Abstract:
A circuit for generating an internal voltage to be supplied to memory elements of a semiconductor memory chip during normal operation and for providing an external voltage to the memory elements during a burn-in test operation. The circuit may be constructed with a driver circuit (50) which receives an external voltage and is controlled to generate the internal voltage. A comparator (300) compares the internal voltage to a first reference voltage to produce a control signal G2 to control the driver circuit (50). An external voltage detector (100) compares a second reference voltage to the external voltage to generate control signal B2. A driver control circuit (200) is enabled by control signal B2, if the external voltage is less than the second reference voltage, to pass control signal G2 to the driver circuit and thereby enable generation of the internal voltage to be equal to, or less than, the operating voltage of the semiconductor memory chip. The driver control circuit is disabled by control signal B2 if the external voltage is greater than the second reference voltage, thereby preventing the control signal G2 of the comparator from controlling conduction by the driver circuit (50) to enable output of the external voltage exhibiting an elevated amplitude to the memory elements for burn-in test operation.
Abstract:
Disclosed is a non-volatile semiconductor memory device and the manufacturing method thereof. The non-volatile semiconductor memory device comprising a semiconductor substrate, and a group of gates electrically isolated from each other and formed on the semiconductor substrate, wherein the group of gates comprises a floating gate formed with a first conductive layer, a control gate formed with a second conductive layer laminated on the floating gate and select gates formed with the first conductive layer and the second conductive layer/formed on both the opposite side of the floating gate and the control gate and with an interposing impurity diffusion region formed on the semiconductor substrate, and wherein the select gates formed with the first conductive layer and the second conductive layer forms contacts on a field oxidation layer, thereby being connected with each other. The gate of the select transistor is formed as a first conductive layer by a self-aligned etching process and a butted contact process. Meanwhile, prior to forming a tunnel oxidized film, a buried n.sup.- layer is formed on a tunnel region pattern so as to be self-aligned, thereby reducing a distance between the select transistor and the storage transistor to within photolithographic processing limits so as to realize the high-integration of the EEPROM.
Abstract:
A nonvolatile semiconductor memory device having a page program mode of operation. The device including a data input buffer for receiving program data from a data line and a plurality of program voltage generating circuits each of which is selectively operable for generating a program voltage output having a first and second logic level. The device further including a plurality of first selecting MOS transistors coupled to respective ones of the program voltage generating circuits and alternating ones of bit lines included in the memory device and a plurality of second selecting MOS transistors coupled to respective ones of the program voltage generating circuits and a second sequences of alternating one of the bit lines. A select circuit having a first output connected to each of the first selecting transistors and a second output connected to each of the second selecting transistors for selectively turning on either of the first and second selecting transistors to thereby selectively couple either the bit lines of the first and second sequence to the program voltage output of the respective ones of the program voltage generating circuits.