公开(公告)号：US20200095133A1

公开(公告)日：2020-03-26

申请号：US16695979

申请日：2019-11-26

申请人： Youngmoon Bae ,  Yudon Moon ,  In-Kyu Hwang ,  Hyundong Shin ,  Seungchul Yang ,  Dongyong Kwak ,  Byungkook Lee ,  Hyunkwang Cho ,  Junho Lee

发明人： Youngmoon Bae ,  Yudon Moon ,  In-Kyu Hwang ,  Hyundong Shin ,  Seungchul Yang ,  Dongyong Kwak ,  Byungkook Lee ,  Hyunkwang Cho ,  Junho Lee

IPC分类号： C01G43/025 ,  C01G43/06 ,  G21C3/62

摘要： Embodiments of the disclosure relate to a treatment method and a treatment apparatus for a UF6 heel, using a gas phase reaction. A specific treatment method includes (1) vaporizing the UF6 heel, (2) manufacturing solid phase UO2F2 by using UF6 gas vaporized at step (1), (3) separating the solid phase UO2F2 and by-product gas from each other, and (4) separating hydrogen fluoride from the by-product gas. According to the disclosure, stabilization of a reconversion process and the quality of UO2 powder may be improved by manufacturing the solid phase UO2F2, which is an intermediate of the UO2 powder, through the UF6 heel treatment, and the high cost of radioactive waste disposal is reduced by minimizing the UF6 heel to be less than 0.5 kg.

公开(公告)号：US09985008B2

公开(公告)日：2018-05-29

申请号：US15423611

申请日：2017-02-03

申请人： Hongbin Shi ,  Junho Lee

发明人： Hongbin Shi ,  Junho Lee

IPC分类号： H01L21/00 ,  H01L25/10 ,  H01L23/00 ,  H01L25/00

CPC分类号： H01L25/105 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/81143 ,  H01L2224/81815 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1082

摘要： A method of fabricating a semiconductor package includes providing a lower semiconductor package including a lower package substrate, and a lower dummy ball and a lower solder ball on a top surface of the lower package substrate, providing an upper semiconductor package including an upper package substrate, and an upper dummy ball and an upper solder ball on a bottom surface of the upper package substrate, joining the upper dummy ball to the lower dummy ball at a first temperature to form a solder joint, and joining the upper solder ball to the lower solder ball at a second temperature to form a connection terminal.

公开(公告)号：US08391800B2

公开(公告)日：2013-03-05

申请号：US13250082

申请日：2011-09-30

申请人： Heung-No Lee ,  Junho Lee ,  Sangjun Park

发明人： Heung-No Lee ,  Junho Lee ,  Sangjun Park

IPC分类号： H04B17/00 ,  H04W24/00

CPC分类号： H04L25/03891 ,  H04J11/0046 ,  H04L1/06 ,  H04L2025/03426 ,  H04W52/0251 ,  H04W72/00 ,  H04W84/18 ,  Y02D70/00

摘要： Disclosed is a multiple sensor system including a plurality of different sensor devices to acquire respective signals sensed from a single signal source, and a signal acquisition apparatus to recover an original signal generated from the signal source. The signal acquisition apparatus recovers the original signal by applying joint recovery, based on characteristics and correlations between the respective sensor devices, to compressive sensing signals independently compressively sensed and transmitted from the respective sensor devices. At this time, a sensing matrix F prearranged with the respective sensor devices and channel information C between the original signal and each sensor device are used for joint recovery.

摘要翻译： 公开了一种多传感器系统，包括多个不同的传感器装置，以获取从单个信号源感测的各个信号，以及信号采集装置，用于恢复从信号源产生的原始信号。 信号采集装置通过基于相应传感器装置之间的特性和相关性，将压缩感测信号独立地压缩感测并从相应的传感器装置发送来应用联合恢复来恢复原始信号。 此时，使用预先布置有各个传感器装置的感测矩阵F和原始信号与每个传感器装置之间的通道信息C用于联合恢复。

公开(公告)号：US20070200881A1

公开(公告)日：2007-08-30

申请号：US11362298

申请日：2006-02-24

申请人： NamJeon Park ,  YunJoo Moon ,  DongMin Kim ,  JungMi Oh ,  ByungChul Kyun ,  SoonJae Moon ,  JunHo Lee

发明人： NamJeon Park ,  YunJoo Moon ,  DongMin Kim ,  JungMi Oh ,  ByungChul Kyun ,  SoonJae Moon ,  JunHo Lee

IPC分类号： B41J25/308

CPC分类号： B41J29/02 ,  B41J3/4078 ,  B41J11/001 ,  B41J11/20 ,  B41J15/04

摘要： There is provided a feeding system for an image forming machine using a first feeder roll and a press roll that form a nip between them though which a substrate is passed, and a second feeder roll located after a printing zone, where the first and second feeder rolls move at the same speed.

摘要翻译： 提供了一种用于图像形成机的进给系统，所述进给系统使用第一进料辊和压辊，所述第一进料辊和压辊在它们之间形成通过基底的辊隙，以及位于印刷区之后的第二进料辊，其中第一和第二进料器 卷移动速度相同。