公开(公告)号：US09473609B2

公开(公告)日：2016-10-18

申请号：US14550814

申请日：2014-11-21

Applicant: Apple Inc.

Inventor： Ashutosh Y. Shukla ,  Tyler B. Cater ,  Sawyer I. Cohen ,  Edward S. Huo ,  David A. Pakula ,  Benjamin Shane Bustle ,  Dhaval N. Shah ,  Yaocheng Zhang ,  Vivek Katiyar

IPC: H01H1/64 ,  H01H1/66 ,  H01H9/02 ,  H01H9/06 ,  H01H13/00 ,  H01H19/04 ,  H01H19/08 ,  H01H21/00 ,  H04M1/23 ,  H01H13/06

CPC classification number: H04B1/3888 ,  H01H13/06 ,  H01H2205/016 ,  H01H2207/032 ,  H01H2213/00 ,  H01H2213/002 ,  H01H2213/016 ,  H01H2223/002 ,  H04B2001/3894 ,  H04M1/0249 ,  H04M1/026 ,  H04M1/236

Abstract: This application relates to various button related embodiments for use with a portable electronic device. In some embodiments, a snap clip can be integrated with a button bracket to save space where two separate brackets would take up too much space in the portable electronic device. In other embodiments, a tactile switch can be waterproofed by welding a polymeric layer atop a tactile switch assembly. In this way water can be prevented from contacting moisture sensitive components of the tactile switch assembly. The weld joining the polymeric layer to the tactile switch can include at least one gap to trapped gas surrounding the tactile switch assembly to enter and exit during heat excursions caused by various operating and/or assembly operations.

Abstract translation: 本申请涉及与便携式电子设备一起使用的各种按钮相关实施例。 在一些实施例中，卡扣夹可以与按钮支架集成，以节省空间，其中两个单独的支架将占据便携式电子装置中太多的空间。 在其他实施例中，触觉开关可以通过在触觉开关组件顶部焊接聚合物层来防水。 以这种方式，可以防止水与触觉开关组件的湿气敏感部件接触。 将聚合物层连接到触觉开关的焊接可以包括围绕触觉开关组件的被捕获的气体的至少一个间隙，以在由各种操作和/或组装操作引起的热偏移期间进入和离开。

公开(公告)号：US09456307B2

公开(公告)日：2016-09-27

申请号：US13904838

申请日：2013-05-29

Applicant: Apple Inc.

Inventor： Vivek Katiyar ,  Andrzej T. Baranski ,  Dhaval N. Shah ,  Stephen Brian Lynch

IPC: H04M1/00 ,  H04W4/02 ,  G01C3/08 ,  G01C15/00

CPC classification number: H04W4/026 ,  G01C3/08 ,  G01C15/002

Abstract: An electronic device may be provided with electronic components such as mapping circuitry for measuring distances, areas, volumes or other properties of objects in the surrounding environment of the device. The mapping circuitry may include a laser sensor and device position detection circuitry. The device may include processing circuitry configured to gather laser sample data and device position data using the laser sensor and the device position detection circuitry. The laser sample data and the device position data may be gathered while pointing a laser beam generated with a laser in the laser sensor at one or more sample points on a surface such as a surface of a wall. By tracking the device position and orientation using the device position detection circuitry, the objects may be mapped while gathering laser sample data from any position with respect to the object.

Abstract translation: 电子设备可以设置有电子部件，例如用于测量设备的周围环境中的物体的距离，面积，体积或其他属性的映射电路。 映射电路可以包括激光传感器和设备位置检测电路。 该装置可以包括配置成使用激光传感器和装置位置检测电路来收集激光采样数据和装置位置数据的处理电路。 可以在将激光产生的激光束指向激光传感器中的一个或多个采样点的表面（例如墙壁的表面）上的同时收集激光采样数据和设备位置数据。 通过使用设备位置检测电路跟踪设备位置和方向，可以在从相对于对象的任何位置收集激光采样数据的同时映射对象。

公开(公告)号：US09080932B2

公开(公告)日：2015-07-14

申请号：US13892748

申请日：2013-05-13

Applicant: Apple Inc.

