公开(公告)号：US10448506B2

公开(公告)日：2019-10-15

申请号：US16238586

申请日：2019-01-03

Applicant: AGC Inc.

Inventor： Tomoya Hosoda ,  Tatsuya Terada

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/18 ,  H05K3/40 ,  H05K1/02 ,  H05K3/42 ,  H01Q1/38

Abstract: To provide a wiring substrate having excellent transmission characteristics, of which initial failure of a plating layer formed on an inner wall surface of a hole is suppressed regardless of the type of the pre-treatment applied to the inner wall surface of the hole, and of which the plating layer has favorable heat resistance, and a process for producing it.A wiring substrate 10 comprising an electrical insulator layer 20, a first conductor layer 32 formed on a first surface of the electrical insulator layer 20, a second conductor layer 34 formed on a second surface of the electrical insulator layer 20, and a plating layer 42 provided on an inner wall surface of a hole 40 which opens from the first conductor layer 32 through the second conductor layer 34; wherein the electrical insulator layer 20 has a heat resistant resin layer 22 containing a heat resistant resin and a resin powder; the resin powder is formed from a resin material containing a melt-formable fluororesin having a functional group such as a carbonyl group-containing group; the content of the resin powder is from 5 to 70 mass % to the heat resistant resin layer 22; and the electrical insulator layer 20 has a dielectric constant of from 2.0 to 3.5.

公开(公告)号：US20190144700A1

公开(公告)日：2019-05-16

申请号：US16249020

申请日：2019-01-16

Applicant: AGC Inc.

Inventor： Tomoya HOSODA ,  Tatsuya Terada ,  Shigeki Kobayashi ,  Atsumi Yamabe

IPC: C09D127/18 ,  C08F214/26 ,  C09D5/00 ,  H05K3/06 ,  H05K3/28 ,  H05K1/03

Abstract: To provide a liquid composition whereby a resin powder can be uniformly dispersed in a resin or the like without being scattered, and a method for producing a film, a laminate or the like by using the liquid composition. The liquid composition comprises a liquid medium and a resin powder dispersed in the liquid medium, and characterized in that the average particle size of the resin powder is from 0.3 to 6 μm, the volume-based cumulative 90% diameter of the resin powder is at most 8 μm, and the resin powder is a resin containing a fluorinated copolymer having a specific functional group. And, the method is a method for producing a film, a laminate or the like by using the liquid composition.

公开(公告)号：US20190030870A1

公开(公告)日：2019-01-31

申请号：US16152637

申请日：2018-10-05

Applicant: AGC Inc.

Inventor： Tatsuya Terada ,  Toru Sasaki

IPC: B32B27/08 ,  B32B15/08 ,  B32B37/18 ,  H05K3/46 ,  H05K1/03

Abstract: To provide a laminate having a fluororesin layer and a thermoplastic resin layer laminated with a good adhesive strength.A method for producing a laminate, comprising carrying out heat lamination of a fluororesin film containing the following fluororesin (A) and a thermoplastic resin film containing a thermoplastic resin (B) having a melting point higher by at least 5° C. than the melting point of the fluororesin (A), at a temperature of at least a melting point of the fluororesin (A) and lower than a melting point of the thermoplastic resin (B). The fluororesin (A) is a fluororesin having at least one functional group selected from the group consisting of a carbonyl group-containing group, a hydroxy group, an epoxy group and an isocyanate group, and having a melt flow rate of from 0.5 to 30 g/10 min at 372° C. under a load of 49N.