Abstract:
A method of manufacturing a bottom electrode of a capacitor. A first dielectric layer is formed on a substrate. A cap layer is formed on the first dielectric layer. A second dielectric layer is formed on the cap layer. A node contact hole is formed to penetrate through the second dielectric layer, the cap layer and the first dielectric layer. A liner layer is formed on a sidewall of the node contact hole. A restraining layer is formed on the second dielectric layer. A patterned conductive layer is formed on a portion of the restraining layer and fills the node contact hole. A selective hemispherical grained layer is formed on the patterned conductive layer.
Abstract:
A method for forming a multi-layered liner on the sidewalls of a node contact opening includes the steps of providing a substrate having a dielectric layer thereon. The dielectric layer further includes a node contact opening that exposes a portion of the substrate. A first liner layer is then formed on the sidewalls of the node contact opening. Next, a second liner layer is formed over the first liner layer such that the first liner layer and the second liner layer together form a dual-layered liner. The first liner layer in contact with the dielectric layer has good insulation capacity while the second liner layer has good etch-resisting property.
Abstract:
A method for forming an electrode of semiconductor device capacitor is disclosed. The method comprises forming a dielectric layer on a semiconductor substrate and then using photolithographic method to etch a trench through the dielectric layer to expose specific part of the semiconductor substrate. A polysilicon layer is then formed over the dielectric layer and filled the trench. The polysilicon layer is patterned by a photoresist layer and etched back to the dielectric layer, then a polysilicon rod is formed. A spacer method is used to form an amorphized silicon spacer is sidewall of the polysilicon rod. The polysilicon rod is then implanted to form an amorphized polysilicon layer on top surface of the polysilicon rod. Final hemispherical grain silicon is formed on the spacer and the amorphized polysilicon layer to increase the surface area of the polysilicon rod. Thereby, an electrode of a semiconductor device capacitor is formed, and the capacitance of capacitor is enhanced.
Abstract:
A method of fabricating a node contact opening includes formation of a dielectric layer on a substrate. An opening is formed with C4F8/Ar/CH2F2 as an etchant. A portion of the dielectric layer under the opening is etched with CHF3/CO as an etchant until the substrate is exposed. A node contact opening is formed.
Abstract:
A method for ensuring no capacitor peeling at the edge of a wafer in the fabrication of dynamic random access memory (DRAM) is disclosed. The method includes first providing a semiconductor substrate having a semiconductor structure formed thereon. A dielectric layer is then formed overlying the semiconductor structure, and patterned for defining a contact window. Followed by, the deposition of a silicon layer over the dielectric layer that fills up the contact window. Consequentially, a photoresist layer is coated overlying the silicon layer, where it will be rinsed twice by a combination of an online EBR (and/or a WEE) and an offline EBR at a distance inwardly away from the edge of the wafer in process for removing a portion of the photoresist to avoid abnormal capacitor formation in later stages. Then, a photolithography process is carried out against the photoresist layer to form a photoresist mask. Finally, the silicon layer is etched where it is not covered by the photoresist mask to form a lower capacitor electrode. The photoresist mask is stripped as to conclude the present invention.
Abstract:
A method for forming different area vias of dynamic random access memory is disclosed. Essential points of the invention comprise spacer is only formed on gate of periphery circuit, and depth of passivation layer of periphery circuit gates is larger than depth of layer that capped over gates of cell. The provided method comprises following steps: First, capping a layer over gate of cell and gate of periphery circuit and then forming spacer on gate of periphery circuit, where depth of capping layer is smaller than depth of passivation layer of periphery circuit gate. Second, both gate of cell and gate of periphery circuit are cover by a dielectric layer. Third, vias in both cell and periphery circuit are formed simultaneously by photolithography and etching, where etching comprises etching of dielectric layer and etching of passivation layer. Advantageous of the invention is only a photolithography process is necessary and then throughput is enhanced.
Abstract:
A single stage low boost/buck ratio stand-alone solar energy power generating circuit with a system thereof is a simplification of a two-stage type circuit. The two-stage circuit, which has a storage unit, a charging converter circuit for charging the storage unit, and a discharging converter circuit for discharging the stored power to a load, is analyzed and categorized such that a circuit structure is selected via a suitable simplified combination to commonly use the elements constituting the charging and the discharging converter circuits so as to form the single stage circuit with less elements, volume and weight for reducing the production cost of the circuit.
Abstract:
A cutting tool includes a blade, a seat, a shank and a damper. The blade is connected to the seat. The seat is connected to the shank. The shank includes a pocket defined therein and a thread formed on the wall of the pocket. A damper is inserted in the pocket. The damper includes a thread formed on the periphery for engagement with the thread of the shank, with a small gap defined between the threads.
Abstract:
A multifunction clothes hanger includes a main body, a hook, an annular member and two clothes hangers. A protrusion of a cylindrical body of each clothes hanger enters a T-shaped through-groove at the bottom of the main body and moves into a transverse portion of the T-shaped through-groove to enter left and right through-holes of the main body. The protrusion is engaged with grooves disposed on the inner sides of the left and right through-holes, respectively. Furthermore, the hook is inserted into a straight through-hole at the upper portion of the main body until the threaded bottom with a thread thereon reaches the bottom of the main body to engage with a screw nut of the annular member. Another space-saving multifunction clothes hanger further includes a fixing base, upper and lower arms, two grooves, left and right baffles and two screw holes.
Abstract:
A combinative cutter includes a holder, a shank, a blade and at least two screws. The holder includes an eccentric bore defined at an end and at least two screw holes in communication with the eccentric bore. The shank is inserted in the eccentric bore and formed with a planar face. The blade is attached to an end of the shank extending beyond the holder. The screws are driven through the screw holes and abutted against the planar face to keep the shank in the eccentric bore.