公开(公告)号：US20170179183A1

公开(公告)日：2017-06-22

申请号：US15455055

申请日：2017-03-09

Applicant: ams AG

Inventor： Cathal CASSIDY ,  Joerg SIEGERT ,  Franz SCHRANK

IPC: H01L27/146 ,  H01L31/0296

CPC classification number: H01L27/1469 ,  H01L24/32 ,  H01L24/83 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14661 ,  H01L27/14663 ,  H01L27/14696 ,  H01L31/0296 ,  H01L31/02966 ,  H01L2924/14 ,  H01L2924/37001

Abstract: The semiconductor device comprises a semiconductor wafer with an integrated circuit, formed by a plurality of dies, a further semiconductor wafer, which differs from the semiconductor wafer in diameter and semiconductor material, the semiconductor wafer and the further semiconductor wafer being bonded to one another by means of a bonding layer, and an electrically conductive contact layer arranged on the further semiconductor wafer opposite to the bonding layer.

公开(公告)号：US20150340264A1

公开(公告)日：2015-11-26

申请号：US14759400

申请日：2014-01-08

Applicant: AMS AG

Inventor： Joerg SIEGERT ,  Martin SCHREMS ,  Jochen KRAFT ,  Franz SCHRANK

IPC: H01L21/683 ,  H01L21/768

CPC classification number: H01L21/6836 ,  H01L21/6835 ,  H01L21/76898 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/10

Abstract: A device wafer having a main surface including an edge region and a carrier having a further main surface including an annular surface region corresponding to the edge region of the device wafer are provided. An adhesive is applied in the edge region and/or in the annular surface region, but not on the remaining areas of the main surfaces. The device wafer is fastened to the carrier by the adhesive. The main surface and the further main surface are brought into contact with one another when the device wafer is fastened to the carrier, while the main surface and the further main surface are fastened to one another only in the edge region. The device wafer is removed from the carrier after further process steps, which may include the formation of through-wafer vias in the device wafer.

Abstract translation: 提供了具有包括边缘区域的主表面和具有包括对应于器件晶片的边缘区域的环形表面区域的另外的主表面的载体的器件晶片。 粘合剂施加在边缘区域和/或环形表面区域中，但不施加在主表面的剩余区域上。 器件晶片通过粘合剂固定到载体上。 当装置晶片被固定到载体上时，主表面和另外的主表面彼此接触，而主表面和另外的主表面仅在边缘区域彼此紧固。 在进一步的工艺步骤之后，器件晶片从载体上移除，其可以包括在器件晶片中形成贯通晶片通孔。