公开(公告)号：US5320705A

公开(公告)日：1994-06-14

申请号：US108498

申请日：1993-08-18

Applicant: Tetsuo Fujii ,  Yoshitaka Gotoh ,  Susumu Kuroyanagi ,  Osamu Ina

Inventor： Tetsuo Fujii ,  Yoshitaka Gotoh ,  Susumu Kuroyanagi ,  Osamu Ina

IPC: G01L9/00 ,  H01L27/20 ,  H01L21/306 ,  B44C1/22 ,  C03C15/00 ,  C03C25/06

CPC classification number: G01L9/0042 ,  G01L19/147 ,  G01L9/0054 ,  H01L27/20 ,  Y10T29/42 ,  Y10T29/49103

Abstract: A semiconductor pressure sensor of this invention is intended to provide a semiconductor pressure sensor having an excellent electrical isolation between the supporting means of the semiconductor pressure sensor and the semiconductor substrate, the semiconductor pressure sensor basically comprising a semiconductor substrate having a first semiconductor region in which; at least a semiconductor device is formed, a second semiconductor region and an isolated layer buried between the first and second semiconductor regions, a cavity provided in the second semiconductor region, the opening thereof existing on the mail surface of the second semiconductor region and a strain detecting portion consisting of the semiconductor device and provided in the first semiconductor region opposite to the cavity. The semiconductor pressure sensor is featured in that at least one of the outer peripheral side surfaces of the first and the second semiconductor regions is formed inside of the outermost peripheral side surface of the isolation layer.

Abstract translation: 本发明的半导体压力传感器旨在提供一种半导体压力传感器，其具有在半导体压力传感器的支撑装置和半导体衬底之间具有优异的电绝缘性，半导体压力传感器基本上包括具有第一半导体区域的半导体衬底， ; 形成至少一个半导体器件，第二半导体区域和埋在第一和第二半导体区域之间的隔离层，设置在第二半导体区域中的空腔，存在于第二半导体区域的邮件表面上的开口和应变 检测部分由半导体器件组成并设置在与空腔相对的第一半导体区域中。 半导体压力传感器的特征在于，第一半导体区域和第二半导体区域的至少一个外周侧表面形成在隔离层的最外周侧表面的内部。

公开(公告)号：US4069009A

公开(公告)日：1978-01-17

申请号：US730720

申请日：1976-10-08

Applicant: Masao Yamawaki ,  Katsuo Aoki ,  Yoshio Oka ,  Takao Suzuki ,  Osamu Ina ,  Kinihiko Hara

Inventor： Masao Yamawaki ,  Katsuo Aoki ,  Yoshio Oka ,  Takao Suzuki ,  Osamu Ina ,  Kinihiko Hara

IPC: B65G35/00 ,  H01L21/50 ,  H01L21/677 ,  F27B9/14

CPC classification number: H01L21/67712 ,  B65G35/00 ,  H01L21/6773

Abstract: An apparatus for automatically transferring semiconductor wafers is disclosed. Semiconductor wafers are loaded on a boat which is placed on a pair of first supporting bars. A pair of second supporting bars are driven by a motor to repeat circular motion between the first supporting bars. The second supporting bars, circularly moving in parallel with the first supporting bars, forwardly transfer the boat. The boat is kept uplifted over the first supporting bars during the forward transfer thereof. Repetition of the circular motion of the second supporting bars makes the automatic transfer of the semiconductor wafers to be heat-treated in a semiconductor manufacturing system.

Abstract translation: 公开了一种用于自动转移半导体晶片的设备。 将半导体晶片装载在放置在一对第一支撑杆上的船上。 一对第二支撑杆由马达驱动以在第一支撑杆之间重复圆周运动。 与第一支撑杆平行移动的第二支撑杆向前移动船。 在向前转移期间，船在第一支撑杆上保持隆起。 第二支撑杆的圆周运动的重复使半导体制造系统中半导体晶片的自动转印被热处理。