公开(公告)号：US07240420B1

公开(公告)日：2007-07-10

申请号：US09884205

申请日：2001-06-19

Applicant: Matthew D. Ellis ,  Eric G. Parker ,  George D. Skidmore

Inventor： Matthew D. Ellis ,  Eric G. Parker ,  George D. Skidmore

IPC: B81B5/00

CPC classification number: B81B3/0054 ,  B81B2201/037 ,  Y10T29/5313

Abstract: A system and method are disclosed which enable post-fabrication reduction of minimum feature size spacing of microcomponents. A method for producing an assembly of microcomponents is provided, in which at least two microcomponents are fabricated having a separation space therebetween. At least one of the microcomponents includes an extension part that is operable to reduce the separation space. Such an extension part may include an extension member that is movably extendable away from its associated microcomponent to reduce the separation space between its associated microcomponent and another microcomponent. The extension part may be latched at a desired position by a latching mechanism. The extension part may be implemented such that the extension member eliminates the separation space, thereby resulting in such extension member engaging another microcomponent. Such engagement may be achieved without requiring power to be applied to the microcomponents. Certain embodiments are insensitive to etching inaccuracy encountered during fabrication.

Abstract translation: 公开了一种系统和方法，其使后期制造减少了微型部件的最小特征尺寸间距。 提供了一种用于制造微组件组件的方法，其中制造了至少两个在其间具有分隔空间的微组件。 微组件中的至少一个包括可操作以减小分离空间的延伸部分。 这种延伸部分可以包括可移动地延伸远离其相关联的微型部件的延伸部件，以减小其相关的微型部件和另一微型部件之间的分离空间。 延伸部分可以通过闭锁机构锁定在期望的位置。 延伸部件可以被实现为使得延伸部件消除分离空间，从而导致这种延伸部件与另一个微型部件接合。 可以在不需要将功率施加到微型部件的情况下实现这种接合。 某些实施例对制造期间遇到的蚀刻不精确性不敏感。

公开(公告)号：US06677225B1

公开(公告)日：2004-01-13

申请号：US09616500

申请日：2000-07-14

Applicant: Matthew D. Ellis ,  Eric G. Parker ,  George D. Skidmore

Inventor： Matthew D. Ellis ,  Eric G. Parker ,  George D. Skidmore

IPC: H01L2144

CPC classification number: B81B3/0051 ,  B81B2203/053 ,  B81B2203/055

Abstract: A system and method are disclosed which constrain a microcomponent that is totally released from a substrate for handling of such totally released microcomponent. A preferred embodiment provides a system and method which constrain a totally released microcomponent to a base (e.g., another microcomponent or a substrate). For example, a preferred embodiment provides constraining members that work to constrain a microcomponent to a substrate as such microcomponent is totally released from such substrate. Accordingly, such constraining members may aid in preserving the microcomponent with its substrate during the release of such microcomponent from its substrate during fabrication. Additionally, a preferred embodiment provides constraining members that are suitable for constraining a totally released microcomponent to a base for post-fabrication handling of the microcomponent. To further aid in post-fabrication handling of totally released microcomponents, a preferred embodiment may be implemented as a “pallet” having one or more microcomponents constrained thereto. Moreover, constraining members of a preferred embodiment enable the totally released microcomponent to be removed from such constraints when desired, but prevents the totally released microcomponent from inadvertently escaping such constraints. For instance, in one embodiment, the constraining members are implemented as moveable members that can be moved to unconstrain the totally released microcomponent from its base.

Abstract translation: 公开了限制从基板完全释放以处理这种完全释放的微型部件的微组件的系统和方法。 优选的实施方案提供了将完全释放的微量组分约束到碱（例如另一微量组分或底物）的系统和方法。 例如，优选的实施方案提供了限制构件，其用于将微组件约束至基底，因为微量组分完全从这种基底释放。 因此，这样的约束构件可以在制造期间从其衬底释放这种微组件期间有助于保护微组件与其衬底。 此外，优选实施例提供了约束构件，其适用于将完全释放的微组件约束到基座以用于微组件的后制造处理。 为了进一步帮助完全释放的微型部件的后制造处理，优选实施例可以被实现为具有一个或多个微部件约束的“托盘”。 此外，优选实施例的约束构件使得当需要时可以从完全释放的微组件从这种约束中移除，但是防止完全释放的微元件不经意地逃避这样的约束。 例如，在一个实施例中，约束构件被实现为可移动的构件，其可以被移动以从其底部不受约束的完全释放的微元件。

