Abstract:
A machine vision system (1) has two laser sources (2, 3) to illuminate a solder deposit from both sides for comprehensive coverage without occlusion. The camera (4) has an FGPA (32) programmed to define a subset of the sensor array (20) as a region of interest to be processed for each laser source (2, 3). This reduces the amount of data transfer and processing required. The image line (31) is dynamically maintained in the region of interest by adjustement of camara Z position according to warp of the substrate (S).
Abstract:
A display for use in a printed circuit board inspection system for inspecting objects on a printed circuit board is capable of displaying a greater-than-two dimensional image of the shape of the surface of an object resident on the printed circuit board in at least two dimensions. The image of the object is generated based on optical imaging of the object under different illumination configurations.
Abstract:
A measurement system (1) has robotic system (3) mounted over a base plate (2) which provides a vertical height reference. In the optical head (8), a CCD camera (17) is adjustable to be pre-set in height. The optical head (8) also has an upper light source (18) comprising LEDs and a lower light source (25) comprising a white fluorescent lamp (26) for lateral component illumination. An air flow system (45) directs cooling air in a swirling motion around the tube. An image analysis computer (10) automatically performs various tests to co-ordinate optical and mechanical operation.
Abstract:
Solder fillets are inspected post-reflow by illuminating firstly from one side only along a dimension through a row of components. Only pixels arising from light received normal to the joints on that side are analysed. There is then illumination from the opposite side and corresponding image analysis normal to the right side fillets only. This avoids noise arising from reflections from a fillet across to the opposite fillet of an adjacent component.
Abstract:
A system has a projection lens directing on-axis light and low level LEDs directing light to blind microvias. A high resolution camera captures blind microvia images and an image processor recognizes defects according to classifications according to reflected light area and centroid position. The lens is telecentric for particularly effective image capture in blind microvias. The system also has an array of 6000 back lighting LEDs providing illumination for capture of images by a camera. These images are analyzed by the image processor to detect defects such as blocked through microvias.
Abstract:
A closed loop controller (6) has a measurement server (11) which captures measurement data from a measurement machine (3) via a link (22). It also receives production data indicating which placement machine parts were involved in depositing inspected items, via links (20, 21). The server (11) correlates this data and transmits it via a link (23) to a closed loop client (10), which generates process engineer displays of the correlated data and generates a control signal for the placement machine (2). These are fed back via a link (24) for automatic closed loop control.
Abstract:
A solder paste inspection machine carries out the steps of automatically generating inspection data for solder paste deposits, automatically determining a squeegee direction of travel for said paste deposits. It associates the squeegee direction with the inspection data, and feeds the inspection data back to a solder paste printer with an indication of squeegee direction. The direction is determined from three-dimensional range maps, the direction of squeegee travel being in the direction of upward slope.
Abstract:
Images are captured of linear illumination with improved identification of lines and elimination of noise. A most probable line of multiple lines is identified as the one which is widest, and two parallel lines in proximity are regarded as one if their separation is two or one dark pixels. There is an upper line width limit, to eliminate blooming.
Abstract:
Determining the quality of a solder paste deposit includes comparing the fluorescence from a solder paste deposit with that of a deposit having an ideal mixture of flux and metal spheres.
Abstract:
A machine vision system comprising a structured light illuminator, a camera, an image processor, and a controller, wherein the controller dynamically adjusts parameters for structured illumination according to actual position of a subject being inspected.