公开(公告)号：US07240420B1

公开(公告)日：2007-07-10

申请号：US09884205

申请日：2001-06-19

Applicant: Matthew D. Ellis ,  Eric G. Parker ,  George D. Skidmore

Inventor： Matthew D. Ellis ,  Eric G. Parker ,  George D. Skidmore

IPC: B81B5/00

CPC classification number: B81B3/0054 ,  B81B2201/037 ,  Y10T29/5313

Abstract: A system and method are disclosed which enable post-fabrication reduction of minimum feature size spacing of microcomponents. A method for producing an assembly of microcomponents is provided, in which at least two microcomponents are fabricated having a separation space therebetween. At least one of the microcomponents includes an extension part that is operable to reduce the separation space. Such an extension part may include an extension member that is movably extendable away from its associated microcomponent to reduce the separation space between its associated microcomponent and another microcomponent. The extension part may be latched at a desired position by a latching mechanism. The extension part may be implemented such that the extension member eliminates the separation space, thereby resulting in such extension member engaging another microcomponent. Such engagement may be achieved without requiring power to be applied to the microcomponents. Certain embodiments are insensitive to etching inaccuracy encountered during fabrication.

Abstract translation: 公开了一种系统和方法，其使后期制造减少了微型部件的最小特征尺寸间距。 提供了一种用于制造微组件组件的方法，其中制造了至少两个在其间具有分隔空间的微组件。 微组件中的至少一个包括可操作以减小分离空间的延伸部分。 这种延伸部分可以包括可移动地延伸远离其相关联的微型部件的延伸部件，以减小其相关的微型部件和另一微型部件之间的分离空间。 延伸部分可以通过闭锁机构锁定在期望的位置。 延伸部件可以被实现为使得延伸部件消除分离空间，从而导致这种延伸部件与另一个微型部件接合。 可以在不需要将功率施加到微型部件的情况下实现这种接合。 某些实施例对制造期间遇到的蚀刻不精确性不敏感。

公开(公告)号：US06677225B1

公开(公告)日：2004-01-13

申请号：US09616500

申请日：2000-07-14

Applicant: Matthew D. Ellis ,  Eric G. Parker ,  George D. Skidmore

Inventor： Matthew D. Ellis ,  Eric G. Parker ,  George D. Skidmore

IPC: H01L2144

CPC classification number: B81B3/0051 ,  B81B2203/053 ,  B81B2203/055

Abstract: A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides a system and method which constrain a totally released microcomponent to a base (e.g., another microcomponent or a substrate). For example, a preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented as a “pallet” having one or more microcomponents constrained thereto. Moreover, constraining members of a preferred embodiment enable the totally released microcomponent to be removed from such constraints when desired, but prevents the totally released microcomponent from inadvertently escaping such constraints. For instance, in one embodiment, the constraining members are implemented as moveable members that can be moved to unconstrain the totally released microcomponent from its base.

Abstract translation: 公开了限制从基板完全释放以处理这种完全释放的微型部件的微组件的系统和方法。 优选的实施方案提供了将完全释放的微量组分约束到碱（例如另一微量组分或底物）的系统和方法。 例如，优选的实施方案提供了限制构件，其用于将微组件约束至基底，因为微量组分完全从这种基底释放。 因此，这样的约束构件可以在制造期间从其衬底释放这种微组件期间有助于保护微组件与其衬底。 此外，优选实施例提供了约束构件，其适用于将完全释放的微组件约束到基座以用于微组件的后制造处理。 为了进一步帮助完全释放的微型部件的后制造处理，优选实施例可以被实现为具有一个或多个微部件约束的“托盘”。 此外，优选实施例的约束构件使得当需要时可以从完全释放的微组件从这种约束中移除，但是防止完全释放的微元件不经意地逃避这样的约束。 例如，在一个实施例中，约束构件被实现为可移动的构件，其可以被移动以从其底部不受约束的完全释放的微元件。

公开(公告)号：US06672795B1

公开(公告)日：2004-01-06

申请号：US09570170

申请日：2000-05-11

Applicant: Matthew D. Ellis ,  George D. Skidmore

Inventor： Matthew D. Ellis ,  George D. Skidmore

IPC: H01R16627

CPC classification number: B81C3/008 ,  B81B2201/13 ,  F16B2/20 ,  Y10T24/45581 ,  Y10T403/602

Abstract: A system and method which provide a general-purpose snap connector suitable for coupling microcomponents are disclosed. A snap connector is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a snap connector is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a snap connector may be pressure fit with a receptacle (or aperture) of a mating component in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the snap connector. A preferred embodiment provides a “preloaded” snap connector that may be utilized to perform general assembly of microcomponents. An alternative embodiments provides a non-preloaded snap connector suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides a “squeeze” snap connector that is suitable for performing general assembly of microcomponents. Such snap connectors may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone snap connectors. For example, a dual-ended snap connector is disclosed herein, which may be coupled to a first microcomponent, and then used to couple the first microcomponent to a second microcomponent.

Abstract translation: 公开了一种提供适用于连接微型部件的通用卡扣连接器的系统和方法。 公开了一种适于执行总体组装的卡扣式连接器，包括微型部件的平面外的3-D组装，其中这种微型部件可以牢固地联接在一起。 也就是说，公开了一种卡扣连接器，其使得能够以限制耦合部件相对于彼此的不期望的运动的方式耦合微部件。 优选地，这种卡扣连接器可以以限制配合部件相对于卡扣连接器的平移和旋转自由度的方式与配合部件的插座（或孔）压配合。 一个优选实施例提供了一种“预加载”卡扣连接器，其可用于执行微型部件的总体组装。 替代实施例提供了适用于执行微型部件的总体组装的非预加载卡扣连接器。 另一替代实施例提供了适用于执行微型部件的总体组装的“挤压”卡扣连接器。 这种快速连接器可以被实现为微型部件的集成部件，或者它们可以被实现为单独的独立卡扣连接器。 例如，本文公开了双端卡扣连接器，其可以耦合到第一微型部件，然后用于将第一微型部件耦合到第二微型部件。