Polishing pads and systems for and methods of using same

    公开(公告)号:US10556316B2

    公开(公告)日:2020-02-11

    申请号:US15573509

    申请日:2016-05-11

    Abstract: A polishing system includes a first carrier assembly configured to receive and hold a substrate and a polishing pad. The polishing pad includes a top major surface and a bottom major surface positioned opposite the top major surface, and a plurality of polishing elements extending from the top major surface of the polishing pad. The system further includes a polishing solution disposed between the top surface of the polishing pad and the substrate. The polishing fluid includes a fluid component, and a plurality of ceramic abrasive composites dispersed in the fluid component, the ceramic abrasive composites including individual abrasive particles dispersed in a porous ceramic matrix. The system further includes a second carrier assembly configured to receive and hold the polishing pad. The system is configured such that the polishing pad is movable relative to the substrate to carry out a polishing operation.

    Method of forming a recess in a substrate

    公开(公告)号:US10265826B2

    公开(公告)日:2019-04-23

    申请号:US14896011

    申请日:2014-06-04

    Abstract: A method of forming a recess in a surface of a substrate includes: providing an abrasive article comprising a structured abrasive member disposed along a peripheral surface of a support member, frictionally contacting the structured abrasive layer with a surface of a substrate, longitudinally advancing the structured abrasive layer relative to the surface of the substrate; and rotating at least one of the abrasive article or the substrate relative to the other around a rotational axis perpendicular to the surface of the substrate such that the structured abrasive layer maintains contact with and abrades the surface of the substrate. The structured abrasive member comprises a structured abrasive layer comprising shaped abrasive composites secured to a backing, wherein the backing is proximate to the support member. The shaped abrasive composites comprise abrasive particles retained in a binder material. The present disclosure also provides an abrasive wheel comprises a structured abrasive member disposed on a peripheral surface of a support wheel and display covers including a spherically concave recess abutting a cylindrical passage.

    METHOD OF FORMING A RECESS IN A SUBSTRATE, ABRASIVE WHEEL, AND COVER
    14.
    发明申请
    METHOD OF FORMING A RECESS IN A SUBSTRATE, ABRASIVE WHEEL, AND COVER 审中-公开
    在基材,磨料轮和覆盖物中形成记忆的方法

    公开(公告)号:US20160129544A1

    公开(公告)日:2016-05-12

    申请号:US14896011

    申请日:2014-06-04

    Abstract: A method of forming a recess in a surface of a substrate includes: providing an abrasive article comprising a structured abrasive member disposed along a peripheral surface of a support member, frictionally contacting the structured abrasive layer with a surface of a substrate, longitudinally advancing the structured abrasive layer relative to the surface of the substrate; and rotating at least one of the abrasive article or the substrate relative to the other around a rotational axis perpendicular to the surface of the substrate such that the structured abrasive layer maintains contact with and abrades the surface of the substrate. The structured abrasive member comprises a structured abrasive layer comprising shaped abrasive composites secured to a backing, wherein the backing is proximate to the support member. The shaped abrasive composites comprise abrasive particles retained in a binder material. The present disclosure also provides an abrasive wheel comprises a structured abrasive member disposed on a peripheral surface of a support wheel and display covers including a spherically concave recess abutting a cylindrical passage.

    Abstract translation: 在基板的表面中形成凹部的方法包括:提供包括沿着支撑构件的外周表面设置的结构化研磨构件的磨料制品,将结构化研磨层与基底表面摩擦接触,纵向推进结构化 研磨层相对于基底的表面; 以及使所述磨料制品或所述基底中的至少一个相对于另一个围绕垂直于所述基底的表面的旋转轴线旋转,使得所述结构化研磨层保持与所述基底的表面接触并磨蚀所述基底的表面。 结构化研磨件包括结构化研磨层,其包括固定到背衬的成形研磨复合材料,其中背衬靠近支撑构件。 成形的磨料复合材料包括保留在粘合剂材料中的磨料颗粒。 本公开还提供了一种研磨轮,其包括设置在支撑轮的外周表面上的结构化研磨构件和包括邻接圆柱形通道的球形凹槽的显示盖。

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