Abstract:
A method for forming an electrode of semiconductor device capacitor is disclosed. The method comprises forming a dielectric layer on a semiconductor substrate and then using photolithographic method to etch a trench through the dielectric layer to expose specific part of the semiconductor substrate. A polysilicon layer is then formed over the dielectric layer and filled the trench. The polysilicon layer is patterned by a photoresist layer and etched back to the dielectric layer, then a polysilicon rod is formed. A spacer method is used to form an amorphized silicon spacer is sidewall of the polysilicon rod. The polysilicon rod is then implanted to form an amorphized polysilicon layer on top surface of the polysilicon rod. Final hemispherical grain silicon is formed on the spacer and the amorphized polysilicon layer to increase the surface area of the polysilicon rod. Thereby, an electrode of a semiconductor device capacitor is formed, and the capacitance of capacitor is enhanced.
Abstract:
A multifunction clothes hanger includes a main body, a hook, an annular member and two clothes hangers. A protrusion of a cylindrical body of each clothes hanger enters a T-shaped through-groove at the bottom of the main body and moves into a transverse portion of the T-shaped through-groove to enter left and right through-holes of the main body. The protrusion is engaged with grooves disposed on the inner sides of the left and right through-holes, respectively. Furthermore, the hook is inserted into a straight through-hole at the upper portion of the main body until the threaded bottom with a thread thereon reaches the bottom of the main body to engage with a screw nut of the annular member. Another space-saving multifunction clothes hanger further includes a fixing base, upper and lower arms, two grooves, left and right baffles and two screw holes.
Abstract:
A cutting tool includes a blade, a seat, a shank and a damper. The blade is connected to the seat. The seat is connected to the shank. The shank includes a pocket defined therein and a thread formed on the wall of the pocket. A damper is inserted in the pocket. The damper includes a thread formed on the periphery for engagement with the thread of the shank, with a small gap defined between the threads.
Abstract:
A method for forming different area vias of dynamic random access memory is disclosed. Essential points of the invention comprise spacer is only formed on gate of periphery circuit, and depth of passivation layer of periphery circuit gates is larger than depth of layer that capped over gates of cell. The provided method comprises following steps: First, capping a layer over gate of cell and gate of periphery circuit and then forming spacer on gate of periphery circuit, where depth of capping layer is smaller than depth of passivation layer of periphery circuit gate. Second, both gate of cell and gate of periphery circuit are cover by a dielectric layer. Third, vias in both cell and periphery circuit are formed simultaneously by photolithography and etching, where etching comprises etching of dielectric layer and etching of passivation layer. Advantageous of the invention is only a photolithography process is necessary and then throughput is enhanced.
Abstract:
A method of fabricating a node contact opening includes formation of a dielectric layer on a substrate. An opening is formed with C4F8/Ar/CH2F2 as an etchant. A portion of the dielectric layer under the opening is etched with CHF3/CO as an etchant until the substrate is exposed. A node contact opening is formed.