公开(公告)号：US20240237322A9

公开(公告)日：2024-07-11

申请号：US18201552

申请日：2023-05-24

申请人： ERSA GmbH

发明人： Michael Haas ,  Benedict Fleischmann ,  Harald Grumm ,  Lukas Thanhäuser

IPC分类号： H05K13/08 ,  H05K5/00 ,  H05K13/04

CPC分类号： H05K13/0817 ,  H05K5/0018 ,  H05K13/0465 ,  H05K13/085 ,  H05K13/0895

摘要： A system for determining a degree of contamination of production units of a production line for the printing, equipping and reflow soldering of printed circuit boards, and evaluation unit.

公开(公告)号：US09615495B2

公开(公告)日：2017-04-04

申请号：US14443491

申请日：2013-11-15

申请人： Panasonic Intellectual Property Management Co., Ltd.

发明人： Katsuhiko Itoh ,  Nobuo Komiya

IPC分类号： B23K31/02 ,  H05K13/04 ,  B23K3/06 ,  H05K13/08 ,  H05K3/34 ,  H05K13/00 ,  H05K13/02 ,  H05K3/30

CPC分类号： H05K13/0465 ,  B23K3/0607 ,  B23K3/0638 ,  H05K3/303 ,  H05K3/341 ,  H05K13/00 ,  H05K13/0015 ,  H05K13/021 ,  H05K13/08 ,  H05K13/0812 ,  H05K13/0817 ,  H05K2203/04 ,  H05K2203/166

摘要： An electronic component is mounted on a substrate according to a mounting mode which is set in advance in the following mounting information—when component mounting work is performed. In the mounting information, any one of a first mounting mode in which an electronic component is transferred and mounted to a mounting position which is corrected based on a positional-shift amount between a position of a printed solder and a position of an electrode and a second mounting mode in which the electronic component is transferred and mounted to the mounting position by considering only the position of the electrode as a reference, is set as a mounting mode for performance for each electronic component mounting device.

公开(公告)号：US20170072424A1

公开(公告)日：2017-03-16

申请号：US15266530

申请日：2016-09-15

申请人： Milara Incorporated

发明人： Krassimir D. PETKOV ,  Velimir DERIC ,  Stephen K. BRODEUR

IPC分类号： B05C11/04 ,  H05K3/40 ,  H05K3/32 ,  B05D1/40

CPC分类号： B05C11/04 ,  B05D1/40 ,  B41F15/0818 ,  B41F15/0881 ,  B41F15/42 ,  B41F15/423 ,  B41P2215/132 ,  H05K3/1216 ,  H05K3/1233 ,  H05K3/32 ,  H05K3/40 ,  H05K13/0465 ,  H05K13/0469 ,  H05K13/08 ,  H05K13/0817 ,  H05K13/082 ,  H05K2203/0139 ,  H05K2203/04

摘要： A manufacturing system for applying a material to a workpiece comprising a blade unit having a blade element for selectively moving along first and second axes for applying the material to the workpiece. A reciprocating motor is coupled to the blade unit for reciprocating the blade element along the first axis concurrent with movement of the blade element along the second axis, and a vibration detector is coupled to the blade unit for detecting the vibrational movement of the blade element. The vibration detector generates an output signal corresponding to the vibrational movement of the blade element. A control unit is coupled to the vibration detector for generating an output signal in response to the vibration detector signal, and a regulating device adjusts a parameter of the reciprocating motor in response to the output signal of the control unit.