公开(公告)号：US06672795B1

公开(公告)日：2004-01-06

申请号：US09570170

申请日：2000-05-11

Applicant: Matthew D. Ellis ,  George D. Skidmore

Inventor： Matthew D. Ellis ,  George D. Skidmore

IPC: H01R16627

CPC classification number: B81C3/008 ,  B81B2201/13 ,  F16B2/20 ,  Y10T24/45581 ,  Y10T403/602

Abstract: A system and method which provide a general-purpose snap connector suitable for coupling microcomponents are disclosed. A snap connector is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a snap connector is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a snap connector may be pressure fit with a receptacle (or aperture) of a mating component in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the snap connector. A preferred embodiment provides a “preloaded” snap connector that may be utilized to perform general assembly of microcomponents. An alternative embodiments provides a non-preloaded snap connector suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides a “squeeze” snap connector that is suitable for performing general assembly of microcomponents. Such snap connectors may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone snap connectors. For example, a dual-ended snap connector is disclosed herein, which may be coupled to a first microcomponent, and then used to couple the first microcomponent to a second microcomponent.

Abstract translation: 公开了一种提供适用于连接微型部件的通用卡扣连接器的系统和方法。 公开了一种适于执行总体组装的卡扣式连接器，包括微型部件的平面外的3-D组装，其中这种微型部件可以牢固地联接在一起。 也就是说，公开了一种卡扣连接器，其使得能够以限制耦合部件相对于彼此的不期望的运动的方式耦合微部件。 优选地，这种卡扣连接器可以以限制配合部件相对于卡扣连接器的平移和旋转自由度的方式与配合部件的插座（或孔）压配合。 一个优选实施例提供了一种“预加载”卡扣连接器，其可用于执行微型部件的总体组装。 替代实施例提供了适用于执行微型部件的总体组装的非预加载卡扣连接器。 另一替代实施例提供了适用于执行微型部件的总体组装的“挤压”卡扣连接器。 这种快速连接器可以被实现为微型部件的集成部件，或者它们可以被实现为单独的独立卡扣连接器。 例如，本文公开了双端卡扣连接器，其可以耦合到第一微型部件，然后用于将第一微型部件耦合到第二微型部件。

公开(公告)号：US07096568B1

公开(公告)日：2006-08-29

申请号：US10616735

申请日：2003-07-10

Applicant: Erik Nilsen ,  Matthew D. Ellis ,  Charles L. Goldsmith ,  Jeong Bong Lee ,  Xiaojun Huang ,  Arun Kumar Nallani ,  Kabseog Kim ,  George D. Skidmore

Inventor： Erik Nilsen ,  Matthew D. Ellis ,  Charles L. Goldsmith ,  Jeong Bong Lee ,  Xiaojun Huang ,  Arun Kumar Nallani ,  Kabseog Kim ,  George D. Skidmore

IPC: H05B3/00

CPC classification number: B81C3/008 ,  B81B2201/13 ,  B81B2207/07 ,  Y10S977/724 ,  Y10T29/49083 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: A new process and structure for microcomponent interconnection utilizing a post-assembly activated junction compound. In one embodiment, first and second microcomponents having respective first and second contact areas are provided. A junction compound is formed on one of the first and second contact areas, and the first and second contact areas are positioned adjacent each other on opposing sides of the junction compound. The junction compound is then activated to couple the first and second microcomponents.

Abstract translation: 用于使用组装后激活的连接化合物的微组件互连的新工艺和结构。 在一个实施例中，提供具有相应的第一和第二接触区域的第一和第二微型部件。 在第一接触区域和第二接触区域中的一个上形成接合化合物，并且第一接触区域和第二接触区域在接合化合物的相对侧上彼此相邻地定位。 然后结合化合物被激活以偶联第一和第二微量组分。

公开(公告)号：US06879016B1

公开(公告)日：2005-04-12

申请号：US10266726

申请日：2002-10-07

Applicant: George D. Skidmore ,  Aaron Geisberger ,  Matthew D. Ellis

Inventor： George D. Skidmore ,  Aaron Geisberger ,  Matthew D. Ellis

IPC: B81B3/00 ,  B81B7/02 ,  B81C1/00 ,  H01L21/762 ,  H01L29/00 ,  H01L29/06

CPC classification number: B81C1/00246 ,  B81B3/0035 ,  H01L21/76232

Abstract: A system and method is disclosed that strengthens the structural integrity of trench-fill electrical isolation techniques. One embodiment provides for etching a series of interlocking geometric trenches into a device layer and filling the trenches with a non-conductive dielectric material. The dielectric material establishes electrical isolation while the interlocking geometric trenches strengthen the structural integrity of the separation by providing at least one surface on the interlocking separation that experiences a compression force for each direction that the electrically isolated MEMS component is moved.

