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    Method and system for locally connecting microstructures and devices formed thereby
    2.
    发明申请
    Method and system for locally connecting microstructures and devices formed thereby 失效
    用于局部连接由此形成的微结构和器件的方法和系统

    公开(公告)号：US20030178403A1

    公开(公告)日：2003-09-25

    申请号：US10342906

    申请日：2003-01-15

    发明人： David F. Lemmerhirt ,  Kensall D. Wise

    IPC分类号： H05B003/00

    CPC分类号： B81C3/008 ,  B81B2201/13 ,  H01L24/83 ,  H01L24/86 ,  H01L2224/83234 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/13091 ,  H01L2924/3011 ,  H05K3/3421 ,  H01L2924/00

    摘要： A method and system for locally connecting microstructures and devices formed thereby are provided wherein localized solder-bonding creates bonds between pairs of microstructures found on miniature flexible cables and silicon microsystem platforms. Multi-lead contact to the pads are detected automatically, triggering an embedded heater or heaters to initiate solder melting. This approach enables delicate microstructures to be connected and disconnected from microsystem platforms in the field, and is implemented with a process that is compatible with monolithic integration of circuits.

    摘要翻译： 提供了一种用于局部连接由此形成的微观结构和器件的方法和系统，其中局部焊接在微型柔性电缆和硅微系统平台之间产生的微结构对之间形成结合。 自动检测到焊盘的多引脚接触，触发嵌入式加热器或加热器启动焊料熔化。 这种方法使精细的微结构与现场的微系统平台连接和断开，并且通过与电路的单片集成兼容的过程来实现。

    Micromachined fluidic coupler and method of making the same
    3.
    发明申请
    Micromachined fluidic coupler and method of making the same 失效
    微加工流体耦合器及其制造方法

    公开(公告)号：US20020180212A1

    公开(公告)日：2002-12-05

    申请号：US10198013

    申请日：2002-07-18

    发明人： Yu-Chong Tai ,  Shuyun Wu ,  Ellis Fan-Chuin Meng

    IPC分类号： F16L019/08 ,  F16L021/02

    CPC分类号： B81B1/00 ,  B81B2201/13

    摘要： The invention is a micromachined coupler for coupling a capillary having a first size to an orifice having a shape and a second size. The coupler has a body which has a shape conforming the shape of the cavity into which the body must fit. A through hole is defined through the body. The through hole has a size conforming to the first size of the capillary. The capillary is disposable into the through hole so that the capillary is communicated to the orifice without the first and second sizes necessarily being the same. The cavity and the body have conforming slanting surfaces, and in particular the cavity and the body define truncated pyramidal shapes. The cavity and the body each have a truncated square pyramidal shape, a truncated triangular pyramidal shape, or a truncated conical shape. The micromachined coupler may further include a tubing stopper defined in the through hole and/or a shoulder defined on a surface of the coupler for bonding to the substrate outside of the cavity. Typically the size of the orifice is different than the size of the capillary. The invention is also characterized as a method of fabricating a micromachined coupler either by micromaching or micromolding.

    摘要翻译： 本发明是用于将具有第一尺寸的毛细管与具有形状和第二尺寸的孔连接的微加工耦合器。 联接器具有本体必须配合的具有符合空腔形状的形状。 通孔穿过身体。 通孔的尺寸符合毛细管的第一尺寸。 毛细管一次性进入通孔，使得毛细管连通到孔口，而第一和第二尺寸必须相同。 空腔和主体具有一致的倾斜表面，特别是空腔和主体限定截锥形的形状。 空腔和主体各自具有截顶的方形金字塔形状，截头三角锥体形状或截头圆锥形状。 微加工耦合器还可以包括限定在通孔中的管塞和/或限定在耦合器的表面上的肩部，用于将结合到空腔外部的基板。 通常，孔口的尺寸不同于毛细管的尺寸。 本发明的特征还在于通过微机械加工或微型成型制造微机械加工器的方法。

    Self-Aligning Latch-up Mechanism in Out of Plane Silicon Microelectrode Arrays
    4.
    发明申请
    Self-Aligning Latch-up Mechanism in Out of Plane Silicon Microelectrode Arrays 审中-公开
    平面硅微​​电极阵列中的自对准闩锁机制

    公开(公告)号：US20100010601A1

    公开(公告)日：2010-01-14

    申请号：US12350113

    申请日：2009-01-07

    申请人： Sandeep Negi ,  Rajmohan Bhandari ,  Florian Solzbacher ,  Richard A. Normann

    发明人： Sandeep Negi ,  Rajmohan Bhandari ,  Florian Solzbacher ,  Richard A. Normann

