公开(公告)号：US20100213563A1

公开(公告)日：2010-08-26

申请号：US12712201

申请日：2010-02-25

申请人： Lu-Ming Lai

发明人： Lu-Ming Lai

IPC分类号： H01L31/02

CPC分类号： H01L27/14618 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/552 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor optoelectronic device including a substrate, a control chip, a light-sensing chip and a molding compound is provided. The control chip is disposed on the substrate and electrically connected to the substrate. The light-sensing chip is disposed on the substrate and electrically connected to the substrate and the control chip. The molding compound encapsulates the control chip and a material of the molding compound is an insulating material doped with a non-electro-conductive magnetic conductive material.

摘要翻译： 提供了包括基板，控制芯片，感光芯片和模塑料的半导体光电子器件。 控制芯片设置在基板上并电连接到基板。 感光芯片设置在基板上并电连接到基板和控制芯片。 模塑料包封控制芯片，模塑料的材料是掺有非导电导电材料的绝缘材料。

公开(公告)号：US20100213562A1

公开(公告)日：2010-08-26

申请号：US12711214

申请日：2010-02-23

申请人： Lu-Ming Lai

发明人： Lu-Ming Lai

IPC分类号： H01L31/02

CPC分类号： H01L27/14683 ,  H01L23/49541 ,  H01L23/49568 ,  H01L23/49575 ,  H01L25/167 ,  H01L27/14618 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/00014 ,  H01L2924/00

摘要： A quad flat non-leaded chip package structure includes a leadframe, a control chip, a light-sensing chip, a first bonding wire, a plurality of second bonding wires, and a molding compound. The leadframe includes a plurality of leads. Besides, the leadframe has an upper surface and a lower surface opposite to the upper surface. The control chip and the light-sensing chip are disposed on the upper surface of the leadframe. The light-sensing chip is electrically connected to the control chip through the first bonding wire. The control chip is electrically connected to the leads through the second bonding wires. The molding compound encapsulates a portion of the leadframe, the control chip, the light-sensing chip, the first bonding wire, and the second bonding wires. In addition, the molding compound fills among the leads.

摘要翻译： 四面扁平非引线芯片封装结构包括引线框架，控制芯片，光感测芯片，第一接合线，多个第二接合线以及模塑料。 引线框架包括多个引线。 此外，引线框具有与上表面相对的上表面和下表面。 控制芯片和感光芯片设置在引线框架的上表面上。 光感测芯片通过第一接合线电连接到控制芯片。 控制芯片通过第二接合线电连接到引线。 成型化合物封装引线框架，控制芯片，感光芯片，第一接合线和第二接合线的一部分。 此外，模塑料填充在引线之间。