公开(公告)号：US20160192550A1

公开(公告)日：2016-06-30

申请号：US15064530

申请日：2016-03-08

Applicant: Apple Inc.

Inventor： Matthew P. Casebolt ,  William F. Leggett ,  David M. Rockford

IPC: H05K13/04 ,  B25B27/00 ,  B23P19/04

CPC classification number: H05K13/0486 ,  B23P19/04 ,  B25B27/00 ,  G06F1/1658 ,  H05K13/0491 ,  Y10T29/49822 ,  Y10T29/49945 ,  Y10T29/53909

Abstract: The described embodiments relate generally to components used in a portable computing device and more particularly to mounting a component with a component extractor that allows a component to be removably affixed to a portable computing device. The component extractor can include a compressible securing portion configured to secure the component to the portable computing device and an extracting portion arranged to apply an extracting force to the compressible securing portion to detach the component from the portable computing device. The compressible material can be made of a highly extensible material. In one embodiment, a low friction material can be provided along an edge of the component such that the component extractor slides along the edge during an extraction procedure.

Abstract translation: 所描述的实施例一般涉及在便携式计算设备中使用的组件，更具体地涉及使用组件提取器安装组件，该组件提取器允许组件可拆卸地固定到便携式计算设备。 组件提取器可以包括被配置为将组件固定到便携式计算设备的可压缩固定部分，以及提取部分，其布置成将提取力施加到可压缩固定部分，以将组件从便携式计算设备分离。 可压缩材料可以由高度可延展的材料制成。 在一个实施例中，可以沿着部件的边缘提供低摩擦材料，使得部件提取器在提取过程期间沿着边缘滑动。

公开(公告)号：US09310847B2

公开(公告)日：2016-04-12

申请号：US13897234

申请日：2013-05-17

Applicant: Apple Inc.

Inventor： Matthew P. Casebolt ,  William F. Leggett ,  David M. Rockford

IPC: B23P11/00 ,  G06F1/16

CPC classification number: H05K13/0486 ,  B23P19/04 ,  B25B27/00 ,  G06F1/1658 ,  H05K13/0491 ,  Y10T29/49822 ,  Y10T29/49945 ,  Y10T29/53909

Abstract: The described embodiments relate generally to components used in a portable computing device and more particularly to mounting a component with a component extractor that allows a component to be removably affixed to a portable computing device. The component extractor can include a compressible securing portion configured to secure the component to the portable computing device and an extracting portion arranged to apply an extracting force to the compressible securing portion to detach the component from the portable computing device. The compressible material can be made of a highly extensible material. In one embodiment, a low friction material can be provided along an edge of the component such that the component extractor slides along the edge during an extraction procedure.

Abstract translation: 所描述的实施例一般涉及在便携式计算设备中使用的组件，更具体地涉及使用组件提取器安装组件，该组件提取器允许组件可拆卸地固定到便携式计算设备。 组件提取器可以包括被配置为将组件固定到便携式计算设备的可压缩固定部分，以及提取部分，其布置成将提取力施加到可压缩固定部分，以将组件从便携式计算设备分离。 可压缩材料可以由高度可延展的材料制成。 在一个实施例中，可以沿着部件的边缘提供低摩擦材料，使得部件提取器在提取过程期间沿着边缘滑动。

公开(公告)号：US20160091933A1

公开(公告)日：2016-03-31

申请号：US14500948

申请日：2014-09-29

Applicant: Apple Inc.

Inventor： David M. Rockford ,  William F. Leggett

IPC: G06F1/16

CPC classification number: G06F1/1658 ,  C09J7/22 ,  C09J7/38 ,  C09J2201/128 ,  C09J2201/20 ,  C09J2201/28 ,  C09J2201/40 ,  C09J2201/606 ,  C09J2203/33 ,  C09J2205/302 ,  G06F1/1616 ,  G06F1/1635 ,  H01M2/1022 ,  Y10T428/14 ,  Y10T428/1476 ,  Y10T428/24802 ,  Y10T428/28

Abstract: This application relates to methods and apparatus relating to an adhesive bond that includes an integrated release mechanism. The adhesive bond can secure components in a portable electronic device, such as a battery, to the housing of the portable electronic device. The release mechanism can be embodied as a thin layer of polymeric material sandwiched between a first adhesive layer and a second adhesive layer. The first and second adhesive layers are joined to one another by a number of pillars that extend through openings in the release mechanism. A portion of the release mechanism can protrude from the adhesive bond allowing a technician or user to pull the release mechanism out of the adhesive bond, which severs the pillars that hold the adhesive layers together. In this way, the release mechanism allows for efficient separation of the adhesively secured components.

Abstract translation: 本申请涉及涉及包括集成释放机构的粘合剂粘合剂的方法和设备。 粘合剂粘合可以将诸如电池的便携式电子设备中的组件固定到便携式电子设备的壳体。 释放机构可以被实施为夹在第一粘合剂层和第二粘合剂层之间的聚合物材料的薄层。 第一和第二粘合剂层通过延伸穿过释放机构中的开口的多个支柱彼此连接。 释放机构的一部分可以从粘合剂粘合点突出，从而使技术人员或使用者将释放机构拉出粘合剂粘结，从而将保持粘合剂层的支柱切断在一起。 以这种方式，释放机构允许有效地分离粘合的固定部件。