公开(公告)号：US10145908B2

公开(公告)日：2018-12-04

申请号：US13946400

申请日：2013-07-19

Applicant: Allegro Microsystems, LLC

Inventor： Paul David ,  William P. Taylor

IPC: G01R33/09 ,  G01R33/07 ,  G01D5/20 ,  G01R33/00

Abstract: Methods and apparatus for detecting a magnetic field include a semiconductor substrate, a coil configured to provide a changing magnetic field in response to a changing current in the coil; and a magnetic field sensing element supported by the substrate. The coil receives the changing current and, in response, generates a changing magnetic field. The magnetic field sensing element detects the presence of a magnetic target by detecting changes to the magnetic field caused by the target and comparing them to an expected value.

公开(公告)号：US09664494B2

公开(公告)日：2017-05-30

申请号：US13891519

申请日：2013-05-10

Applicant: Allegro Microsystems, LLC

Inventor： Devon Fernandez ,  Paul David ,  William P. Taylor

IPC: G01B7/30 ,  G01B7/00 ,  G01R33/00

CPC classification number: G01B7/003 ,  G01R33/0023

Abstract: A magnetic field sensor with enhanced immunity to external magnetic interference is presented. Included is a magnetic field signal generator and a demodulator. The magnetic field signal generator produces a magnetic field signal having a modulated signal portion in a first frequency band based on a sensed modulated AC bias magnetic field. The modulated AC bias magnetic field is produced by movement of ferromagnetic target relative to a bias coil when an AC signal is applied to the bias coil. When the magnetic field signal also includes an unwanted signal portion in a second frequency band based on external magnetic interference, demodulation performed by the demodulator results in the modulated signal portion being shifted from the first frequency band to a third frequency band and the unwanted signal portion being shifted to the first frequency band. The bias coil may be provided as part of the magnetic field sensor.

公开(公告)号：US09494660B2

公开(公告)日：2016-11-15

申请号：US13749776

申请日：2013-01-25

Applicant: Allegro Microsystems, LLC

Inventor： Paul David ,  William P. Taylor ,  P. Karl Scheller ,  Ravi Vig ,  Andreas P. Friedrich

IPC: G01R33/00 ,  H01L23/495

CPC classification number: G01R33/00 ,  G01R33/0011 ,  G01R33/0047 ,  H01L23/49562 ,  H01L23/49589 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.

Abstract translation: 磁场传感器包括具有多个引线的引线框架，其中至少两个引线框具有连接部分和管芯附接部分。 半导体管芯附接到至少两个引线的管芯附接部分。 在一些实施例中，至少一个无源部件附接到至少两个引线的管芯附接部分。

公开(公告)号：US20140320124A1

公开(公告)日：2014-10-30

申请号：US13871131

申请日：2013-04-26

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Paul David ,  Ravi Vig ,  William P. Taylor ,  Andreas P. Friedrich

IPC: G01R33/09

CPC classification number: G01R33/093 ,  G01R33/0047 ,  H01L2224/32245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads and a separately formed ferromagnetic element, such as a magnet, is disposed adjacent to the lead frame.

Abstract translation: 磁场传感器包括具有多个引线的引线框架，其中至少两个引线框具有连接部分和管芯附接部分。 半导体管芯附接到至少两个引线的管芯附接部分，并且分开形成的铁磁元件（例如磁体）被布置成与引线框架相邻。

公开(公告)号：US20130249546A1

公开(公告)日：2013-09-26

申请号：US13749776

申请日：2013-01-25

Applicant: ALLEGRO MICROSYSTEMS, LLC

Inventor： Paul David ,  William P. Taylor ,  P. Karl Scheller ,  Ravi Vig ,  Andreas P. Friedrich

IPC: G01R33/00

CPC classification number: G01R33/00 ,  G01R33/0011 ,  G01R33/0047 ,  H01L23/49562 ,  H01L23/49589 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A magnetic field sensor includes a lead frame having a plurality of leads, at least two of which have a connection portion and a die attach portion. A semiconductor die is attached to the die attach portion of the at least two leads. In some embodiments, at least one passive component is attached to the die attach portion of at least two leads.

Abstract translation: 磁场传感器包括具有多个引线的引线框架，其中至少两个引线框具有连接部分和管芯附接部分。 半导体管芯附接到至少两个引线的管芯附接部分。 在一些实施例中，至少一个无源部件附接到至少两个引线的管芯附接部分。