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公开(公告)号:US20090290342A1
公开(公告)日:2009-11-26
申请号:US12340488
申请日:2008-12-19
申请人: YI ZHANG , CHENG-TIEN LAI , JIN-SONG FENG , WEI-LE WU
发明人: YI ZHANG , CHENG-TIEN LAI , JIN-SONG FENG , WEI-LE WU
IPC分类号: F21V8/00
CPC分类号: F21V17/12 , F21K9/00 , Y10S362/80
摘要: An LED light source includes an LED module and a light-guiding module fixed on the LED module. The LED module includes a printed circuit board and a plurality of LEDs. The light-guiding module includes a frame placed on the LED module and a plurality of light guiding units engaging with the frame. The frame defines an opening in a lower portion thereof to receive the LEDs of the LED module therein and a recess in an upper portion thereof and in communication with the opening. Each of the light guiding units has a base with two flanges respectively fittingly received in two cutouts of the recess of the frame so that the light guiding unit is movable along the recess until it faces a corresponding LED.
摘要翻译: LED光源包括LED模块和固定在LED模块上的导光模块。 LED模块包括印刷电路板和多个LED。 导光模块包括放置在LED模块上的框架和与框架接合的多个导光单元。 框架在其下部限定开口以将LED模块的LED接收到其中,并且其上部的凹部与开口连通。 每个导光单元具有一个具有两个凸缘的底座,两个凸缘分别适合地容纳在框架的凹部的两个切口中,使得导光单元可以沿着凹部移动,直到其面对相应的LED。
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公开(公告)号:US20100097766A1
公开(公告)日:2010-04-22
申请号:US12417605
申请日:2009-04-02
申请人: WEI-LE WU , JIN-SONG FENG , CHENG-TIEN LAI
发明人: WEI-LE WU , JIN-SONG FENG , CHENG-TIEN LAI
IPC分类号: H05K7/20
CPC分类号: H01L23/427 , H01L23/4006 , H01L23/467 , H01L2023/4056 , H01L2023/4062 , H01L2023/4087 , H01L2924/0002 , H01L2924/00
摘要: A fixing device fastens a heat sink having a base on one of motherboards with different specifications. Each motherboard with a corresponding specification defines a plurality of extending holes therethrough. The fixing device comprises a plurality of slats each having an end thereof pivotally connecting to the base of the heat sink and the other end thereof defining an elongated slot for corresponding to one of the extending holes of the one of the motherboards, a back plate defining a plurality of mounting holes corresponding to the extending holes of the motherboards, and a plurality of fixing units extending through the slots of the slats, the extending holes of the one of the motherboards and corresponding mounting holes of the back plate to mount the heat sink on the one of the motherboards.
摘要翻译: 定影装置将具有基座的散热器固定在具有不同规格的主板之一上。 具有相应规格的每个主板限定了穿过其中的多个延伸的孔。 定影装置包括多个板条,每个板条的端部枢转地连接到散热器的底部,并且其另一端限定用于对应于一个主板的一个延伸孔的细长槽,限定 与主板的延伸孔相对应的多个安装孔,以及延伸穿过板条槽的多个固定单元,一个主板的延伸孔和背板的相应安装孔,以安装散热片 在主板之一上。
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公开(公告)号:US20080169089A1
公开(公告)日:2008-07-17
申请号:US11623299
申请日:2007-01-15
申请人: WEI-LE WU , CHUN-CHI CHEN
发明人: WEI-LE WU , CHUN-CHI CHEN
IPC分类号: H05K7/20
CPC分类号: H01L23/467 , F28D15/0266 , F28D15/0275 , F28F1/14 , F28F2215/00 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要: A heat sink assembly for a heat-generating electronic component includes a base (12), a shell mounted on the base, and a plurality of heat exchangers (11, 13, 15) mounted on the base and surrounded by the shell. The heat exchangers comprise heat conducting plates (110,130, 150) extending from the base, cores (112, 132, 152) formed on tops of the heat conducting plates and a plurality of fins (114, 134, 154) arranged about the cores. A plurality of heat pipes (20) connects the base and the cores of the heat exchangers for transferring heat from the base to the fins for dissipation.
摘要翻译: 一种用于发热电子部件的散热器组件包括基座(12),安装在基座上的壳体和安装在基座上并被壳体包围的多个热交换器(11,13,15)。 热交换器包括从基座延伸的导热板(110,130,150),形成在导热板的顶部上的芯(112,132,152)和围绕芯布置的多个翅片(114,134,154)。 多个热管(20)连接热交换器的基部和芯部,用于将热量从基座传递到散热片以进行散热。
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公开(公告)号:US20080314555A1
公开(公告)日:2008-12-25
申请号:US11767014
申请日:2007-06-22
申请人: WEI-LE WU , CHUN-CHI CHEN
发明人: WEI-LE WU , CHUN-CHI CHEN
CPC分类号: F28F1/32 , F28D15/0266 , F28D15/0275 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要: A heat dissipation device includes a base, a first fin group located above the base, at least one heat pipe connecting the base and the first fin group and first and second fans located at two opposite sides of the first fin group. Each of the first and second fans is oriented with an acute angle to the base. Outlet and inlet of the first and second fans are oriented towards the base and the first fan produces cooling air to blow towards the first fin group and the base and the second fan draws heated air away from the first fin group and the base.
摘要翻译: 散热装置包括底座,位于基座上方的第一翅片组,连接底座和第一翅片组的至少一个热管以及位于第一翅片组两相对侧的第一和第二风扇。 第一和第二风扇中的每一个都与基座成锐角。 第一和第二风扇的出口和入口朝向底座并且第一风扇产生冷却空气以朝向第一翅片组吹动并且底座和第二风扇将加热的空气从第一翅片组和底座拉出。
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