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公开(公告)号:US5834297A
公开(公告)日:1998-11-10
申请号:US876365
申请日:1997-06-16
Applicant: Patrick J. Oriel , In Cheol Kim
Inventor: Patrick J. Oriel , In Cheol Kim
CPC classification number: C12N9/0071 , C09B7/00 , C12P17/165
Abstract: A method for the production of indigo and indirubin dyes using a recombinant Escherichia coli containing a gene encoding a phenol hydroxylase from Bacillus stearothermophilus. The dyes are used for coloring cloth and the like.
Abstract translation: 使用含有编码来自嗜热脂肪芽孢杆菌的酚羟化酶的基因的重组大肠杆菌来生产靛蓝和靛玉红染料的方法。 染料用于着色布等。
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12.
公开(公告)号:US08336509B2
公开(公告)日:2012-12-25
申请号:US12770310
申请日:2010-04-29
Applicant: In Cheol Kim
Inventor: In Cheol Kim
IPC: F01P7/02
CPC classification number: F01P7/12
Abstract: A flap control apparatus of a vehicle and a control method thereof are disclosed. The flap control apparatus can control flaps, disposed at the front side of the vehicle to adjust inflow of air into a radiator, and can perform a fail-safe operation by releasing a corresponding flap from a locked state so that the corresponding flap can be opened by drive wind pressure upon occurrence of a malfunction making the flaps substantially non-operative, thereby preventing the engine from overheating.
Abstract translation: 公开了一种车辆的挡板控制装置及其控制方法。 翼片控制装置可以控制设置在车辆前侧的翼片,以调节空气进入散热器的流入,并且可以通过从锁定状态释放相应的翼片来执行故障保护操作,从而可以打开相应的翼片 在发生故障时通过驱动风压使得翼片基本上不起作用,从而防止发动机过热。
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公开(公告)号:US08118124B2
公开(公告)日:2012-02-21
申请号:US12621937
申请日:2009-11-19
Applicant: Yong Suk Shin , Hun Soo Kim , Hee Jun Jeong , In Cheol Kim
Inventor: Yong Suk Shin , Hun Soo Kim , Hee Jun Jeong , In Cheol Kim
IPC: B60K11/08
CPC classification number: F01P7/12 , F01P2031/00
Abstract: A fail-safe air flap control apparatus for a vehicle includes a coolant temperature sensor, a control unit, an actuator, a movable unit, a flap unit, an elastic member and a solenoid unit. The coolant temperature sensor measures the temperature of a coolant. The control unit compares a value measured by the sensor to a reference value and generates a corresponding control signal. The actuator has a rotator which rotates in a clockwise or counterclockwise direction depending on the control signal. The movable unit linearly moves under rotational force of the rotator. The flap unit includes a flap housing having an air flow slot, a flap door mounted to the flap housing to openably close the air flow slot, and a connecting rod connected to the movable unit. The elastic member applies elastic force to the movable unit in a direction in which the flap door opens. The solenoid unit is controlled by the control signal of the control unit so as to either restrain movement of the movable unit and so maintain the flap door in a closed state or to release the movable unit.
Abstract translation: 一种用于车辆的故障安全空气挡板控制装置包括冷却剂温度传感器,控制单元,致动器,可移动单元,翼片单元,弹性构件和螺线管单元。 冷却液温度传感器测量冷却液的温度。 控制单元将由传感器测量的值与参考值进行比较,并产生相应的控制信号。 致动器具有根据控制信号沿顺时针或逆时针方向旋转的旋转器。 可移动单元在旋转体的旋转力下线性移动。 翼片单元包括具有气流槽的翼片壳体,安装到翼片壳体以可打开地关闭气流槽的翼片门和连接到可移动单元的连接杆。 弹性构件沿着挡板门打开的方向向可移动单元施加弹性力。 螺线管单元由控制单元的控制信号控制,以便限制可移动单元的运动,从而将挡板门保持在关闭状态或释放可移动单元。
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公开(公告)号:US06878630B2
公开(公告)日:2005-04-12
申请号:US10238233
申请日:2002-09-10
Applicant: Chull Won Bang , In Cheol Kim , Dong Won Back
Inventor: Chull Won Bang , In Cheol Kim , Dong Won Back
IPC: C30B29/06 , C30B33/08 , H01L21/302 , H01L21/304 , H01L21/306 , H01L21/3063 , H01L21/462
CPC classification number: H01L21/02008 , H01L21/02019 , H01L21/30608
Abstract: A method of manufacturing a wafer. The surface of a wafer for which a lapping process is completed is exposed to a caustic etch process so that the etch rate against the surface of the wafer ranges from about 0.3 to about 0.7 μm/min using an etchant containing from about 42 to about 48% KOH and from about 52 to about 58% H2O. Then, a wafer back side polishing process is controlled in order to prevent a sliding phenomenon without a drop in a chucking voltage. Therefore, a lift-off or peeling phenomenon of a subsequently deposited film is reduced and local variations in the etch rate is also reduced.
Abstract translation: 一种制造晶片的方法。 完成研磨工艺的晶片的表面暴露于苛性蚀刻工艺,使得使用含有约42至约48的蚀刻剂对晶片表面的蚀刻速率为约0.3至约0.7μm/ min %KOH和约52至约58%H 2 O. 然后,控制晶片背面研磨工序,以防止滑动现象而不会使夹紧电压下降。 因此,随后沉积的膜的剥离或剥离现象减少,并且蚀刻速率的局部变化也降低。
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