公开(公告)号：US07445944B2

公开(公告)日：2008-11-04

申请号：US11646244

申请日：2006-12-28

申请人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Che-Ya Chou ,  Shin-Hua Chao ,  Song-Fu Yang ,  Kao-Ming Su

发明人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Che-Ya Chou ,  Shin-Hua Chao ,  Song-Fu Yang ,  Kao-Ming Su

IPC分类号： H01L21/00

CPC分类号： H01L22/20 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.

摘要翻译： 提供了一种封装基板及其制造方法。 制造方法包括以下步骤。 首先，提供包括几个第一基板单元和至少一个缺陷基板单元的第一封装基板。 接下来，将缺陷的基板单元与包装基板分离，并且相应地在第一包装基板的框架中形成至少一个开口。 然后，设置第二基板单元。 第二基板单元的形状与开口的形状不同。 之后，第二基板单元设置在开口中。

公开(公告)号：US20080124836A1

公开(公告)日：2008-05-29

申请号：US11646244

申请日：2006-12-28

申请人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Che-Ya Chou ,  Shin-Hua Chao ,  Song-Fu Yang ,  Kao-Ming Su

发明人： Ho-Ming Tong ,  Teck-Chong Lee ,  Chao-Fu Weng ,  Chian-Chi Lin ,  Che-Ya Chou ,  Shin-Hua Chao ,  Song-Fu Yang ,  Kao-Ming Su

IPC分类号： H01L21/77

CPC分类号： H01L22/20 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

摘要： A packaging substrate and a manufacturing method thereof are provided. The manufacturing method includes following steps. First, a first packaging substrate including several first substrate units and at least one defected substrate unit is provided. Next, the defected substrate unit is separated from the packaging substrate, and at least one opening is formed in a frame of the first packaging substrate correspondingly. Then, a second substrate unit is provided. The shape of the second substrate unit is different from the shape of the opening. Afterwards, the second substrate unit is disposed in the opening.

公开(公告)号：US20080044931A1

公开(公告)日：2008-02-21

申请号：US11646291

申请日：2006-12-28

申请人： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Che-Ya Chou ,  Shin-Hua Chao ,  Teck-Chong Lee ,  Song-Fu Yang ,  Chian-Chi Lin

发明人： Ho-Ming Tong ,  Kao-Ming Su ,  Chao-Fu Weng ,  Che-Ya Chou ,  Shin-Hua Chao ,  Teck-Chong Lee ,  Song-Fu Yang ,  Chian-Chi Lin

IPC分类号： H01L21/98

CPC分类号： H05K3/0052 ,  H01L21/485 ,  H01L24/97 ,  H01L24/98 ,  H01L25/50 ,  H05K3/225 ,  H05K2201/10598

摘要： A packaging substrate and a method of manufacturing the same are provided. The method includes following steps. First, a first substrate including at least one defected packaging unit and several first packaging units is provided. The defected packaging unit and the first packaging units are arranged in an array on the first substrate. Next, the defected packaging unit is removed from the first substrate to correspondingly form at least one opening in the first substrate. Then, a second substrate including at least one second packaging unit is provided. Later, the second packaging unit is separated from the second substrate. The area of the second packaging unit is less than that of the opening. Subsequently, the second packaging unit is disposed in the opening. The edge of the second packaging unit is placed partially against an inner wall of the opening.

摘要翻译： 提供了一种封装基板及其制造方法。 该方法包括以下步骤。 首先，提供包括至少一个缺陷包装单元和多个第一包装单元的第一基板。 缺陷包装单元和第一包装单元以阵列布置在第一基板上。 接下来，将缺陷的包装单元从第一基板移除，以相应地形成第一基板中的至少一个开口。 然后，提供包括至少一个第二包装单元的第二基板。 之后，第二包装单元与第二基板分离。 第二包装单元的面积小于开口面积。 随后，第二包装单元设置在开口中。 第二包装单元的边缘部分地放置在开口的内壁上。

公开(公告)号：US20050168906A1

公开(公告)日：2005-08-04

申请号：US11044027

申请日：2005-01-28

申请人： Gwo-Liang Weng ,  Che-Ya Chou ,  Shih-Chang Lee

发明人： Gwo-Liang Weng ,  Che-Ya Chou ,  Shih-Chang Lee

IPC分类号： G06K9/00 ,  H01L23/28 ,  H02H1/04

CPC分类号： G06K9/00053 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00014

摘要： A contact sensor chip package includes a substrate, a contact sensor chip, a ground member and an encapsulation. The contact sensor chip is disposed on the substrate, and the contact sensor chip has a sensor area. The ground member is disposed on the ground pad of the substrate, and the ground member is electrically connected to the ground pad. The encapsulation covers the contact sensor chip and the ground member, wherein the sensor area of the contact sensor chip and a portion of the ground member are exposed out of the encapsulation.

