Curable compositions containing cycloolefin and filler
    12.
    发明授权
    Curable compositions containing cycloolefin and filler 失效
    含有环烯烃和填料的固化组合物

    公开(公告)号:US6001909A

    公开(公告)日:1999-12-14

    申请号:US736703

    申请日:1996-10-28

    申请人: Frans Setiabudi

    发明人: Frans Setiabudi

    摘要: A composition, comprising(a) at least one tight cycloolefin,(b) a catalyst for the ring-opening metathesis polymerisation,(c) a filler, and(d) a silane of formula I ##STR1## wherein R is a polyvalent organic group having 2 to 100 carbon atoms, where one or more than one carbon atom can be replaced by O, S, N or Si atoms and Y.sub.1, Y.sub.2 and Y.sub.3 are each independently of one another C.sub.1 -C.sub.20 alkyl, C.sub.5 -C.sub.20 aryl, C.sub.6 -C.sub.20 aralkyl, C.sub.5 -C.sub.12 cycloalkyl, C.sub.2 -C.sub.20 -alkoxyalkyl or C.sub.1 -C.sub.20 acyl, gives cured products having excellent mechanical and electrical properties and which is particularly suitable as encapsulating material for electrical and electronic components.

    摘要翻译: 一种组合物,其包含(a)至少一种紧密环烯烃,(b)用于开环易位聚合的催化剂,(c)填料和(d)式I的硅烷,其中R是具有2 至100个碳原子,其中一个或多于一个碳原子可被O,S,N或Si原子取代,并且Y 1,Y 2和Y 3各自独立地为C 1 -C 20烷基,C 5 -C 20芳基,C 6 -C 20芳烷基,C 5 -C 12环烷基,C 2 -C 20烷氧基烷基或C 1 -C 20酰基,得到具有优异的机械和电学性质的固化产物,并且特别适用于电气和电子部件的封装材料。

    Impregnating reinforcing material with photopolymerizable epoxy resin composition
    14.
    发明授权
    Impregnating reinforcing material with photopolymerizable epoxy resin composition 失效
    用光聚合环氧树脂组合物浸渍增强材料

    公开(公告)号:US07488785B2

    公开(公告)日:2009-02-10

    申请号:US11732921

    申请日:2007-04-05

    申请人: Frans Setiabudi

    发明人: Frans Setiabudi

    摘要: Compositions containing (a) a liquid epoxy resin, (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine, (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 10° C./min), (d) a photopolymerizable compound and (e) a photoinitiator, the ratio of the number of equivalents of epoxy groups to that of polymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.

    摘要翻译: 包含(a)液体环氧树脂,(b)脂族或脂环族伯单胺和/或脂族或脂环族二元二胺的组合物,(c)环氧树脂(a)的潜在性固化剂,其在上述温度之前不反应 70℃(通过DSC以10℃/分钟的加热速率测定),(d)光聚合性化合物和(e)光引发剂,环氧基的当量数与可聚合的 基团为1:0.01至1:0.7,适合作为浸渍树脂。

    Epoxy resin composition
    15.
    发明授权
    Epoxy resin composition 失效
    环氧树脂组合物

    公开(公告)号:US07442434B2

    公开(公告)日:2008-10-28

    申请号:US10551938

    申请日:2004-04-05

    摘要: A solvent-free epoxy resin matrix composition comprising: (a) a liquid epoxy resin or a liquid mixture of epoxy resins, (b) a benzylidenamine compound, (c) an aliphatic or cycloaliphatic primary monoamine and/or disecondary diamine; and (d) a catalytically curing tertiary amine. The epoxy resin matrix composition is used as an impregnating resin to form impregnated fiber composite materials.

    摘要翻译: 一种无溶剂的环氧树脂基质组合物,其包含:(a)液体环氧树脂或环氧树脂的液体混合物,(b)亚苄基胺化合物,(c)脂族或脂环族伯胺和/或二仲二胺; 和(d)催化固化的叔胺。 环氧树脂基质组合物用作浸渍树脂以形成浸渍纤维复合材料。

    Epoxy resin
    16.
    发明授权
    Epoxy resin 有权
    环氧树脂

    公开(公告)号:US07217771B2

    公开(公告)日:2007-05-15

    申请号:US10485440

    申请日:2002-07-29

    申请人: Frans Setiabudi

    发明人: Frans Setiabudi

    IPC分类号: C08L63/02 C08L63/04

    摘要: Compositions containing: (a) a liquid epoxy resin; (b) an aliphatic or cycloaliphatic primary monoamine and/or an aliphatic or cycloaliphatic disecondary diamine; (c) a latent curing agent for the epoxy resin (a) which does not react until temperatures above 70° C. (measured by means of DSC at a heating rate of 10° C./min); (d) a photopolymerizable compound; and (e) a photoinitiator; the ratio of the number of equivalents of epoxy groups to that of photopolymerizable groups being 1:0.01 to 1:0.7, are suitable as impregnating resins.

