公开(公告)号：US20090323347A1

公开(公告)日：2009-12-31

申请号：US12274358

申请日：2008-11-20

申请人： YI ZHANG ,  JIN-SONG FENG ,  CHENG-TIEN LAI

发明人： YI ZHANG ,  JIN-SONG FENG ,  CHENG-TIEN LAI

IPC分类号： F21V29/00 ,  H01J7/24

CPC分类号： F21V29/004 ,  F21S2/005 ,  F21V19/001 ,  F21V29/713 ,  F21V29/75 ,  F21V29/76 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED lamp includes a heat sink, a plurality of fin arrays mounted on the heat sink, and a plurality of LED modules mounted on the fin arrays. The heat sink includes a base and a plurality of heat dissipating fins extending from the base. The fin arrays are mounted on a top surface of the base of the heat sink. Each fin array consists of a plurality of fins interlocked together. Each fin array has a bottom mounting surface in contact with the top surface of the base and a top engaging surface defined at an acute angle with respect to the top surface of the base. The LED modules are mounted on the engaging surfaces of the fin arrays, respectively, via heat absorbing plates.

摘要翻译： LED灯包括散热器，安装在散热器上的多个散热片阵列和安装在散热片阵列上的多个LED模块。 散热器包括基部和从基部延伸的多个散热翅片。 翅片阵列安装在散热器底座的顶表面上。 每个翅片阵列由互锁在一起的多个翅片组成。 每个翅片阵列具有与基部的顶表面接触的底部安装表面和相对于基部的顶部表面以锐角限定的顶部接合表面。 LED模块分别通过吸热板安装在翅片阵列的接合表面上。

公开(公告)号：US20090059536A1

公开(公告)日：2009-03-05

申请号：US12269858

申请日：2008-11-12

申请人： CHENG-TIEN LAI ,  JIN-SONG FENG

发明人： CHENG-TIEN LAI ,  JIN-SONG FENG

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  H01L23/3672 ,  H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation assembly includes a heat sink, a retention module surrounding the heat sink, and a pair of wire clips pivotably attached to the retention module to press the heat sink against an electronic component on a printed circuit board. The retention module includes three walls surrounding a rectangular opening through which the heat sink contacts with the electronic component. Two barbs and two supporting members are formed on the three walls. Each clip includes a pivoting section retained in one supporting member, an abutting section pressing the heat sink toward the electronic component, and a locking section locked with one barb, a connecting section connecting the abutting section with the pivoting section, and a handle formed from the locking section. Each clip is entirely located at a corresponding side of the heat sink.

摘要翻译： 散热组件包括散热器，围绕散热器的保持模块以及可枢转地连接到保持模块的一对线夹，以将散热器压靠在印刷电路板上的电子部件上。 保持模块包括围绕矩形开口的三个壁，散热器通过该壁与电子部件接触。 在三面墙上形成两个倒钩和两个支撑构件。 每个夹具包括保持在一个支撑构件中的枢转部分，将热沉朝向电子部件按压的邻接部分，以及一个锁定在一个倒钩上的锁定部分，连接该邻接部分与枢转部分的连接部分以及由 锁定部分。 每个夹子完全位于散热器的相应侧。

公开(公告)号：US07167370B2

公开(公告)日：2007-01-23

申请号：US10950324

申请日：2004-09-23

申请人： Hsieh Kun Lee ,  Wan-Lin Xia ,  Xue-Wen Peng ,  Jin-Song Feng

发明人： Hsieh Kun Lee ,  Wan-Lin Xia ,  Xue-Wen Peng ,  Jin-Song Feng

IPC分类号： H05K7/20 ,  H01L23/34 ,  A44B17/00 ,  F16B13/00

CPC分类号： H01L23/4093 ,  H01L2924/0002 ,  Y10T24/306 ,  H01L2924/00

摘要： A fastener (10) for mounting a heat-radiator (20) to an electronic device (30) on a circuit board (40) is disclosed. The heat-radiator and the circuit board have aligned holes (22, 44). The fastener includes a head (11) having an upper portion (112) with a large diameter and a lower portion (113) with a smaller diameter, a cylindrical spring (14) captured around the lower portion of the head for exerting a spring force against the heat-radiator, and a metallic wire (15) having a first end portion fixed on said head and a second end portion bent to form an engaging portion (152). The engaging portion of the metallic wire compressively passes through the aligned holes of the heat-radiator and the circuit board and is engaged with an underside of the circuit board.

