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    METHOD AND SYSTEM OF INSPECTING PRE-MOLDED SEALANT PARTS
    12.
    发明申请
    METHOD AND SYSTEM OF INSPECTING PRE-MOLDED SEALANT PARTS 有权

    公开(公告)号：US20220260505A1

    公开(公告)日：2022-08-18

    申请号：US17618159

    申请日：2020-06-10

    Applicant: PRC-DESOTO Intemational, Inc. ,  KA Imaging Inc.

    Inventor： Soccorso Rizzello ,  Karim Sallaudin Karim ,  Christopher Charles Scott

    IPC: G01N23/041 ,  G01N33/44

    Abstract: A method and system of inspecting pre-molded parts comprising sealant material are disclosed. The method includes directing a micro-focused X-ray beam through a pre-molded sealant part comprising a sealant material to produce a phase-shifted refracted X-ray beam, and detecting the refracted X-ray beam with at least one phase contrast imaging X-ray detector to produce an image of the sealant material. The system includes at least one X-ray source structured and arranged to direct a micro-focused X-ray beam through a pre-molded sealant part comprising a sealant material to produce a phase-shifted refracted X-ray beam, and at least one phase contrast imaging X-ray detector structured and arranged to detect the refracted X-ray beam to produce an image of the sealant material.

    Method and apparatus for spectral adjustment in digital X-ray imaging
    14.
    发明授权
    Method and apparatus for spectral adjustment in digital X-ray imaging 有权

    公开(公告)号：US11147529B2

    公开(公告)日：2021-10-19

    申请号：US17105579

    申请日：2020-11-26

    Applicant: KA IMAGING INC.

    Inventor： Karim S. Karim ,  Sebastian Lopez Maurino

    IPC: A61B6/00

    Abstract: A method and system for spectral adjustment for a digital X-ray imaging system. The method includes obtaining a set of initial digital X-ray images and then weight factoring the images to generate a set of weight factored digital X-ray images. The weight-factored digital X-ray images are then combined to generate a composite image that is spectrally distinct from the set of initial digital X-ray images.

    SENSOR, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE
    15.
    发明申请
    SENSOR, MANUFACTURING METHOD THEREOF AND ELECTRONIC DEVICE 审中-公开

    公开(公告)号：US20180122841A1

    公开(公告)日：2018-05-03

    申请号：US15540411

    申请日：2016-09-21

    Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  KA IMAGING INC.

    Inventor： Chia Chiang LIN

    IPC: H01L27/144 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/0376 ,  H01L31/20

    CPC classification number: H01L27/1446 ,  H01L29/786 ,  H01L31/02005 ,  H01L31/02164 ,  H01L31/03762 ,  H01L31/202

    Abstract: A sensor, a manufacturing method thereof and an electronic device. The sensor includes: a base substrate; a thin-film transistor (TFT) disposed on the base substrate and including a source electrode; a first insulation layer disposed on the TFT and provided with a first through hole running through the first insulation layer; a conductive layer disposed in the first through hole and on part of the first insulation layer and electrically connected with the source electrode via the first through hole; a bias electrode disposed on the first insulation layer and separate from the conductive layer; a sensing active layer respectively connected with the conductive layer and the bias electrode; and an auxiliary conductive layer disposed on the conductive layer. The sensor and the manufacturing method thereof improve the conductivity and ensure normal transmission of signals by arranging the auxiliary conductive layer on the conductive layer without addition of processes.

    DETECTION PANEL AND MANUFACTURING METHOD THEREOF
    20.
    发明申请
    DETECTION PANEL AND MANUFACTURING METHOD THEREOF 有权

    公开(公告)号：US20210233954A1

    公开(公告)日：2021-07-29

    申请号：US16965941

    申请日：2020-01-16

    Applicant: BOE TECHNOLOGY GROUP CO., LTD. ,  KA IMAGING INC.

    Inventor： Gang HUA ,  Chuncheng CHE ,  Cheng LI ,  Jian WANG ,  Yanna XUE ,  Yong ZHANG ,  Chia Chiang LIN

    IPC: H01L27/146 ,  G01T1/20

    Abstract: A detection panel and a manufacturing method thereof are disclosed. The detection panel (200) includes a first substrate (21) and a second substrate (22), and the first substrate (21) includes a light detection layer (213); the second substrate (22) includes a drive circuit (205); the first substrate (21) and the second substrate (22) are opposite to each other for cell assembly, and the drive circuit (205) is coupled to the light detection layer (213) to read a photosensitive signal generated by the light detection layer (213). By forming the light detection layer (213) and the drive circuit (205) on different substrates, the detection panel (200) contributes to increase the flatness of the light detection layer (213) and reduce the defects of the light detection layer (213), thereby reducing the leakage current in a dark state and improving the performance of the detection panel (200).

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