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公开(公告)号：US20200317948A1
公开(公告)日：2020-10-08
申请号：US16904645
申请日：2020-06-18
Applicant: AGC Inc.
Inventor： Tatsuya Terada , Tomoya Hosoda , Atsumi Yamabe
Abstract: To provide a dispersion excellent in miscibility with varnish, coating properties, dispersibility and dispersion stability; and methods for producing a metal laminate and a printed board. A dispersion comprises an organic solvent and a powder so that the powder is dispersed in the organic solvent, wherein the powder is a powder containing a tetrafluoroethylene type polymer having a melt viscosity at 380° C. of from 1×102 to 1×106 Pa·s; the viscosity is from 50 to 10,000 mPa·s; and the thixotropy ratio calculated by dividing the viscosity measured under the condition of rotational speed of 30 rpm by the viscosity measured under the condition of rotational speed of 60 rpm, is from 1.0 to 2.2.
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Patent Agency Ranking
2.发明授权公开(公告)号：US11174411B2
公开(公告)日：2021-11-16
申请号：US16249020
申请日：2019-01-16
Applicant: AGC Inc.
Inventor： Tomoya Hosoda , Tatsuya Terada , Shigeki Kobayashi , Atsumi Yamabe
IPC: C08J3/12 , C09D127/18 , C08F18/08 , C08F20/04 , C08F16/24 , C08F22/06 , C08L27/18 , B32B15/082 , C08J5/18 , C08F14/26 , C08L101/00 , C08F20/18 , C08F234/00 , C08F20/32 , C08F214/26 , B32B15/08 , H05K1/03 , H05K3/28 , C09D5/00 , H05K3/06
Abstract: To provide a liquid composition whereby a resin powder can be uniformly dispersed in a resin or the like without being scattered, and a method for producing a film, a laminate or the like by using the liquid composition. The liquid composition comprises a liquid medium and a resin powder dispersed in the liquid medium, and characterized in that the average particle size of the resin powder is from 0.3 to 6 μm, the volume-based cumulative 90% diameter of the resin powder is at most 8 μm, and the resin powder is a resin containing a fluorinated copolymer having a specific functional group. And, the method is a method for producing a film, a laminate or the like by using the liquid composition.
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3.发明申请公开(公告)号：US20190144700A1
公开(公告)日：2019-05-16
申请号：US16249020
申请日：2019-01-16
Applicant: AGC Inc.
Inventor： Tomoya HOSODA , Tatsuya Terada , Shigeki Kobayashi , Atsumi Yamabe
IPC: C09D127/18 , C08F214/26 , C09D5/00 , H05K3/06 , H05K3/28 , H05K1/03
Abstract: To provide a liquid composition whereby a resin powder can be uniformly dispersed in a resin or the like without being scattered, and a method for producing a film, a laminate or the like by using the liquid composition. The liquid composition comprises a liquid medium and a resin powder dispersed in the liquid medium, and characterized in that the average particle size of the resin powder is from 0.3 to 6 μm, the volume-based cumulative 90% diameter of the resin powder is at most 8 μm, and the resin powder is a resin containing a fluorinated copolymer having a specific functional group. And, the method is a method for producing a film, a laminate or the like by using the liquid composition.
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公开(公告)号：US11642877B2
公开(公告)日：2023-05-09
申请号：US17071058
申请日：2020-10-15
Applicant: AGC Inc.
Inventor： Atsumi Yamabe , Kohei Yasuda , Nobuaki Ikawa
CPC classification number: B32B27/322 , B32B3/30 , B32B17/10 , B32B17/10018 , B32B17/1055 , B32B17/10146 , B32B17/10577 , B32B2307/538
Abstract: To provide a glass resin laminate of the present invention, in which the glass substrate and the resin layer containing a TFE polymer are strongly laminated, is hardly warped and is excellent in the electrical properties, a composite laminate further having a metal foil, and methods for producing them.
A glass resin laminate comprising a glass substrate 10 having an uneven surface 12 with an arithmetic mean roughness of at least 5 nm, and a resin layer containing a tetrafluoroethylene polymer in contact with the uneven surface 12,
wherein the uneven surface 12 has specific convex portions 21 and 22 which narrow at at least a part of the root portion as compared with the tip portion.-
公开(公告)号：US11632859B2
公开(公告)日：2023-04-18
申请号：US16911492
申请日：2020-06-25
Applicant: AGC Inc.
Inventor： Wataru Kasai , Tomoya Hosoda , Atsumi Yamabe
Abstract: Provided is a long laminate for a printed wiring board, which has reduced thickness of a resin layer and increased signal transmission speed, and which, while being excellent in dimensional stability and folding endurance, has no wrinkles in a fluororesin layer. The long laminate contains a metal layer of a long metal foil, a fluororesin layer containing a fluororesin and contacting the metal layer, and a heat-resistant resin layer containing a heat-resistant resin and contacting the fluororesin layer. Each fluororesin layer is 1 to 10 μm thick. The ratio of the total thickness of the fluororesin layer to the total thickness of the heat-resistant resin layer is 0.3 to 3.0. The sum of the total thickness of the fluororesin layer and the total thickness of the heat-resistant resin layer is at most 50 μm. Also provided are a method for producing the long laminate, and the printed wiring board.
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公开(公告)号：US11370200B2
公开(公告)日：2022-06-28
申请号：US16660895
申请日：2019-10-23
Applicant: AGC Inc.
Inventor： Tomoya Hosoda , Tatsuya Terada , Atsumi Yamabe , Nobutaka Kidera , Wataru Kasai
Abstract: The purpose of the present invention is to provide a fluororesin film or fluororesin laminate excellent in heat resistance and excellent in interlayer adhesion to an object to be laminated, such as a prepreg, a method for producing a hot pressed laminate using said film or laminate, and a method for producing a printed circuit board. The fluororesin film contains a fluororesin having a melting point of from 260 to 380° C., and has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 μm2 of at least one surface thereof in the thickness direction is measured by an atomic force microscope. The laminate 1 has a layer A10 containing said fluororesin and a layer B12 made of another substrate, wherein the layer A10 has an arithmetic average roughness Ra of at least 3.0 nm when inside of 1 μm2 of a second surface 10b thereof is measured by an atomic force microscope.
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