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    Electrostatic chuck assembly, electrostatic chuck, and focus ring
    2.
    发明授权
    Electrostatic chuck assembly, electrostatic chuck, and focus ring 有权

    公开(公告)号：US11610798B2

    公开(公告)日：2023-03-21

    申请号：US16856224

    申请日：2020-04-23

    申请人： NGK INSULATORS, LTD.

    发明人： Tatsuya Kuno ,  Ikuhisa Morioka ,  Kenichiro Aikawa

    IPC分类号： H01L21/683 ,  H01J37/32 ,  H01L21/67

    摘要： An electrostatic chuck assembly includes a ceramic body having a wafer placement surface that is a circular surface, and an F/R placement surface that is formed around the wafer placement surface and is positioned at a lower level than the wafer placement surface, a wafer attraction electrode embedded inside the ceramic body and positioned in a facing relation to the wafer placement surface, an F/R attraction electrode embedded inside the ceramic body and positioned in a facing relation to the F/R placement surface, a concave-convex region formed in the F/R placement surface to hold gas, a focus ring placed on the F/R placement surface, and a pair of elastic annular sealing members arranged between the F/R placement surface and the focus ring on the inner peripheral side and the outer peripheral side of the F/R placement surface, and surrounding the concave-convex region in a sandwiching relation.

    Wafer placement table
    4.
    发明授权
    Wafer placement table 有权

    公开(公告)号：US11948825B2

    公开(公告)日：2024-04-02

    申请号：US17465943

    申请日：2021-09-03

    申请人： NGK INSULATORS, LTD.

    发明人： Kenichiro Aikawa ,  Hiroshi Takebayashi ,  Tatsuya Kuno

    IPC分类号： H01L21/683

    CPC分类号： H01L21/6833

    摘要： A wafer placement table includes: an electrostatic chuck that is a ceramic sintered body in which an electrode for electrostatic adsorption is embedded; a cooling member which is bonded to a surface on an opposite side of a wafer placement surface of the electrostatic chuck, and cools the electrostatic chuck; a hole for power supply terminal, the hole penetrating the cooling member in a thickness direction; and a power supply terminal which is bonded to the electrode for electrostatic adsorption from the surface on the opposite side of the wafer placement surface of the electrostatic chuck, and is inserted in the hole for power supply terminal. The outer peripheral surface of a portion of the power supply terminal is covered with an insulating thin film that is formed by coating of an insulating material, the portion being inserted in the hole for power supply terminal.

    Electrostatic chuck heater
    5.
    发明授权
    Electrostatic chuck heater 有权

    公开(公告)号：US11837490B2

    公开(公告)日：2023-12-05

    申请号：US17224183

    申请日：2021-04-07

    申请人： NGK INSULATORS, LTD.

    发明人： Kenichiro Aikawa ,  Yuji Akatsuka ,  Hiroshi Takebayashi ,  Takahiro Ando

    IPC分类号： H01L21/683 ,  H01L21/67 ,  H05B3/03 ,  H05B3/18

    CPC分类号： H01L21/6833 ,  H01L21/67103 ,  H05B3/03 ,  H05B3/18

    摘要： An electrostatic chuck heater according to the present invention includes an alumina substrate having a wafer placement surface on its upper surface; an electrostatic electrode, a resistance heating element provided for each zone, and a multilayer jumper wire for supplying power to the resistance heating element, which are buried in the alumina substrate in this order from the wafer placement surface side; a heating element coupling via for vertically coupling the resistance heating element to the jumper wire; and a power supply via extending outward for supplying power to the jumper wire. At least the heating element coupling via and the power supply via contain ruthenium metal.

    Ceramic heater
    7.
    发明授权
    Ceramic heater 有权

    公开(公告)号：US12027385B2

    公开(公告)日：2024-07-02

    申请号：US17222164

    申请日：2021-04-05

    申请人： NGK INSULATORS, LTD.

    发明人： Kenichiro Aikawa ,  Yuji Akatsuka ,  Hiroshi Takebayashi ,  Takahiro Ando

    IPC分类号： H01L21/67 ,  H01L21/683 ,  H05B3/12 ,  H05B3/26

    CPC分类号： H01L21/67103 ,  H01L21/6833 ,  H05B3/12 ,  H05B3/265 ,  H05B2203/016

    摘要： The ceramic heater of the present invention includes: an alumina substrate having a wafer placement surface; resistance heating elements disposed in respective zones; multistage jumpers that supply electric power to the resistance heating elements, the resistance heating elements and the jumpers being embedded in the alumina substrate in this order from a wafer placement surface side; heating element connecting vias that vertically connect the resistance heating elements to the jumpers; and power supply vias exposed to the outside in order to supply electric power to the jumpers. The specific resistance of the heating element connecting vias is smaller than that of the resistance heating elements, and the absolute value of the difference between CTE of the heating element connecting vias and CTE of the alumina substrate is smaller than the absolute value of the difference between CTE of the resistance heating elements and CTE of the alumina substrate.

    Electrostatic chuck and method for manufacturing the same
    9.
    发明授权
    Electrostatic chuck and method for manufacturing the same 有权

    公开(公告)号：US11282734B2

    公开(公告)日：2022-03-22

    申请号：US16717106

    申请日：2019-12-17

    申请人： NGK INSULATORS, LTD.

    发明人： Tatsuya Kuno ,  Ikuhisa Morioka ,  Takashi Kataigi ,  Kenichiro Aikawa

    IPC分类号： H01L21/683 ,  B23Q3/15 ,  H01L21/67 ,  H02N13/00

    摘要： An electrostatic chuck includes a first ceramic member disk-shaped and having an annular step surface outside a circular wafer holding surface thereof, the annular step surface being at a lower level than the wafer holding surface, the first ceramic member having a volume resistivity that allows Coulomb force to be exerted; a first electrode embedded in the first ceramic member at a position facing the wafer holding surface; a second electrode disposed on the annular step surface of the first ceramic member, the second electrode being independent of the first electrode; and a second ceramic member having an annular shape and configured to cover the annular step surface having the second electrode thereon, the second ceramic member having a volume resistivity that allows Johnsen-Rahbek force to be exerted, wherein an upper surface of the second ceramic member is a focus ring holding surface on which a focus ring is placed.