摘要翻译： 一种用于将材料施加到工件上的制造系统，包括具有用于选择性地沿着第一和第二轴线移动的刀片单元的刀片单元，用于将材料施加到工件。 往复式电动机联接到刀片单元，用于沿刀片元件沿着第二轴线的运动与刀片元件沿着第一轴线往复运动，并且振动检测器联接到刀片单元以检测刀片元件的振动运动。 振动检测器产生对应于叶片元件的振动运动的输出信号。 控制单元耦合到振动检测器，用于响应于振动检测器信号产生输出信号，并且调节装置响应于控制单元的输出信号调整往复式电动机的参数。

公开(公告)号：US09465385B2

公开(公告)日：2016-10-11

申请号：US14109560

申请日：2013-12-17

申请人： CKD Corporation

发明人： Yosuke Kamioka ,  Manabu Okuda ,  Shingo Suzuki

IPC分类号： G06F19/00 ,  G05B19/418 ,  H05K13/08

CPC分类号： G05B19/41875 ,  G05B2219/32209 ,  G05B2219/37217 ,  H05K13/08 ,  H05K13/0817 ,  H05K13/083 ,  Y02P90/22

摘要： In a monitoring system, when there is an evaluation that a product is defective, in a solder print inspecting device that is subject to monitoring, that information is sent to a mobile terminal possessed by an operator. The operator who views the notification performs, through the mobile terminal, a checking task for evaluating whether or not the evaluation result regarding the printed substrate that has been evaluated as a defective product is correct. Depending on the evaluation result, an operating instruction is sent to the solder print inspecting device, which has temporarily stopped the printed substrate. If correction information instructing that the defective-product evaluation be corrected to a non-defective-product evaluation is sent from a mobile terminal to the solder print inspecting device, the solder print inspecting device corrects the defective-product evaluation to a non-defective-product evaluation, and releases the temporary stop of the printed substrate.

摘要翻译： 在监视系统中，当评估产品有缺陷时，在要进行监视的焊料印刷检查装置中，将该信息发送给操作者拥有的移动终端。 查看通知的操作者通过移动终端执行用于评估关于已被评估为缺陷产品的打印基板的评估结果是否正确的检查任务。 根据评估结果，将操作指令发送到已经暂时停止印刷基板的焊料印刷检查装置。 如果从移动终端向焊接印刷检查装置发送指示将缺陷品评价修正为无缺陷品评价的修正信息，则焊料印刷检查装置将缺陷品评价校正为无缺陷品评价， 产品评估，并释放印刷基板的临时停止。

公开(公告)号：US20160234983A1

公开(公告)日：2016-08-11

申请号：US14867241

申请日：2015-09-28

申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

发明人： Katsuhiko ITOH ,  Masanori IKEDA ,  Kenji OKAMOTO

IPC分类号： H05K13/04 ,  H05K3/34

CPC分类号： H05K13/0465 ,  H05K3/3421 ,  H05K3/3478 ,  H05K13/08 ,  H05K13/0817 ,  H05K2203/041

摘要： A component mounting apparatus includes a mounting unit that mounts an electronic component on a board, at least one component supply unit that supplies chip solder, and a control unit that controls the mounting unit to mount the chip solder, which is supplied from the component supply unit, on the board, based on production data in which a size of chip solder to be mounted on each electrode of the board is instructed.

摘要翻译： 一种部件安装装置，包括将电子部件安装在基板上的安装单元，供给芯片焊料的至少一个部件供给部，以及控制单元，其控制从所述部件供给部供给的芯片焊料的安装部 基于生产数据，其中指示要安装在板的每个电极上的芯片焊料的尺寸的单元。

公开(公告)号：US20150223370A1

公开(公告)日：2015-08-06

申请号：US14414928

申请日：2012-07-17

申请人： Junichi Suzuki

发明人： Junichi Suzuki

IPC分类号： H05K13/04 ,  B65G43/08 ,  B65G43/00 ,  B65G37/00

CPC分类号： B65G43/10 ,  B65G37/00 ,  B65G43/00 ,  B65G43/08 ,  B65G2811/0673 ,  H05K13/0061 ,  H05K13/04 ,  H05K13/08 ,  H05K13/0817 ,  H05K13/085

摘要： In a work system for substrates which includes plural working machines conveying circuit substrates through two paths and in which the circuit substrates are conveyed through the two paths from the working machine disposed upstream out of the plural working machines to the working machine disposed downstream, a circuit substrate of which the work result is not good is conveyed to the downstream working machine earlier than the circuit substrate of which the work result is good in a state in which the circuit substrate of which the work result is good and the circuit substrate of which the work result is not good are able to be conveyed to the downstream working machine by the upstream working machine.

