POLISHING PADS AND SYSTEMS FOR AND METHODS OF USING SAME

    公开(公告)号:US20180154497A1

    公开(公告)日:2018-06-07

    申请号:US15573509

    申请日:2016-05-11

    CPC classification number: B24B37/044 B24B37/105 B24B37/26

    Abstract: A polishing system includes a first carrier assembly configured to receive and hold a substrate and a polishing pad. The polishing pad includes a top major surface and a bottom major surface positioned opposite the top major surface, and a plurality of polishing elements extending from the top major surface of the polishing pad. The system further includes a polishing solution disposed between the top surface of the polishing pad and the substrate. The polishing fluid includes a fluid component, and a plurality of ceramic abrasive composites dispersed in the fluid component, the ceramic abrasive composites including individual abrasive particles dispersed in a porous ceramic matrix. The system further includes a second carrier assembly configured to receive and hold the polishing pad. The system is configured such that the polishing pad is movable relative to the substrate to carry out a polishing operation.

    Polishing Article, Polishing System and Method of Polishing

    公开(公告)号:US20220347816A1

    公开(公告)日:2022-11-03

    申请号:US17773923

    申请日:2020-10-29

    Abstract: A polishing article includes a polishing layer having a working surface including at least one multi-cell structure disposed on the working surface. The multi-cell structure includes three cells, defined as a first cell, a second cell and a third cell. Each of the three cells includes at least one sidewall defining a cell shape. The first cell and the second cell include a first common sidewall including a first channel, having a first channel length, allowing fluid communication between the first cell and the second cell, and a first axis perpendicular to the first channel length and substantially parallel to the working surface. Further, the second cell and the third cell include a second common sidewall including a second channel, having a second channel length, allowing fluid communication between the second cell and the third cell, and a second axis perpendicular to the second channel length and substantially parallel to the working surface. An included angle between the first axis and the second axis is from 0° to less than 180°.

    OLEOPHOBIC COATINGS
    5.
    发明申请
    OLEOPHOBIC COATINGS 有权
    氧化涂料

    公开(公告)号:US20150038642A1

    公开(公告)日:2015-02-05

    申请号:US14379313

    申请日:2013-02-06

    Abstract: A polymeric coating for a glass substrate includes a hexafluoropropylene oxide derived silane polymer. The hexafluoropropylene oxide derived silane polymer has a molecular weight of greater than about 5500, a thickness of between about 2 and about 15 nanometers and a coefficient of friction constant of less than about 0.35. A water contact angle of the polymeric hexafluoropropylene oxide derived silane coating decreases by less than about 27% after being subjected to 10000 abrasion cycles.

    Abstract translation: 用于玻璃基底的聚合物涂层包括衍生自六氟环氧丙烷的硅烷聚合物。 六氟环氧丙烷衍生的硅烷聚合物的分子量大于约5500,厚度为约2至约15纳米,摩擦系数常数小于约0.35。 聚合六氟环氧丙烷衍生的硅烷涂层的水接触角在经受10000次磨损循环后减少了约27%。

    Polishing pads and systems for and methods of using same

    公开(公告)号:US10556316B2

    公开(公告)日:2020-02-11

    申请号:US15573509

    申请日:2016-05-11

    Abstract: A polishing system includes a first carrier assembly configured to receive and hold a substrate and a polishing pad. The polishing pad includes a top major surface and a bottom major surface positioned opposite the top major surface, and a plurality of polishing elements extending from the top major surface of the polishing pad. The system further includes a polishing solution disposed between the top surface of the polishing pad and the substrate. The polishing fluid includes a fluid component, and a plurality of ceramic abrasive composites dispersed in the fluid component, the ceramic abrasive composites including individual abrasive particles dispersed in a porous ceramic matrix. The system further includes a second carrier assembly configured to receive and hold the polishing pad. The system is configured such that the polishing pad is movable relative to the substrate to carry out a polishing operation.

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