摘要翻译： 接触传感器芯片封装包括基板，接触传感器芯片，接地部件和封装。 接触传感器芯片设置在基板上，并且接触传感器芯片具有传感器区域。 接地部件设置在基板的接地焊盘上，并且接地部件电连接到接地焊盘。 封装覆盖接触传感器芯片和接地部件，其中接触传感器芯片的传感器区域和接地部件的一部分暴露在封装之外。

公开(公告)号：US20130221536A1

公开(公告)日：2013-08-29

申请号：US13612860

申请日：2012-09-13

申请人： Thomas Matthew Gregorich ,  Tzu-Hung Lin ,  Che-Ya Chou

发明人： Thomas Matthew Gregorich ,  Tzu-Hung Lin ,  Che-Ya Chou

IPC分类号： H01L23/48

CPC分类号： H01L24/13 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/0554 ,  H01L2224/05567 ,  H01L2224/05599 ,  H01L2224/13012 ,  H01L2224/13013 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/16105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/8114 ,  H01L2224/81191 ,  H01L2224/81385 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00015 ,  H01L2924/00012 ,  H01L2224/13099 ,  H01L2224/05099 ,  H01L2224/05552

摘要： A flip chip package includes a carrier coupled to a die. The carrier includes: at least a via, for coupling the surface of the carrier to electrical traces in the carrier; and at least a capture pad electrically coupled to the via, wherein the capture pad is plated over the via. The die includes: at least a bond pad formed on the surface of the die; and at least a copper column, formed on the bond pad for coupling the die to the capture pad on the carrier, wherein the copper column is disposed on one side of the capture pad about the via opening only.

摘要翻译： 倒装芯片封装包括耦合到管芯的载体。 载体包括：用于将载体的表面耦合到载体中的电迹线的至少一个通孔; 以及至少一个电耦合到所述通孔的捕获垫，其中所述捕获垫被电镀在所述通孔上。 模具包括：至少形成在模具表面上的接合焊盘; 以及形成在所述接合焊盘上的至少一个铜柱，用于将所述管芯耦合到所述载体上的捕获垫，其中所述铜柱仅围绕所述通孔开口设置在所述捕获垫的一侧上。

公开(公告)号：US07550836B2

公开(公告)日：2009-06-23

申请号：US11889797

申请日：2007-08-16

申请人： Che-Ya Chou ,  Chi-Tsung Chiu

发明人： Che-Ya Chou ,  Chi-Tsung Chiu

IPC分类号： H01L23/02

CPC分类号： H01L23/3128 ,  H01L24/48 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A structure of a package on package and a method for fabricating the same are provided. The structure of the package on package includes a first package, a second package and a plurality of pins. The first package includes a first substrate and a first chip disposed thereon. The second package includes a second substrate and a second chip disposed thereon. The second package is disposed under the first package. The second package includes a plurality of holes. The pins are disposed on the first package and inserted to the holes so as to electrically connect the first package and the second package.

摘要翻译： 提供了封装封装的结构及其制造方法。 封装上的封装的结构包括第一封装，第二封装和多个引脚。 第一包装包括第一基板和设置在其上的第一芯片。 第二包装包括第二基板和设置在其上的第二芯片。 第二包装在第一包装下。 第二包装包括多个孔。 销设置在第一包装上并插入到孔中，以便电连接第一包装和第二包装。

公开(公告)号：US20050139997A1

公开(公告)日：2005-06-30

申请号：US10876453

申请日：2004-06-28

申请人： Che-Ya Chou

发明人： Che-Ya Chou

IPC分类号： H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/02 ,  H01L23/28 ,  H01L23/31 ,  H01L23/34 ,  H01L23/36 ,  H01L23/367 ,  H01L23/433

CPC分类号： H01L23/36 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/4334 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip assembly package mainly comprises a substrate, a chip, a plurality of electrically conductive wires, a flat heat spreader. The substrate comprises an upper surface having a chip disposal area and a bonding area surrounding the chip disposal area wherein the flat heat spreader is mounted on the upper surface and at least exposes the bonding area. The chip is disposed above the chip disposal area and mounted on the flat heat spreader. Moreover, the chip is electrically connected to the bonding area by the electrically conductive wires. Besides, an encapsulation is provided to encapsulate the chip, the flat heat spreader and the electrically conductive wires.