摘要翻译： 在基板的工作系统中，包括通过两条路径输送电路基板的多个工作机械，其中，电路基板从设置在多个加工机械的上游的作业机械的两条路径输送到设置在下游的工作机械， 工作结果不好的基板比工作结果良好的电路基板的状态良好地输送到下游工作机械，其中工作结果良好的电路基板和其工作结果良好的电路基板 工作结果不好，能够通过上游工作机向下游工作机输送。

公开(公告)号：US20140200700A1

公开(公告)日：2014-07-17

申请号：US14109560

申请日：2013-12-17

申请人： CKD Corporation

发明人： Yosuke Kamioka ,  Manabu Okuda ,  Shingo Suzuki

IPC分类号： G05B19/418

CPC分类号： G05B19/41875 ,  G05B2219/32209 ,  G05B2219/37217 ,  H05K13/08 ,  H05K13/0817 ,  H05K13/083 ,  Y02P90/22

摘要： In a monitoring system, when there is an evaluation that a product is defective, in a solder print inspecting device that is subject to monitoring, that information is sent to a mobile terminal possessed by an operator. The operator who views the notification performs, through the mobile terminal, a checking task for evaluating whether or not the evaluation result regarding the printed substrate that has been evaluated as a defective product is correct. Depending on the evaluation result, an operating instruction is sent to the solder print inspecting device, which has temporarily stopped the printed substrate. If correction information instructing that the defective-product evaluation be corrected to a non-defective-product evaluation is sent from a mobile terminal to the solder print inspecting device, the solder print inspecting device corrects the defective-product evaluation to a non-defective-product evaluation, and releases the temporary stop of the printed substrate.

摘要翻译： 在监视系统中，当评估产品有缺陷时，在要进行监视的焊料印刷检查装置中，将该信息发送给操作者拥有的移动终端。 查看通知的操作者通过移动终端执行用于评估关于已被评估为缺陷产品的打印基板的评估结果是否正确的检查任务。 根据评估结果，将操作指令发送到已经暂时停止印刷基板的焊料印刷检查装置。 如果从移动终端向焊接印刷检查装置发送指示将缺陷品评价修正为无缺陷品评价的修正信息，则焊料印刷检查装置将缺陷品评价校正为无缺陷品评价， 产品评估，并释放印刷基板的临时停止。

公开(公告)号：US20080166039A1

公开(公告)日：2008-07-10

申请号：US11956951

申请日：2007-12-14

申请人： Kazuki TATEYAMA ,  Hideki OGAWA ,  Satoshi IMI

发明人： Kazuki TATEYAMA ,  Hideki OGAWA ,  Satoshi IMI

IPC分类号： G06K9/00

CPC分类号： H05K3/3484 ,  H05K1/0269 ,  H05K3/1233 ,  H05K3/341 ,  H05K13/0817 ,  H05K13/083 ,  H05K2203/163 ,  Y10T29/49004

摘要： A process control method is provided for a surface mount line including a solder printer for printing solder on a surface of a substrate, a solder print inspector for inspecting the printed solder and outputting printing quality data, a mounter for mounting components on the substrate with the solder printed, a mount inspector for inspecting a state of the mounted components and outputting mounting quality data, a reflow furnace for heating the solder to solder the components to the substrate, and a soldering inspector for inspecting a state of the soldering and outputting soldering pass/fail data. The process control method includes: retrieving the printing quality data, the mounting quality data, and the soldering pass/fail data from a primary recorder with the printing quality data, the mounting quality data, and the soldering pass/fail data recorded therein, calculating representative data for each said component from the printing quality data, and recording the representative data, the mounting quality data, and the soldering pass/fail data for each said component in a secondary recorder; and determining whether the solder printer and the mounter need adjustment by using the data of the components with the soldering pass/fail data indicating conforming among the data recorded in the secondary recorder.