    IPC分类号： A61N1/05 ,  H01L21/3205 ,  H01L21/304 ,  H01L21/306 ,  B32B43/00

    CPC分类号： A61N1/05 ,  A61B5/04001 ,  A61B5/685 ,  A61N1/0551 ,  A61N1/0558 ,  A61N1/37205 ,  B81B2201/13 ,  B81C3/008 ,  Y10T156/195

    摘要： The present invention provides microelectrode array stabilizing devices and associated methods. A microelectrode array stabilizing device includes a first microelectrode array substrate having a plurality of first microelectrodes configured to penetrate tissue. A plurality of first interlocking structures are coupled to the first microelectrode array substrate, with each of the plurality of first interlocking structures including a first interlocking mechanism at a distal end. The device may further include a second microelectrode array substrate which optionally has a plurality of second microelectrodes configured to penetrate tissue. A plurality of second interlocking structures are coupled to the second microelectrode array substrate, each of the plurality of second interlocking structures including a second interlocking mechanism at a distal end. The second interlocking mechanism is complimentary to the first interlocking mechanism. The first microelectrode array and the second microelectrode array are configured to self-align and couple together with the first interlocking mechanism secured to the second interlocking mechanism.

    摘要翻译： 本发明提供微电极阵列稳定装置及相关方法。 微电极阵列稳定装置包括具有构造成穿透组织的多个第一微电极的第一微电极阵列基板。 多个第一互锁结构联接到第一微电极阵列基板，多个第一互锁结构中的每一个包括位于远端的第一互锁机构。 该装置还可以包括第二微电极阵列衬底，其可选地具有构造成穿透组织的多个第二微电极。 多个第二互锁结构联接到第二微电极阵列基板，多个第二互锁结构中的每一个在远端包括第二互锁机构。 第二互锁机构与第一互锁机构互补。 第一微电极阵列和第二微电极阵列被配置为与固定到第二互锁机构的第一互锁机构自对准和耦合在一起。

    MEMS device assembly
    7.
    发明申请
    MEMS device assembly 审中-公开
    MEMS器件组装

    公开(公告)号：US20040163717A1

    公开(公告)日：2004-08-26

    申请号：US10371452

    申请日：2003-02-21

    申请人： Cookson Electronics, Inc.

    发明人： Kenneth B. Gilleo

    IPC分类号： G05D007/06

    CPC分类号： B81B7/0061 ,  B81B2201/058 ,  B81B2201/13 ,  Y10T137/86131

    摘要： An assembly of the present invention has a substrate and a first MEMS device adapted to be electrically and mechanically connected to the substrate. A first set of MEMS/substrate fluid transfer ports on the first MEMS device and on the substrate are adapted to mate with one another when the first MEMS device and substrate are connected to permit the transfer of fluid between the first MEMS device and the substrate.

    摘要翻译： 本发明的组件具有衬底和适于电性和机械连接到衬底的第一MEMS器件。 当第一MEMS器件和衬底被连接以允许第一MEMS器件和衬底之间的流体传输时，在第一MEMS器件和衬底上的第一组MEMS /衬底流体传输端口适于彼此配合。

    Isolated tungsten microelectromechanical structures
    10.
    发明授权
    Isolated tungsten microelectromechanical structures 失效
    隔离钨微机电结构

    公开(公告)号：US5399415A

    公开(公告)日：1995-03-21

    申请号：US71260

    申请日：1993-06-04

    申请人： Liang-Yu Chen ,  Noel C. MacDonald

    发明人： Liang-Yu Chen ,  Noel C. MacDonald

    IPC分类号： B81B3/00 ,  B81C99/00 ,  G01P15/08 ,  H02N1/00 ,  B32B9/00

    CPC分类号： B81C1/00214 ,  B81B3/0086 ,  G01P15/0802 ,  H02N1/006 ,  H02N1/008 ,  B81B2201/13 ,  B81B2203/0118 ,  B81B2203/0315 ,  G01P2015/0814 ,  Y10T428/24917 ,  Y10T428/24926

    摘要： A process for fabricating mechanically interconnected, released, electrically isolated metal microstructures, and circuit components and actuators produced by the process. A dielectric stack on a substrate is patterned and etched to produce trenches in which a metal such as tungsten is deposited. The dielectric is removed from selected regions of the metal to expose metal beams, and to form mechanically interconnecting, electrically insulating hinges supporting the beams. The beams and hinges are then released for relative motion. Electrical potentials may be established between adjacent beams to produce controlled motion.

    摘要翻译： 用于制造机械互连，释放，电隔离的金属微结构的工艺，以及由该工艺制造的电路部件和致动器。 图案化并蚀刻衬底上的电介质堆叠以产生其中沉积诸如钨的金属的沟槽。 电介质从金属的选定区域去除以暴露金属梁，并形成支撑梁的机械互连的电绝缘铰链。 然后释放梁和铰链以进行相对运动。 可以在相邻光束之间建立电势以产生受控的运动。