Abstract translation: 公开了一种加强沟槽填充电气隔离技术的结构完整性的系统和方法。 一个实施例提供了将一系列互锁几何沟槽蚀刻到器件层中并用非导电介电材料填充沟槽。 电介质材料建立电隔离，而互锁几何沟槽通过在互锁分离上提供至少一个表面，从而经受电动隔离MEMS组件移动的每个方向的压缩力，从而增强了分离的结构完整性。

公开(公告)号：US06676416B1

公开(公告)日：2004-01-13

申请号：US09569328

申请日：2000-05-11

Applicant: Matthew D. Ellis ,  George D. Skidmore

Inventor： Matthew D. Ellis ,  George D. Skidmore

IPC: H01R1200

CPC classification number: H01R12/91 ,  H01R12/79 ,  Y10S439/953

Abstract: A system, apparatus, and method which enable microcomponents to be electrically coupled in a desirable manner are disclosed. More specifically, electrical coupling mechanisms are disclosed, which are suitable for providing an electrical coupling between two or more microcomponents. One electrical coupling mechanism provided herein, which may be utilized to provide a flexible coupling between two or more microcomponents, is a ribbon cable. Such a ribbon cable may include one or more electrically isolated conducting “rows,” which may enable communication of electrical signals between two or more microcomponents coupled to such ribbon cable. An electrical connector, such as an electrical snap connector, is also provided herein, which is suitable for electrically coupling two or more microcomponents. Such an electrical connector may be utilized to couple a ribbon cable to a microcomponent or it may be utilized to directly couple two microcomponents in a manner that enables electrical communication therebetween. Furthermore, a “Z clamp” electrical connector is provided which allows for an engageable/disengageable electrical connection to be achieved between two or more microcomponents.

Abstract translation: 公开了一种允许微组件以期望的方式电耦合的系统，装置和方法。 更具体地，公开了电耦合机构，其适于提供两个或更多个微组件之间的电耦合。 本文提供的一种电耦合机构可用于提供两个或多个微组件之间的柔性耦合，其为带状电缆。 这种带状电缆可以包括一个或多个电隔离的导电“行”，其可以实现耦合到这种带状电缆的两个或更多个微组件之间的电信号的通信。 此处还提供了电连接器，例如电扣接头，其适用于电耦合两个或多个微元件。 这种电连接器可以用于将带状电缆耦合到微型部件，或者可以用于以能够在其间进行电连通的方式直接耦合两个微型部件。 此外，提供了一种“Z夹紧”电连接器，其允许在两个或更多个微型部件之间实现可接合/可分离的电连接。

公开(公告)号：US06678458B2

公开(公告)日：2004-01-13

申请号：US09932489

申请日：2001-08-17

Applicant: Matthew D. Ellis ,  George D. Skidmore

Inventor： Matthew D. Ellis ,  George D. Skidmore

IPC: G02B600

CPC classification number: B81C3/008 ,  B81C99/002 ,  Y10S977/951

Abstract: A system and method are disclosed that enable precise positioning of microcomponents. According to one embodiment, a system and method for positioning a microcomponent are disclosed, wherein a microcomponent is received into a microcomponent positioning device. A target position for the microcomponent may then be determined, and at least a portion of the microcomponent positioning device is controllably deformed to accurately fix, at least temporarily, the position of the microcomponent at the target position. In one embodiment, microactuators that are operable to move the microcomponent are controllably deformed to fix the position of the microcomponent at the target position. In another embodiment, support beams that support a microcomponent holder are controllably deformed to fix the position of the microcomponent at the target position.

Abstract translation: 公开了能够精确定位微组件的系统和方法。 根据一个实施例，公开了一种用于定位微组件的系统和方法，其中微组件被接收到微组件定位装置中。 然后可以确定微组件的目标位置，并且微组件定位装置的至少一部分被可控地变形，以至少临时地精确地固定微组件在目标位置的位置。 在一个实施例中，可操作以移动微组件的微致动器被可控地变形以将微组件的位置固定在目标位置。 在另一个实施例中，支撑微组件支架的支撑梁可控地变形，以将微组件的位置固定在目标位置。

公开(公告)号：US06561725B1

公开(公告)日：2003-05-13

申请号：US09643011

申请日：2000-08-21

Applicant: Matthew D. Ellis ,  George D. Skidmore

Inventor： Matthew D. Ellis ,  George D. Skidmore

IPC: H01R16627

CPC classification number: B81C3/008 ,  B81B2201/13 ,  Y10T24/42 ,  Y10T24/45581 ,  Y10T403/60 ,  Y10T403/606

