公开(公告)号：US07445944B2

公开(公告)日：2008-11-04

申请号：US11646244

申请日：2006-12-28

Applicant: Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Che-Ya Chou ,  Shin-Hua Chao ,  Song-Fu Yang ,  Kao-Ming Su

Inventor： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Che-Ya Chou ,  Shin-Hua Chao ,  Song-Fu Yang ,  Kao-Ming Su

IPC: H01L21/00

CPC classification number: H01L22/20 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.

Abstract translation: 提供了一种封装基板及其制造方法。 制造方法包括以下步骤。 首先，提供包括几个第一基板单元和至少一个缺陷基板单元的第一封装基板。 接下来，将缺陷的基板单元与包装基板分离，并且相应地在第一包装基板的框架中形成至少一个开口。 然后，设置第二基板单元。 第二基板单元的形状与开口的形状不同。 之后，第二基板单元设置在开口中。

公开(公告)号：US20080102539A1

公开(公告)日：2008-05-01

申请号：US11905868

申请日：2007-10-05

Applicant: Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Chih-Nan Wei ,  Song-Fu Yang ,  Chia-Jung Tsai ,  Kao-Ming Su

Inventor： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Chih-Nan Wei ,  Song-Fu Yang ,  Chia-Jung Tsai ,  Kao-Ming Su

IPC: H01L21/60

CPC classification number: H01L24/93 ,  B23K20/004 ,  H01L2224/78901 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  Y10S228/904

Abstract: A wire-bonding method for a wire-bonding apparatus is provided. The wire-bonding apparatus includes at least a first wire-bonder and a second wire-bonder for respectively bonding at least several first chips in a first region and several second chips in a second region on a substrate simultaneously. The wire-bonding method includes following steps. First, initial position coordinates of the first region and the second region are obtained. Next, it is determined whether a space between the first region and the second region is greater than a predetermined space. When the space between the first region and the second region is greater than the predetermined space, the first wire-bonder and the second wire-bonder respectively bond the first chips and the second chips simultaneously.

Abstract translation: 提供了一种用于引线接合装置的引线接合方法。 引线接合装置至少包括第一引线接合器和第二引线接合器，用于分别在基板上的第一区域中的至少几个第一芯片和第二区域中的第二区域中的多个第二芯片接合。 引线键合方法包括以下步骤。 首先，获得第一区域和第二区域的初始位置坐标。 接下来，确定第一区域和第二区域之间的空间是否大于预定空间。 当第一区域和第二区域之间的空间大于预定空间时，第一引线接合器和第二引线接合器分别同时地接合第一芯片和第二芯片。

公开(公告)号：US20080085571A1

公开(公告)日：2008-04-10

申请号：US11905804

申请日：2007-10-04

Applicant: Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Teck-Chong Lee ,  Chian-Chi Lin ,  Chia-Jung Tsai ,  Chih-Nan Wei ,  Song-Fu Yang

Inventor： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Teck-Chong Lee ,  Chian-Chi Lin ,  Chia-Jung Tsai ,  Chih-Nan Wei ,  Song-Fu Yang

IPC: B29C65/48 ,  H01L21/58

CPC classification number: H01L24/83 ,  H01L21/67144 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/743 ,  H01L24/95 ,  H01L2221/68354 ,  H01L2224/743 ,  H01L2224/83 ,  H01L2224/83192 ,  H01L2224/83855 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  Y10T156/1744

Abstract: A die bonder and a die bonding method thereof are provided. The die bonder includes a wafer platform, an arranging platform, a conveyer, at least one first pick-up device and a second pick-up device. The wafer platform is for placing a wafer with several dies. The conveyer is for carrying and conveying a substrate. The first pick-up device is for picking up one of the dies and placing each die on the arranging platform. The second pick-up device is for picking up the dies on the arranging platform and placing the dies on the substrate at the same time.

Abstract translation: 提供了一种管芯接合器及其管芯接合方法。 芯片焊接机包括晶片平台，排列平台，输送机，至少一个第一拾取装置和第二拾取装置。 晶片平台用于放置具有多个模具的晶片。 输送机用于承载和输送基材。 第一拾取装置用于拾取一个模具并将每个模具放置在排列平台上。 第二拾取装置用于拾取排列平台上的模具并将模具同时放置在基板上。