公开(公告)号：US08026903B2

公开(公告)日：2011-09-27

申请号：US11650049

申请日：2007-01-03

Applicant: Mark Arthur Hamblin ,  Steve Porter Hotelling

Inventor： Mark Arthur Hamblin ,  Steve Porter Hotelling

IPC: G09G5/00

CPC classification number: H01R12/62 ,  G06F3/0416 ,  G06F2203/04103 ,  H01H2001/5816 ,  H01R4/04 ,  H01R43/205 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/0278 ,  H05K2203/1121 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.

Abstract translation: 可以使用在两侧形成的柱和行迹线的基板来创建多点触摸传感器面板。 可以使用沿基板边界延伸的金属轨迹将行迹线与列轨迹相同。 可以制造单个柔性电路以连接到直接相对侧上的行和列。 柔性印刷电路可以通过在粘合另一个基板的同时冷却基板的一侧而与基板的直接相对的附接区域接合。 此外，在柔性电路上的直角迹线上延伸的“覆盖层”材料可确保在接合期间导电接合材料被挤出时，这些迹线不会短路。 此外，间隔件放置在柔性电路的远端处，以在接合期间在整个柔性电路连接区域上施加均匀的粘结压力。

公开(公告)号：US07999795B2

公开(公告)日：2011-08-16

申请号：US12985239

申请日：2011-01-05

Applicant: Mark Arthur Hamblin ,  Steve Porter Hotelling

Inventor： Mark Arthur Hamblin ,  Steve Porter Hotelling

IPC: G09G5/00

CPC classification number: H01R12/62 ,  G06F3/0416 ,  G06F2203/04103 ,  H01H2001/5816 ,  H01R4/04 ,  H01R43/205 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/0278 ,  H05K2203/1121 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.

公开(公告)号：US20080158181A1

公开(公告)日：2008-07-03

申请号：US11650049

申请日：2007-01-03

Applicant: Mark Arthur Hamblin ,  Steve Porter Hotelling

Inventor： Mark Arthur Hamblin ,  Steve Porter Hotelling

IPC: G06F3/041 ,  H01R12/24

CPC classification number: H01R12/62 ,  G06F3/0416 ,  G06F2203/04103 ,  H01H2001/5816 ,  H01R4/04 ,  H01R43/205 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/0278 ,  H05K2203/1121 ,  H05K2203/1572 ,  Y10T29/49124 ,  Y10T29/49155

Abstract: A multi-touch sensor panel can be created using a substrate with column and row traces formed on either side. Metal traces running along the border of the substrate can be used to bring the row traces to the same edge as the column traces. A single flex circuit can be fabricated to connect to the rows and columns on directly opposing sides. Flex printed circuits can be bonded to directly opposing attachment areas of a substrate by cooling one side of the substrate while bonding the other. In addition, “coverlay” material extending over right-angled traces on the flex circuit ensure that those traces do not get shorted should conductive bonding material get squeezed out during bonding. Furthermore, a spacer is placed at the distal end of the flex circuit to apply even bonding pressure over the entire flex circuit attachment area during bonding.

Abstract translation: 可以使用在两侧形成的柱和行迹线的基板来创建多点触摸传感器面板。 可以使用沿基板边界延伸的金属轨迹将行迹线与列轨迹相同。 可以制造单个柔性电路以连接到直接相对侧上的行和列。 柔性印刷电路可以通过在粘合另一个基板的同时冷却基板的一侧而与基板的直接相对的附接区域接合。 此外，在柔性电路上的直角迹线上延伸的“覆盖层”材料可确保在接合期间导电接合材料被挤出时，这些迹线不会短路。 此外，间隔件放置在柔性电路的远端处，以在接合期间在整个柔性电路连接区域上施加均匀的粘结压力。