摘要翻译： 公开了一种用于将散热器（20）安装到电路板（40）上的电子设备（30）的紧固件（10）。 散热器和电路板具有对准的孔（22,44）。 紧固件包括具有大直径的上部部分（112）和较小直径的下部（113）的头部（11），围绕头部的下部部分捕获的圆柱形弹簧（14），用于施加弹簧力 以及金属线（15），其具有固定在所述头部上的第一端部和弯曲形成接合部分（152）的第二端部。 金属丝的接合部压缩地穿过散热器和电路板的对准的孔，并与电路板的下侧接合。

公开(公告)号：US20120183396A1

公开(公告)日：2012-07-19

申请号：US13271363

申请日：2011-10-12

申请人： JIN-SONG FENG ,  XING-HUA HE

发明人： JIN-SONG FENG ,  XING-HUA HE

IPC分类号： F01D25/28

CPC分类号： H05K7/20172 ,  F04D25/0613 ,  F04D29/601

摘要： An exemplary fan mount for mounting a fan which has a connecting hole includes a frame and a fastener. The frame comprising a sidewall defining a chamber for receiving the fan and a connecting wall extending inwards from the sidewall towards the chamber. A hollow elastic pole extends out from the connecting wall into the chamber, for inserting in the connecting hole of the fan. A through hole extends through the elastic hole and a corresponding part of the connecting wall. The fastener includes a shaft for engaging in the through hole. When the fastener is inserted in the through hole, the fixing pole deforms to make an outer end thereof away from the connecting wall enlarge, thereby fixing the fastener on the frame.

摘要翻译： 用于安装具有连接孔的风扇的示例性风扇安装架包括框架和紧固件。 所述框架包括限定用于容纳所述风扇的室的侧壁和从所述侧壁向所述室向内延伸的连接壁。 中空的弹性杆从连接壁伸出进入腔室，用于插入风扇的连接孔中。 通孔延伸穿过弹性孔和连接壁的对应部分。 紧固件包括用于接合在通孔中的轴。 当紧固件插入通孔中时，固定杆变形，使得其外端远离连接壁变大，从而将紧固件固定在框架上。

公开(公告)号：US08052300B2

公开(公告)日：2011-11-08

申请号：US12274358

申请日：2008-11-20

申请人： Yi Zhang ,  Jin-Song Feng ,  Cheng-Tien Lai

发明人： Yi Zhang ,  Jin-Song Feng ,  Cheng-Tien Lai

IPC分类号： F21S4/00 ,  F21V29/00

CPC分类号： F21V29/004 ,  F21S2/005 ,  F21V19/001 ,  F21V29/713 ,  F21V29/75 ,  F21V29/76 ,  F21Y2115/10 ,  Y10S362/80

摘要： An LED lamp includes a heat sink, a plurality of fin arrays mounted on the heat sink, and a plurality of LED modules mounted on the fin arrays. The heat sink includes a base and a plurality of heat dissipating fins extending from the base. The fin arrays are mounted on a top surface of the base of the heat sink. Each fin array consists of a plurality of fins interlocked together. Each fin array has a bottom mounting surface in contact with the top surface of the base and a top engaging surface defined at an acute angle with respect to the top surface of the base. The LED modules are mounted on the engaging surfaces of the fin arrays, respectively, via heat absorbing plates.

