Novel Method to Increase Breakdown Voltage of Semiconductor Devices
    11.
    发明申请
    Novel Method to Increase Breakdown Voltage of Semiconductor Devices 有权
    提高半导体器件击穿电压的新方法

    公开(公告)号:US20090090984A1

    公开(公告)日:2009-04-09

    申请号:US12061358

    申请日:2008-04-02

    CPC classification number: H01L29/7787 H01L29/2003 H01L29/66462

    Abstract: Methods of achieving high breakdown voltages in semiconductor devices by suppressing the surface flashover using high dielectric strength insulating encapsulation material are generally described. In one embodiment of the present invention, surface flashover in AlGaN/GaN heterostructure field-effect transistors (HFETs) is suppressed by using high dielectric strength insulating encapsulation material. Surface flashover in as-fabricated III-Nitride based HFETs limits the operating voltages at levels well below the breakdown voltages of GaN.

    Abstract translation: 一般来说,通过使用高介电强度绝缘包封材料抑制表面闪络来实现半导体器件中的高击穿电压的方法。 在本发明的一个实施例中,通过使用高介电强度绝缘封装材料来抑制AlGaN / GaN异质结构场效应晶体管(HFET)中的表面闪络。 基于III-Nitride的HFET的表面闪络将工作电压限制在远低于GaN击穿电压的水平。

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