公开(公告)号：US20180154497A1

公开(公告)日：2018-06-07

申请号：US15573509

申请日：2016-05-11

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Paul S. Lugg ,  Bruce A. Sventek ,  Lian S. Tan

IPC: B24B37/04 ,  B24B37/10 ,  B24B37/26

CPC classification number: B24B37/044 ,  B24B37/105 ,  B24B37/26

Abstract: A polishing system includes a first carrier assembly configured to receive and hold a substrate and a polishing pad. The polishing pad includes a top major surface and a bottom major surface positioned opposite the top major surface, and a plurality of polishing elements extending from the top major surface of the polishing pad. The system further includes a polishing solution disposed between the top surface of the polishing pad and the substrate. The polishing fluid includes a fluid component, and a plurality of ceramic abrasive composites dispersed in the fluid component, the ceramic abrasive composites including individual abrasive particles dispersed in a porous ceramic matrix. The system further includes a second carrier assembly configured to receive and hold the polishing pad. The system is configured such that the polishing pad is movable relative to the substrate to carry out a polishing operation.

公开(公告)号：US10556316B2

公开(公告)日：2020-02-11

申请号：US15573509

申请日：2016-05-11

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Paul S. Lugg ,  Bruce A. Sventek ,  Lian S. Tan

IPC: B24B37/26 ,  B24B37/04 ,  B24B37/10

Abstract: A polishing system includes a first carrier assembly configured to receive and hold a substrate and a polishing pad. The polishing pad includes a top major surface and a bottom major surface positioned opposite the top major surface, and a plurality of polishing elements extending from the top major surface of the polishing pad. The system further includes a polishing solution disposed between the top surface of the polishing pad and the substrate. The polishing fluid includes a fluid component, and a plurality of ceramic abrasive composites dispersed in the fluid component, the ceramic abrasive composites including individual abrasive particles dispersed in a porous ceramic matrix. The system further includes a second carrier assembly configured to receive and hold the polishing pad. The system is configured such that the polishing pad is movable relative to the substrate to carry out a polishing operation.

公开(公告)号：US20210189175A1

公开(公告)日：2021-06-24

申请号：US16076015

申请日：2017-02-10

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： John J. Gagliardi ,  Eric C. Coad ,  Paul S. Lugg

IPC: C09G1/02 ,  B24B37/04 ,  C09K3/14

Abstract: A polishing system includes a substrate to be polished and a polishing pad. The polishing pad includes a base layer and a wear resistant layer. The system further includes a polishing solution disposed between the polishing pad and the substrate. The polishing solution includes a fluid component and a plurality of ceramic abrasive composites. The ceramic abrasive composites include individual abrasive particles uniformly dispersed throughout a porous ceramic matrix. At least a portion of the porous ceramic matrix includes glassy ceramic material. The ceramic abrasive composites are dispersed in the fluid component.