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公开(公告)号：US20210202818A1
公开(公告)日：2021-07-01
申请号：US16948395
申请日：2019-03-14
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Ravi Palaniswamy , Donato G. Caraig , Jian Xia Gao , Alejandro Aldrin A. Narag, II , Siang Sin Foo , Antonny E. Flor
Abstract: Flexible thermoelectric devices including an array of slot openings on a flexible substrate, and methods of making and using the same are provided. The slot openings on the flexible substrate can help remove the tension or compression induced during bending of the devices. Slot openings each extend along a cross direction substantially perpendicular to the longitudinal direction of the substrate.
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公开(公告)号：US10580940B2
公开(公告)日：2020-03-03
申请号：US15748663
申请日：2016-08-30
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Alejandro Aldrin A. Narag, II , Ravi Palaniswamy
Abstract: A flexible dielectric substrate (102) defines a LESD mounting region (120) including two conductive filled vias (105, 106) extending through the flexible dielectric substrate (102) and the LESD mounting region is substantially surrounded by two conductive frame portions (112, 116). The frame portions are in electrical connection with the conductive filled vias (105, 106), respectively. The conductive filled vias (105, 106) form conductive features in the mounting region (120) that are co-planar with each other.
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公开(公告)号：US10438897B2
公开(公告)日：2019-10-08
申请号：US15753426
申请日：2016-08-30
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Siang Sin Foo , Hiromitsu Kosugi , Alejandro Aldrin A. Narag, II , Ravi Palaniswamy
IPC: H01L23/544 , H01L23/498 , H01L23/00 , H05K1/02 , H05K1/18 , H01L33/62 , H01L21/48 , H05K1/11 , H05K3/32 , H05K3/34
Abstract: A flexible multilayer construction (100) for mounting a light emitting semiconductor device (200) (LESD), includes a flexible dielectric substrate (110) having an LESD mounting region (120), first and second electrically conductive pads (130, 140) disposed in the LESD mounting region for electrically connecting to corresponding first and second electrically conductive terminals of an LESD (200) received in the LESD mounting region, and a first fiducial alignment mark (150) for an accurate placement of an LESD in the LESD mounting region. The first fiducial alignment mark is disposed within the LESD mounting region.
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公开(公告)号：US20180219136A1
公开(公告)日：2018-08-02
申请号：US15748663
申请日：2016-08-30
Applicant: 3M INNOVATIVE PROPERTIES COMPANY
Inventor： Alejandro Aldrin A. Narag, II , Ravi Palaniswamy
CPC classification number: H01L33/486 , H01L33/62 , H05K1/189 , H05K2201/10106
Abstract: A flexible dielectric substrate (102) defines a LESD mounting region (120) including two conductive filled vias (105, 106) extending through the flexible dielectric substrate (102) and the LESD mounting region is substantially surrounded by two conductive frame portions (112, 116). The frame portions are in electrical connection with the conductive filled vias (105, 106), respectively. The conductive filled vias (105, 106) form conductive features in the mounting region (120) that are co-planar with each other.
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