摘要翻译： LED灯包括散热器，安装在散热器上的多个散热片阵列和安装在散热片阵列上的多个LED模块。 散热器包括基部和从基部延伸的多个散热翅片。 翅片阵列安装在散热器底座的顶表面上。 每个翅片阵列由互锁在一起的多个翅片组成。 每个翅片阵列具有与基部的顶表面接触的底部安装表面和相对于基部的顶部表面以锐角限定的顶部接合表面。 LED模块分别通过吸热板安装在翅片阵列的接合表面上。

公开(公告)号：US20090290342A1

公开(公告)日：2009-11-26

申请号：US12340488

申请日：2008-12-19

申请人： YI ZHANG ,  CHENG-TIEN LAI ,  JIN-SONG FENG ,  WEI-LE WU

发明人： YI ZHANG ,  CHENG-TIEN LAI ,  JIN-SONG FENG ,  WEI-LE WU

IPC分类号： F21V8/00

CPC分类号： F21V17/12 ,  F21K9/00 ,  Y10S362/80

摘要： An LED light source includes an LED module and a light-guiding module fixed on the LED module. The LED module includes a printed circuit board and a plurality of LEDs. The light-guiding module includes a frame placed on the LED module and a plurality of light guiding units engaging with the frame. The frame defines an opening in a lower portion thereof to receive the LEDs of the LED module therein and a recess in an upper portion thereof and in communication with the opening. Each of the light guiding units has a base with two flanges respectively fittingly received in two cutouts of the recess of the frame so that the light guiding unit is movable along the recess until it faces a corresponding LED.

摘要翻译： LED光源包括LED模块和固定在LED模块上的导光模块。 LED模块包括印刷电路板和多个LED。 导光模块包括放置在LED模块上的框架和与框架接合的多个导光单元。 框架在其下部限定开口以将LED模块的LED接收到其中，并且其上部的凹部与开口连通。 每个导光单元具有一个具有两个凸缘的底座，两个凸缘分别适合地容纳在框架的凹部的两个切口中，使得导光单元可以沿着凹部移动，直到其面对相应的LED。

公开(公告)号：US20090027858A1

公开(公告)日：2009-01-29

申请号：US11782459

申请日：2007-07-24

申请人： CHENG-TIEN LAI ,  JIN-SONG FENG ,  SONG-SHUI LIU

发明人： CHENG-TIEN LAI ,  JIN-SONG FENG ,  SONG-SHUI LIU

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/3672 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating device assembly for dissipating heat generated by an electronic component (32) mounted on a printed circuit board (30) is disclosed. The heat dissipating device assembly includes a back plate (26) mounted below the printed circuit board, a retention module (22) secured on the printed circuit board, a heat sink (10) disposed on the retention module for contacting the electronic component, and a pair of wire clips (24) pivotably attached to two opposite walls (222) of the retention module. The pair of clips produce symmetrical pressure acting on two lateral sides of the heat sink, thus holding the heat sink in reliable contact with the electronic component.

摘要翻译： 公开了一种用于散发由安装在印刷电路板（30）上的电子部件（32）产生的热量的散热装置组件。 所述散热装置组件包括安装在所述印刷电路板下方的背板（26），固定在所述印刷电路板上的保持模块（22），设置在所述保持模块上用于接触所述电子部件的散热片（10） 一对线夹（24），其可枢转地连接到保持模块的两个相对的壁（222）。 这对夹子产生作用在散热器的两个侧面上的对称压力，从而将散热器保持与电子部件的可靠接触。

公开(公告)号：US07277281B1

公开(公告)日：2007-10-02

申请号：US11308837

申请日：2006-05-12

申请人： Cui-Jun Lu ,  Jin-Song Feng ,  Qiao Chen

发明人： Cui-Jun Lu ,  Jin-Song Feng ,  Qiao Chen

IPC分类号： H05K7/20

CPC分类号： H01L23/467 ,  F28D15/0266 ,  F28F1/32 ,  H01L23/4006 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipation device is for use in a computer enclosure, the computer enclosure having a group of wires (20) therein. The heat dissipation device includes a heat sink assembly. A wire fixture (60) is mounted on the heat sink assembly and configured for fixing the wires thereto. The wire fixture includes a mounting plate (62) positioned on the heat sink assembly. A bridge (624) projects from the mounting plate to form a receiving room (625) below the bridge. The wires are securely bound together via the wire fixture so as not to be loosened by vibration.

