公开(公告)号：US20140092560A1

公开(公告)日：2014-04-03

申请号：US13631973

申请日：2012-09-29

Applicant: APPLE INC.

Inventor： Kevin D. GIBBS ,  Amy QIAN ,  John RAFF ,  Derek WRIGHT

IPC: H05K7/20 ,  H05K3/30

CPC classification number: H05K1/0209 ,  H05K1/0215 ,  H05K1/181 ,  H05K3/4092 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10106 ,  H05K2201/10128 ,  Y10T29/4913

Abstract: The described embodiment relates generally to the manufacture of display assemblies. More particularly the use of alternative back plates for a display assembly is discussed. By using a printed circuit board (PCB) in lieu of a metal backer heat can be evenly spread across the backer by applying a layer of copper configured to normalize a spread of heat across the printed circuit board. The configuration of the copper layer can be configured based on a tested or simulated heat map that accounts for proximate heat producing elements. The PCB can also advantageously act as an interconnection layer between other electrical components disposed within the electronic device.

Abstract translation: 所描述的实施例一般涉及显示组件的制造。 更具体地，讨论了用于显示组件的备用背板的使用。 通过使用印刷电路板（PCB）代替金属支架，可以通过施加配置成使印刷电路板上的热量扩展归一化的铜层，可以均匀地分布在衬底上。 可以基于测量或模拟的热图来配置铜层的构造，这些热图表示邻近的发热元件。 PCB还可以有利地用作布置在电子设备内的其它电气部件之间的互连层。