Inventor： Dhaval N. Shah ,  Shayan Malek ,  Vivek Katiyar

IPC: G01N3/30 ,  G01M99/00 ,  G01N3/303 ,  G01N33/00

CPC classification number: G01N3/30 ,  G01L1/2262 ,  G01L1/2287 ,  G01M5/0033 ,  G01M99/00 ,  G01N3/303 ,  G01N2033/0078 ,  G01P15/0891 ,  G06F1/1633 ,  H04M1/0277 ,  H04M1/185 ,  H04M2250/12

Abstract: An electronic device may contain electrical components mounted on one or more substrates such as printed circuit boards. During a drop event, the printed circuit boards and components may be subjected to stresses. Strain gauges may be formed from metal traces embedded within dielectric layers in the printed circuit boards. The strain gauges may be used to make stress measurements at various locations on the boards. Stress data may be collected in response to data from an accelerometer indicating that the device has been dropped. Stress data collection may be halted in response to determining that the device has struck an external surface. Impact may be detected using accelerometer data, strain gauge output, or other sensor data. Stress data may be analyzed by the electronic device or external equipment.

Abstract translation: 电子设备可以包含安装在诸如印刷电路板的一个或多个基板上的电气部件。 在跌落事件期间，印刷电路板和部件可能受到应力。 应变计可以由嵌入印刷电路板的电介质层中的金属迹线形成。 应变计可用于在板上的各个位置进行应力测量。 应答数据可以响应于来自加速度计的数据而被收集，表示该设备已被丢弃。 响应于确定设备已经撞击到外部表面，可以停止压力数据收集。 可以使用加速度计数据，应变计输出或其他传感器数据检测影响。 应力数据可以由电子设备或外部设备分析。

公开(公告)号：US09972454B1

公开(公告)日：2018-05-15

申请号：US14867336

申请日：2015-09-28

Applicant: Apple Inc.

Inventor： Sawyer I. Cohen ,  Tyler B. Cater ,  Ramachandran Chundru ,  Vivek Katiyar ,  Marwan Rammah ,  Ashutosh Y. Shukla

IPC: H01H1/10 ,  H01H3/12 ,  H01H11/00 ,  H01H3/00

CPC classification number: H01H3/12 ,  H01H11/00 ,  H01H2003/008 ,  H01H2011/0087

Abstract: An electronic device includes a tactile switch assembly. The tactile switch assembly includes a tactile switch structure. A grounding structure can be included in an electrostatic discharge path in the tactile switch structure. The grounding structure can result in a shorter electrostatic discharge path that minimizes damage caused by an electrostatic discharge event. Additionally, different grounding connectors are disclosed that can attach to a grounded component in the electronic device and to a tactile switch bracket associated with the tactile switch assembly. The grounding connector provides a grounding connection to the tactile switch bracket.

公开(公告)号：US09952703B2

公开(公告)日：2018-04-24

申请号：US14776592

申请日：2013-03-15

Applicant: Apple Inc.

Inventor： Storrs T. Hoen ,  Kristina A. Babiarz ,  Miguel C. Christophy ,  Romain A. Teil ,  Sinan Filiz ,  Vivek Katiyar

IPC: G06F3/041 ,  G06F3/0488

CPC classification number: G06F3/0414 ,  G06F3/041 ,  G06F3/0412 ,  G06F3/0416 ,  G06F3/0488 ,  G06F2203/04103

Abstract: An electronic device has a force sensor that determines a measure of applied force from a user contacting a cover glass of the device. In one embodiment, a frame at least partially encloses an interior of the electronic device and has an open end. A cover glass covers the open end of the frame and is movably connected to the frame to allow movement of the cover glass in response to one or more forces applied to an external surface of the cover glass. A plurality of strain probes is positioned under the cover glass, between the cover glass and the frame, and is arranged to output a plurality of strain signals responsive to the one or more forces applied to the cover glass. A force processing module is configured to at least calculate an amount of force applied to the cover glass based on the plurality of stain signals.

公开(公告)号：US20160093975A1

公开(公告)日：2016-03-31

申请号：US14870749

申请日：2015-09-30

Applicant: APPLE INC.

Inventor： Vivek Katiyar ,  Ibuki Kamei ,  Gregory N. Stephens

IPC: H01R13/62 ,  H01F7/08 ,  H01F1/147

CPC classification number: H01F7/08 ,  H01F1/147 ,  H01F7/0252 ,  H01R11/30 ,  H01R13/2407 ,  H01R24/28

Abstract: Connectors that may provide an improved reliability by having a reduced tendency for damage to their contacts and may have a reduced size and complexity. One example may provide a magnetic connector having a magnetic pin. The magnetic pin may have a plunger that may remain protected in a barrel and housing when the magnetic connector is not engaged with a corresponding connector. When the magnetic connector is engaged with a corresponding connector, the plunger may be magnetically attracted to a corresponding contact on the corresponding connector and may emerge from the barrel or housing to make an electrical connection between the plunger and the corresponding contact.