Abstract: A system and method which provide a general-purpose pressure-fitting receptacle (or “clamp”) suitable for coupling microcomponents are disclosed. A pressure-fitting receptacle is disclosed that is suitable for performing general assembly, including out-of-plane, 3-D assembly of microcomponents, wherein such microcomponents may be securely coupled together. That is, a pressure-fitting receptacle is disclosed which enables microcomponents to be coupled in a manner that constrains undesirable movement of the coupled components relative to each other. Preferably, such a receptacle may be pressure fit with a mating component (or a portion thereof) in a manner that constrains translational and rotational degrees of freedom of the mating component relative to the receptacle. A preferred embodiment provides a “preloaded” receptacle that may be utilized to perform general assembly of microcomponents. An alternative embodiment provides a non-preloaded receptacle suitable for performing general assembly of microcomponents. Still a further alternative embodiment provides an “expansion” receptacle that is suitable for performing general assembly of microcomponents. Such pressure-fitting receptacles may be implemented as an integrated part of a microcomponent, or they may be implemented as separate, stand-alone receptacles.

Abstract translation: 公开了一种提供适合于耦合微型部件的通用压力接头（或“夹具”）的系统和方法。 公开了一种适于执行总体组装的压力容器，包括微组件的平面外的3-D组装，其中这种微组件可以牢固地连接在一起。 也就是说，公开了一种压配合容器，其使得能够以限制耦合部件相对于彼此的不希望的运动的方式耦合微部件。 优选地，这样的容器可以以限制配合部件相对于容器的平移和旋转自由度的方式与配合部件（或其部分）压配合。 优选的实施例提供了一种可用于执行微型部件的总体组装的“预加载”插座。 一个替代实施例提供了一种非预加载的插座，其适于执行微型部件的总体组装。 另一个替代实施例提供了一种适于执行微型部件的总体组装的“扩展”插座。 这种压力插座可以实现为微型部件的一体部分，或者它们可以被实现为单独的独立插座。

公开(公告)号：US06806991B1

公开(公告)日：2004-10-19

申请号：US10219044

申请日：2002-08-14

Applicant: Neil Sarkar ,  Aaron Geisberger ,  Matthew D. Ellis

Inventor： Neil Sarkar ,  Aaron Geisberger ,  Matthew D. Ellis

IPC: G02B2600

CPC classification number: G01Q10/04 ,  G02B26/0841

Abstract: In one embodiment, the present invention is directed to a system that enables controllable positioning of a fully-released micro-stage. The fully-released micro-stage may be assembled onto a detector substrate that enables micro-positioning feedback. A payload structure (e.g., a lens, mirror, manipulator, and/or the like) may be assembled or coupled onto the fully-release microstage. Snap connectors may facilitate the mechanical coupling associated with assembly of the various components. The fully-released microstage may be actuated by motion amplified actuators that are coupled to anchored flexures. Moreover, the actuation of the fully-release microstage may produce fully decoupled movement by coupling the actuators and respective flexures to the stage in a mirrored fashion.

Abstract translation: 在一个实施例中，本发明涉及一种使得能够可控地定位完全释放的微型平台的系统。 完全释放的微型级可以组装到能够进行微定位反馈的检测器基板上。 有效载荷结构（例如，透镜，反射镜，操纵器和/或类似物）可以组装或耦合到完全释放的微步骤上。 卡扣连接器可以促进与各种部件的组装有关的机械联接。 完全释放的微步骤可以由耦合到锚定的挠曲件的运动放大致动器来致动。 此外，通过将致动器和相应的挠曲件以镜像的方式连接到平台，完全释放微型台架的致动可以产生完全解耦的运动。

公开(公告)号：US06837723B1

公开(公告)日：2005-01-04

申请号：US10154685

申请日：2002-05-24

Applicant: John N. Randall ,  Matthew D. Ellis

Inventor： John N. Randall ,  Matthew D. Ellis

IPC: H01R12/16 ,  H01R13/20 ,  H01R13/629

CPC classification number: H01R12/82 ,  H01R13/20 ,  H01R13/629

Abstract: A deflection element operating under control of selectively applied energy is used to achieve low insertion loss between mating elements. Once the elements are in proper relationship the deflection element is allowed to settle to its stable position thereby serving to lock the elements together.

Abstract translation: 在选择性施加的能量的控制下操作的偏转元件用于实现配合元件之间的低插入损耗。 一旦元件处于适当的关系中，偏转元件被允许沉降到其稳定位置，从而用于将元件锁定在一起。