公开(公告)号：US06807972B2

公开(公告)日：2004-10-26

申请号：US10113495

申请日：2002-03-29

Applicant: Ho-Man Rodney Chiu ,  Eugene Smargiassi ,  Steven Verhaverbeke ,  Brian H. Burrows

Inventor： Ho-Man Rodney Chiu ,  Eugene Smargiassi ,  Steven Verhaverbeke ,  Brian H. Burrows

IPC: B08B302

CPC classification number: H01L21/67051 ,  B08B3/02 ,  B08B17/00 ,  Y10S134/902

Abstract: A single wafer cleaning chamber that includes a rotatable bracket that can place a wafer beneath an upper end of a catch cup during a wafer cleaning process, a gutter positioned above a wafer transfer slit; where the catch cup can mate with the gutter to create a gap, and with the upper end of the catch cup positioned at a height equal to or higher than the gutter.

Abstract translation: 单晶片清洗室，其包括可旋转支架，其可在晶片清洁过程中将晶片放置在捕捉杯的上端下方，位于晶片转移狭缝上方的沟槽; 捕捉杯可以与沟槽匹配以产生间隙，并且捕捉杯的上端位于等于或高于沟槽的高度。

公开(公告)号：US06535628B2

公开(公告)日：2003-03-18

申请号：US09173665

申请日：1998-10-15

Applicant: Eugene Smargiassi ,  Wayez R. Ahmad

Inventor： Eugene Smargiassi ,  Wayez R. Ahmad

IPC: G06K962

CPC classification number: G06T7/0008 ,  G06T7/001 ,  G06T2207/30148

Abstract: During a wafer process, fragments can break away from a wafer. The wafer fragments can compromise the accuracy of the temperature signals generated by sensor probes in a rapid thermal process. In particular, the fragments can attenuate or otherwise interfere with the radiation received from the wafer. This interference can undermine the accuracy of the temperature measurement signal generated by the probes. If the temperature control function is compromised, excessive temperature gradients can result in damage to the wafer, reducing device yield and degrading device quality. To alleviate the effects of wafer fragments, the presence of a wafer fragment is detected. An image acquisition device acquires an image of an area adjacent the sensor probe. A processor analyzes the acquired image to determine whether a wafer fragment is present. One approach involves comparing the acquired image to a reference image taken in the absence of a wafer fragment quantifying the amount of deviation. Another approach involves analyzing the acquired image for optical density contrast changes indicative of the presence of a wafer fragment. Detection of a wafer fragment allows the rapid thermal process to be stopped so that the fragment can be cleared away, either manually or automatically, prior to insertion of the next wafer into the chamber.

Abstract translation: 在晶片工艺期间，碎片可以从晶片脱离。 晶片碎片可能会影响传感器探头在快速热处理过程中产生的温度信号的精确度。 特别地，碎片可以衰减或以其他方式干扰从晶片接收的辐射。 这种干扰可能会破坏由探头产生的温度测量信号的精度。 如果温度控制功能受损，过度的温度梯度可能会导致晶片损坏，降低设备产量并降低设备质量。 为了减轻晶片碎片的影响，检测到晶片片段的存在。 图像采集装置获取与传感器探针相邻的区域的图像。 处理器分析所获取的图像以确定晶片碎片是否存在。 一种方法包括将所获取的图像与在不存在限制偏差量的晶片片段的情况下拍摄的参考图像进行比较。 另一种方法涉及分析所获得的图像以获得指示晶片片段存在的光密度对比度变化。 晶片片段的检测允许快速热处理被停止，使得在将下一个晶片插入腔室之前，片段可以手动或自动清除。

公开(公告)号：US06515261B1

公开(公告)日：2003-02-04

申请号：US10093275

申请日：2002-03-06

Applicant: Eugene Smargiassi ,  Aaron Hunter

Inventor： Eugene Smargiassi ,  Aaron Hunter

IPC: F27B514

CPC classification number: H01L21/67248 ,  C23C16/4586 ,  C23C16/481 ,  C30B25/12

Abstract: An apparatus and method for thermally processing a substrate employs lift pin for supporting or contacting the substrate while conveying radiation from the substrate to a detector and/or processor through a hollow member. The lift pin comprises a contact member flexibly mounted on the hollow member to adjust to the angle of the substrate. By conforming the orientation of the contact member to the angle of the substrate, accurate detection and processing of the substrate may be performed.

Abstract translation: 用于热处理衬底的装置和方法使用提升销来支撑或接触衬底，同时通过中空构件将辐射从衬底传送到检测器和/或处理器。 提升销包括柔性地安装在中空构件上的接触构件以适应基板的角度。 通过使接触部件的取向与基板的角度一致，可以进行基板的精确的检测和处理。