    摘要翻译: 组合物,其含有:(a)液体环氧树脂; (b)脂族或脂环族伯单胺和/或脂族或脂环族二仲二胺; (c)环氧树脂(a)的潜在性固化剂,其在高于70℃的温度下不起反应(通过DSC以10℃/分钟的升温速度测定); (d)可光聚合化合物; 和(e)光引发剂; 环氧基的当量数与光聚合基团的当量的比例为1:0.01至1:0.7适合作为浸渍树脂。

    Thixotropic agent for filled cycloolefins
    17.
    发明授权
    Thixotropic agent for filled cycloolefins 失效
    用于填充环烯烃的触变剂

    公开(公告)号:US5922802A

    公开(公告)日:1999-07-13

    申请号:US988096

    申请日:1997-12-10

    申请人: Frans Setiabudi

    发明人: Frans Setiabudi

    CPC分类号: C08G61/08 C08L65/00 C08L51/00

    摘要: A composition, comprising(a) a strained cycloolefin,(b) a filler, and(c) 0.01-10.0% by weight, based on the sum of components (a)+(b), of a copolymer selected from the group consisting of core/shell polymers and microgels, is distinguished by having high storage stability and gives polymers having high heat stability, toughness and mechanical strength, which polymers are suitable as encapsulating material for electrical and electronic components.

    摘要翻译: 一种组合物,其包含(a)应变环烯烃,(b)填料,和(c)基于组分(a)+(b))与0.01-10.0重量%的共聚物,所述共聚物选自 核/壳聚合物和微凝胶的特征在于具有高储存稳定性并且提供具有高热稳定性,韧性和机械强度的聚合物,该聚合物适合作为电气和电子部件的封装材料。

    Hardenable epoxide resin mixtures containing a latent hardener, an amine
and a thiol
    18.
    发明授权
    Hardenable epoxide resin mixtures containing a latent hardener, an amine and a thiol 失效
    含有最佳硬化剂,胺和甲醇的可再生环氧树脂混合物

    公开(公告)号:US5214098A

    公开(公告)日:1993-05-25

    申请号:US614805

    申请日:1990-11-16

    摘要: Hardenable mixtures comprising(a) an epoxide resin,(b) a latent epoxide resin hardener which starts to react only at a temperature of at least 80.degree. C. (measured by DSC at a heating rate of 10.degree. C./minute),(c) an amine having at least one amine hydrogen and(d) a thiol having at least one SH group, either the amine (c) having at least two hydrogen atoms bound to one or more nitrogen atoms or the thiol (d) having at least two SH groups, and the difference between the reaction maxima in the DSC diagram at a heating rate of 10.degree. C./minutes being at least 30.degree. C., are suitable for the production of crosslinked products, especially for the production of flexible prepregs having a non-critical B stage and a very good storability.

    摘要翻译: 包含(a)环氧化物树脂的可硬化混合物,(b)潜在环氧树脂硬化剂,其仅在至少80℃的温度下开始反应(通过DSC以10℃/分钟的加热速率测量), (c)具有至少一个胺氢的胺和(d)具有至少一个SH基团的硫醇,具有至少两个与一个或多个氮原子结合的氢原子的胺(c)或硫醇(d)具有 至少两个SH基团,并且DSC图中以10℃/分钟的加热速率为至少30℃的反应最大值之间的差异适用于生产交联产物,特别是用于生产 柔性预浸料具有非临界B阶段和非常好的储存性。

    THERMOSETTING COMPOSITION
    20.
    发明申请
    THERMOSETTING COMPOSITION 有权
    热成分

    公开(公告)号:US20100015343A1

    公开(公告)日:2010-01-21

    申请号:US12525936

    申请日:2008-01-30

    申请人: Frans Setiabudi

    发明人: Frans Setiabudi

    IPC分类号: C08L79/00 B05D3/02

    CPC分类号: C08L61/34 C08G73/0233

    摘要: A thermosetting composition comprising (a) 97 to 40 percent by weight of at least one bis(dihydrobenzoxazine) prepared by the reaction of an unsubstituted or substituted bisphenol with at least one unsubstituted position ortho to each hydroxyl group, formaldehyde and a primary amine; and (b) 3 to 60 percent by weight of at least one bisphenol, wherein the percent by weight refer to the total amount of components (a) and (b), with the proviso that (a) and (b) add up to 100 percent by weight; and (c) optionally other components. Cured products made from these compositions have valuable chemical, physical and mechanical properties.

    摘要翻译: 一种热固性组合物,其包含(a)97至40重量%的至少一种通过未取代或取代的双酚与至少一个未取代的位置邻位于每个羟基,甲醛和伯胺制备的双(二氢苯并恶嗪); 和(b)3至60重量%的至少一种双酚,其中重量百分数是指组分(a)和(b)的总量,条件是(a)和(b)加起来 100重量% 和(c)任选的其它组分。 由这些组合物制成的固化产品具有有价值的化学,物理和机械性能。