to generate a fundamental wave having a predetermined wavelength, a non-linear material to transform at least a portion of the fundamental wave generated by the light source into a harmonic wave having a shorter wavelength than the fundamental wave, and a first optical device to separate the harmonic wave generated by the non-linear material from the fundamental wave. The harmonic wave generator further includes a second optical device between the condensing lens and the non-linear material to adjust the depth of the focus of light. The harmonic wave generator is easily assembled and can be manufactured at a low cost. A harmonic wave having high power can be generated.