Abstract translation: 连接器可通过降低其触点损坏的趋势而提供改进的可靠性，并且可能具有减小的尺寸和复杂性。 一个示例可以提供具有磁销的磁性连接器。 当磁性连接器未与相应的连接器接合时，磁性销可以具有可保持在筒体和壳体中的保护柱塞。 当磁性连接器与对应的连接器接合时，柱塞可以被磁力地吸引到相应的连接器上的对应接触件上，并且可以从机筒或壳体上出来，以在柱塞和对应的接触件之间形成电连接。

公开(公告)号：US20160071664A1

公开(公告)日：2016-03-10

申请号：US14553985

申请日：2014-11-25

Applicant: Apple Inc.

Inventor： Sawyer I. Cohen ,  Tyler B. Cater ,  Marwan Rammah ,  Yaocheng Zhang ,  Edward S. Huo ,  Dhaval N. Shah ,  Scott A. Myers ,  Vivek Katiyar

IPC: H01H13/50

CPC classification number: H01H13/705 ,  H01H13/52 ,  H01H2221/062 ,  H01H2221/064 ,  H01H2221/08

Abstract: Systems and methods for forming button assemblies for electronic devices are disclosed. According to some embodiments, the button assemblies include one or more sound improvement features to improve the sound that the button assemblies make when pressed by users of the electronic devices. According to some embodiments, the button assemblies include shims that provide proper alignment of the various components of the button assemblies and to accommodate any tolerance stack up of the various components of the button assemblies. The shims can include alignment features to prevent the shims from shifting within the button assemblies. According to some embodiments, thicknesses of the shims are customized to accommodate varying tolerance stack ups of the components of the button assemblies. In some embodiments, the button assemblies include a combination of sound improvement features and shims.

Abstract translation: 公开了用于形成用于电子设备的按钮组件的系统和方法。 根据一些实施例，按钮组件包括一个或多个声音改进特征，以在根据电子设备的用户按压时改善按钮组件所产生的声音。 根据一些实施例，按钮组件包括提供按钮组件的各种部件的适当对准并且适应按钮组件的各种部件的任何公差叠加的垫片。 垫片可以包括对准特征，以防止垫片在按钮组件内移动。 根据一些实施例，垫片的厚度被定制以适应按钮组件的部件的不同公差叠加。 在一些实施例中，按钮组件包括声音改进特征和垫片的组合。

公开(公告)号：US20140331741A1

公开(公告)日：2014-11-13

申请号：US13892748

申请日：2013-05-13

Applicant: APPLE INC.

Inventor： Dhaval N. Shah ,  Shayan Malek ,  Vivek Katiyar

IPC: G01N3/30

CPC classification number: G01N3/30 ,  G01L1/2262 ,  G01L1/2287 ,  G01M5/0033 ,  G01M99/00 ,  G01N3/303 ,  G01N2033/0078 ,  G01P15/0891 ,  G06F1/1633 ,  H04M1/0277 ,  H04M1/185 ,  H04M2250/12

Abstract: An electronic device may contain electrical components mounted on one or more substrates such as printed circuit boards. During a drop event, the printed circuit boards and components may be subjected to stresses. Strain gauges may be formed from metal traces embedded within dielectric layers in the printed circuit boards. The strain gauges may be used to make stress measurements at various locations on the boards. Stress data may be collected in response to data from an accelerometer indicating that the device has been dropped. Stress data collection may be halted in response to determining that the device has struck an external surface. Impact may be detected using accelerometer data, strain gauge output, or other sensor data. Stress data may be analyzed by the electronic device or external equipment.

Abstract translation: 电子设备可以包含安装在诸如印刷电路板的一个或多个基板上的电气部件。 在跌落事件期间，印刷电路板和部件可能受到应力。 应变计可以由嵌入印刷电路板的电介质层中的金属迹线形成。 应变计可用于在板上的各个位置进行应力测量。 应答数据可以响应于来自加速度计的数据而被收集，表示该设备已被丢弃。 响应于确定设备已经撞击到外部表面，可以停止压力数据收集。 可以使用加速度计数据，应变计输出或其他传感器数据检测冲击。 应力数据可以由电子设备或外部设备分析。