摘要翻译： 芯片组件封装主要包括基板，芯片，多根导电线，扁平散热器。 基板包括具有芯片处理区域的上表面和围绕芯片处理区域的结合区域，其中平坦散热器安装在上表面上并且至少暴露粘合区域。 该芯片设置在芯片处理区域上方并安装在平板散热器上。 此外，芯片通过导电线电连接到接合区域。 此外，提供封装以封装芯片，扁平散热器和导电线。

公开(公告)号：US20080116556A1

公开(公告)日：2008-05-22

申请号：US11892693

申请日：2007-08-27

申请人： Che-Ya Chou ,  Chi-Tsung Chiu

发明人： Che-Ya Chou ,  Chi-Tsung Chiu

IPC分类号： H01L23/48 ,  H01L23/02

CPC分类号： H01L23/3128 ,  H01L23/3135 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L25/03 ,  H01L25/0657 ,  H01L2224/48145 ,  H01L2224/49175 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package structure having through hole in spacer is provided. The package structure includes a substrate, a first chip, a spacer and a sub-package. The first chip is disposed on the substrate, to which an active surface of the first chip is electrically connected. The spacer, having a first side, a second side and a through hole, is disposed on the first chip, wherein the first side is opposite to the second side, and the through hole connects the first side and the second side. The sub-package is disposed on the spacer and electrically connected to the substrate.

摘要翻译： 提供了一种在间隔件中具有通孔的封装结构。 封装结构包括衬底，第一芯片，间隔物和子封装。 第一芯片设置在基板上，第一芯片的有源表面电连接到基板上。 具有第一侧，第二侧和通孔的间隔件设置在第一芯片上，其中第一侧与第二侧相对，并且通孔连接第一侧和第二侧。 子封装设置在间隔件上并电连接至基板。

公开(公告)号：US07193282B2

公开(公告)日：2007-03-20

申请号：US11044027

申请日：2005-01-28

申请人： Gwo-Liang Weng ,  Che-Ya Chou ,  Shih-Chang Lee

发明人： Gwo-Liang Weng ,  Che-Ya Chou ,  Shih-Chang Lee

IPC分类号： H01L27/14

CPC分类号： G06K9/00053 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/00014

摘要： A contact sensor chip package includes a substrate, a contact sensor chip, a ground member and an encapsulation. The contact sensor chip is disposed on the substrate, and the contact sensor chip has a sensor area. The ground member is disposed on the ground pad of the substrate, and the ground member is electrically connected to the ground pad. The encapsulation covers the contact sensor chip and the ground member, wherein the sensor area of the contact sensor chip and a portion of the ground member are exposed out of the encapsulation.

摘要翻译： 接触传感器芯片封装包括基板，接触传感器芯片，接地部件和封装。 接触传感器芯片设置在基板上，并且接触传感器芯片具有传感器区域。 接地部件设置在基板的接地焊盘上，并且接地部件电连接到接地焊盘。 封装覆盖接触传感器芯片和接地部件，其中接触传感器芯片的传感器区域和接地部件的一部分暴露在封装之外。

公开(公告)号：US20080122059A1

公开(公告)日：2008-05-29

申请号：US11839290

申请日：2007-08-15

申请人： Che-Ya Chou ,  Chih-Pin Hung

发明人： Che-Ya Chou ,  Chih-Pin Hung

IPC分类号： H01L23/02

CPC分类号： H01L25/0657 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/0401

摘要： A stacked chip package structure including a carrier, a first chip, a second chip, a barrier layer, and a metal piece is provided. The carrier has an upper surface and a corresponding lower surface. The first chip is disposed on the upper surface of the carrier, and electrically connected to the carrier. The second chip is disposed over the first chip, and electrically connected to the carrier. The barrier layer is made of an electrically conductive material, and is disposed between the first chip and the second chip. The metal piece is connected to a border of the barrier layer, and electrically connected to a ground, such that the barrier layer is grounded via the metal piece. A fabricating method of the stacked chip package structure is also provided.

摘要翻译： 提供了包括载体，第一芯片，第二芯片，阻挡层和金属片的堆叠芯片封装结构。 载体具有上表面和相应的下表面。 第一芯片设置在载体的上表面上，并与载体电连接。 第二芯片设置在第一芯片上，并且电连接到载体。 阻挡层由导电材料制成，并且设置在第一芯片和第二芯片之间。 金属片连接到阻挡层的边界，并且电连接到地，使得阻挡层通过金属片接地。 还提供了一种堆叠芯片封装结构的制造方法。