Wafer placement table
    11.
    发明授权

    公开(公告)号:US12266557B2

    公开(公告)日:2025-04-01

    申请号:US17816006

    申请日:2022-07-29

    Abstract: A wafer placement table includes an alumina base that has a wafer placement surface on its upper surface, and incorporates an electrode; a brittle cooling base bonded to a lower surface of the alumina base; and a ductile connection member stored in a storage hole, opened in a lower surface of the cooling base, in a state of restricted axial rotation and in a state of engaging with an engagement section of the storage hole, the ductile connection member having a male thread section or a female thread section.

    METHOD OF OPERATING SEPARATION APPARATUS AND SEPARATION APPARATUS

    公开(公告)号:US20250083098A1

    公开(公告)日:2025-03-13

    申请号:US18960001

    申请日:2024-11-26

    Abstract: A method of operating a separation apparatus using a separation membrane includes a step of performing a normal operation for supplying a mixed gas containing a plurality of types of gases to a separation membrane at a constant set pressure, to thereby separate a substance in the mixed gas, which has high permeability through the separation membrane, from any other substance and a step of performing a high pressure treatment for supplying the mixed gas to the separation membrane at a pressure higher than the set pressure at the time of starting supply of the mixed gas to the separation membrane before the normal operation or in the middle of the normal operation.

    WAFER PLACEMENT TABLE AND METHOD OF USING THE SAME

    公开(公告)号:US20250079230A1

    公开(公告)日:2025-03-06

    申请号:US18667048

    申请日:2024-05-17

    Inventor: Ikuhisa MORIOKA

    Abstract: The wafer placement table includes a ceramic plate, a thermal diffusion plate, a first adhesive layer, a cooling plate, and a second adhesive layer. The ceramic plate has a wafer placement surface on its upper surface, and includes built-in electrodes. The thermal diffusion plate is provided on the lower surface of the ceramic plate. The first adhesive layer bonds the ceramic plate and the thermal diffusion plate together. The cooling plate is provided on the lower surface of the thermal diffusion plate, and internally includes a refrigerant flow path. The second adhesive layer is provided between the thermal diffusion plate and the cooling plate. The second adhesive layer is provided with an adhesive part and a hollow part, the adhesive part bonding the thermal diffusion plate and the cooling plate together, the hollow part being a gap provided between the thermal diffusion plate and the cooling plate.

    Electrostatic chuck
    16.
    发明授权

    公开(公告)号:US12243764B2

    公开(公告)日:2025-03-04

    申请号:US17304749

    申请日:2021-06-25

    Abstract: An electrostatic chuck includes a ceramic plate through holes which penetrate the plate, and a pair of positive and negative electrodes. The plate has division areas virtually divided, which are equal in number to the number of the through holes. The positive electrode and the negative electrode have pairs of positive and negative helical electrode portions, and for each of the division areas, one of the pairs is provided in parallel so as to cover the entirety of the division area from each of a positive electrode start point and a negative electrode start point which are close to one of the through holes. The positive electrode is such that the positive helical electrode portions are connected via outer circumferential portions of the plate, and the negative electrode is such that the negative helical electrode portions are connected via a central portion of the plate.

    GAS SENSOR
    17.
    发明申请

    公开(公告)号:US20250067624A1

    公开(公告)日:2025-02-27

    申请号:US18798905

    申请日:2024-08-09

    Abstract: Provided is a gas sensor that prevents a ceramic housing from biting into a member arranged on a rear end side of the ceramic housing in a state of being inclined from an axial direction. In the gas sensor according to one aspect of the present invention, a spacer having Young's modulus of 80 GPa or more is arranged at least in a front end portion on a rear end side of the ceramic housing to which a terminal fitting is attached.

    MULTIZONE CERAMIC HEATER
    18.
    发明申请

    公开(公告)号:US20250063636A1

    公开(公告)日:2025-02-20

    申请号:US18675244

    申请日:2024-05-28

    Inventor: Yutaka UNNO

    Abstract: There is provided a multizone ceramic heater including a ceramic plate including an inner zone and an outer zone, an inner zone heater circuit embedded in the inner zone, an outer zone heater circuit embedded in the outer zone, one pair of first feeding terminals for feeding power to the inner zone heater circuit, one pair of second feeding terminals for feeding power to the outer zone heater circuit, and one pair of jumpers embedded in the inner zone of the ceramic plate, one of which connects one of the second feeding terminals and the outer zone heater circuit by a first junction and the other of which connects the other of the second feeding terminals and the outer zone heater circuit by a second junction. Thicknesses of the jumpers are from 1.2 to 3.0 times a thickness of the outer zone heater circuit.

    Electrostatic chuck heater
    20.
    发明授权

    公开(公告)号:US12230526B2

    公开(公告)日:2025-02-18

    申请号:US17451504

    申请日:2021-10-20

    Abstract: An electrostatic chuck heater includes an electrostatic chuck including an electrostatic electrode embedded in a ceramic sintered body, a cooling member cooling the electrostatic chuck, and a heater layer disposed between the electrostatic chuck and the cooling member and including a plurality of metal layers embedded therein in multiple stages, the metal layers including resistance heating element layers. The heater layer includes a ceramic insulating layer with a thickness of 2 μm or more and 50 μm or less between the metal layers.

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