摘要翻译： 提供了一种用于表面安装线的工艺控制方法，该表面安装线包括用于在基板的表面上印刷焊料的焊料打印机，用于检查印刷焊料并输出印刷质量数据的焊料印刷检查器，用于将部件安装在基板上的安装器 焊接印刷，用于检查安装部件的状态并输出安装质量数据的安装检查器，用于加热焊料以将部件焊接到基板的回流炉，以及用于检查焊接和输出焊接通过状态的焊接检查器 /失败数据。 过程控制方法包括：通过记录在其中的打印质量数据，安装质量数据和焊接通过/失败数据，从主记录器检索打印质量数据，安装质量数据和焊接合格/不合格数据，计算 根据打印质量数据为每个所述组件提供代表性数据，并且在二次记录器中记录每个所述部件的代表性数据，安装质量数据和焊接合格/不合格数据; 并且通过使用表示符合记录在副记录器中的数据的焊接合格/不合格数据的部件的数据来确定焊料打印机和安装器是否需要调整。

公开(公告)号：US20020083570A1

公开(公告)日：2002-07-04

申请号：US10037094

申请日：2001-10-25

发明人： Masafumi Inoue ,  Mitsuhaya Tsukamoto ,  Masato Fujioka

IPC分类号： B23P011/00 ,  B21D039/03 ,  H01S004/00

CPC分类号： H05K13/0465 ,  H05K1/0269 ,  H05K3/0008 ,  H05K3/1216 ,  H05K13/0817 ,  H05K13/083 ,  Y10T29/49002 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49826 ,  Y10T29/53052 ,  Y10T29/53091 ,  Y10T29/53178

摘要： A component mounting system which includes a printer for printing solder on electrodes formed on a board; a first inspection unit for detecting positions of printed solder and outputting solder position detection results; a component mounting unit for picking up components from a component feeder carriage and placing the components on the board using mounting heads; a second inspection unit for inspecting positions of the components placed and outputting component position detection results; a soldering unit for soldering the components onto the board by heating and melting solder; and a main controller for updating at least a control parameter for controlling the printer operation or a control parameter for the component mounting unit operation based on at least the solder position detection results or component position detection results. The above configuration enables the accurate and efficient quality control throughout the mounting process.

摘要翻译： 一种部件安装系统，其包括用于在形成在板上的电极上印刷焊料的打印机; 第一检查单元，用于检测印刷焊料的位置并输出焊料位置检测结果; 组件安装单元，用于从部件供给器托架拾取部件，并使用安装头将部件放置在板上; 第二检查单元，用于检查放置的部件的位置并输出部件位置检测结果; 焊接单元，用于通过加热和熔化焊料将部件焊接到板上; 至少基于焊料位置检测结果或分量位置检测结果，至少更新用于控制打印机操作的控制参数或部件安装单元操作的控制参数的主控制器。 上述配置使得能够在整个安装过程中进行准确和有效的质量控制。

公开(公告)号：US12108536B2

公开(公告)日：2024-10-01

申请号：US16919726

申请日：2020-07-02

申请人： KOH YOUNG TECHNOLOGY INC.

发明人： Jeongyeob Kim

IPC分类号： H05K13/08 ,  B23K3/08 ,  B23K101/42

CPC分类号： H05K13/08 ,  B23K3/08 ,  H05K13/0817 ,  H05K13/083 ,  B23K2101/42

摘要： A component mounting system and a method for inspecting mounted components are provided. A component mounting system according to an embodiment, comprises a solder inspection apparatus comparing coordinate information of the solder, which is obtained through measurement of a substrate to which solder is applied, with reference coordinate information to generate coordinate correction data; and a first mounting inspection apparatus comparing a first measurement data obtained by measuring mounting state of a component when the component is mounted based on the coordination correction data through a component mounting apparatus, with the coordinate correction data to verify whether a component is mounted on a position corrected based on the coordinate correction data. In this manner, by adding the verification function for the performance function of the component mounting apparatus to the inspection apparatus, it is possible to monitor the operation state of the component mounting apparatus in each process step.