摘要翻译： 散热装置用于计算机外壳，其中计算机外壳具有一组电线（20）。 散热装置包括散热器组件。 电线夹具（60）安装在散热器组件上并且被配置用于将电线固定到其上。 电线固定装置包括位于散热器组件上的安装板（62）。 桥（624）从安装板突出以在桥下方形成接收室（625）。 电线通过电线固定装置固定在一起，以免振动而松动。

公开(公告)号：US20070089862A1

公开(公告)日：2007-04-26

申请号：US11163474

申请日：2005-10-20

申请人： Cui-Jun Lu ,  Jin-Song Feng

发明人： Cui-Jun Lu ,  Jin-Song Feng

IPC分类号： F28D15/00

CPC分类号： H05K7/20181

摘要： A heat dissipation device includes a computer enclosure having a panel, a heat sink installed in the computer enclosure, a fan mounted on the heat sink, a duct and a dust mask. The panel defines an air intake therein. The duct includes a first end portion mounted onto the fan and a second end portion connected to the air intake of the panel so that a sealed access is provided for air straightly flowing from the air intake to the heat sink. The dust mask is removably mounted on the panel and covers the air intake for hindering dust particles from entering the computer enclosure.

摘要翻译： 散热装置包括具有面板的计算机外壳，安装在计算机外壳中的散热器，安装在散热器上的风扇，导管和防尘罩。 面板上定义了进气口。 管道包括安装在风扇上的第一端部和连接到面板的进气口的第二端部，从而为从空气入口直接流向散热器的空气提供密封通路。 防尘罩可拆卸地安装在面板上并覆盖进​​气口，以阻止灰尘颗粒进入计算机机壳。

公开(公告)号：US07142430B2

公开(公告)日：2006-11-28

申请号：US10953654

申请日：2004-09-29

申请人： Hsieh-Kun Lee ,  Wan-Lin Xia ,  Bao-Chun Chen ,  Bo-Yong Yang ,  Jin-Song Feng ,  Tao Li

发明人： Hsieh-Kun Lee ,  Wan-Lin Xia ,  Bao-Chun Chen ,  Bo-Yong Yang ,  Jin-Song Feng ,  Tao Li

IPC分类号： H05K7/20

CPC分类号： H01L23/4093 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： A heat dissipating device assembly for an electronic components (70), includes a heat sink (10) for contacting the electronic component, and a locking device (20) and a back plate unit (40) for cooperatively mounting the heat sink to the electronic component. The locking device includes a retention module (28) located around the electronic component for supporting the heat sink thereon, and a clip (30) pivotably attached to the retention module. The clip includes a pressing portion and a pushing portion. The clip is pivotable between a first position in which the clip presses the heat sink toward the electronic component and a second position in which the clip pushes the heat sink in a direction away from the electronic component.

摘要翻译： 一种用于电子部件（70）的散热装置组件，包括用于接触电子部件的散热器（10）和用于将散热器协同地安装到电子部件的锁定装置（20）和后板单元（40） 零件。 锁定装置包括位于电子部件周围的用于在其上支撑散热器的保持模块（28），以及可枢转地连接到保持模块的夹子（30）。 夹子包括按压部分和推动部分。 夹子可在其中夹子将散热器朝向电子部件按压的第一位置和夹子沿远离电子部件的方向推动散热器的第二位置之间枢转。