公开(公告)号：US12230879B2

公开(公告)日：2025-02-18

申请号：US17738787

申请日：2022-05-06

Applicant: Apple Inc.

Inventor： Xiaofang Mu ,  Chi V Pham ,  Mingjuan Zhu ,  Bo Tong Deng ,  Bo Zhang ,  Srinivasa Yasasvy Sateesh Bhamidipati ,  Vineet Nayak ,  Daniel C Kong

IPC: H05K1/02 ,  H01L23/498 ,  H01L23/552 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q1/52

Abstract: Techniques to reduce signal interference between wired signals communicated within an electronic device and wireless signals transmitted to or received from antennas of the electronic device are disclosed. The electronic device includes an interposer with an inner fence and an outer fence having offset gaps to prevent a pathway otherwise formed by overlapping tabs, where the pathway allows noise leakage from the wired signals. In some embodiments, the electronic device (e.g., in a main logic board package) includes a ground fencing of ground vias to prevent the noise leakage from harmonics associated with signal vias communicating the wired signals. The spacing between the ground vias is based on frequencies of signals that the ground vias are intended to block.

公开(公告)号：US20250016923A1

公开(公告)日：2025-01-09

申请号：US18774455

申请日：2024-07-16

Applicant: Apple Inc.

Inventor： Chi V. Pham ,  Xiaofang Mu

IPC: H05K1/11 ,  H01P3/08 ,  H05K1/02

Abstract: Devices are disclosed that include a wideband millimeter wave (mmW) via transition design for multilayer printed circuit boards (MLBs). In various instances embodiments, a via is dimensioned to provide impedance matching to stripline tracing connected at the end of the via. Impedance matching in the via may eliminate the need for an impedance matching section on the stripline tracing. In some instances, the dimensions of the via pad diameter and the via keepout diameter are selected to tune a via transition structure to selected frequencies and/or frequency bandwidths.

公开(公告)号：US20240297672A1

公开(公告)日：2024-09-05

申请号：US18658606

申请日：2024-05-08

Applicant: Apple Inc.

Inventor： Xiaofang Mu ,  Bo Zhang ,  Mingjuan Zhu ,  Chi V. Pham ,  Berke Cetinoneri ,  Timothy B. Ogilvie

IPC: H04B1/04 ,  H04B1/00 ,  H04B1/52

CPC classification number: H04B1/0483 ,  H04B1/0057 ,  H04B1/52 ,  H04B2001/0408

Abstract: Frequency-filtering circuitry is disclosed that rejects power of a wireless signal having an undesired frequency while causing a decreased power loss to a wireless signal having a desired frequency using distributed elements, rather than lumped elements. The frequency-filtering circuitry may reject at least 5 decibels of power of a wireless signal having a frequency over 32 gigahertz, while causing a power loss of at most 1.1 decibels to a wireless signal having a frequency lower than 29.5 gigahertz. The frequency-filtering circuitry may include a main branch, a first parallel branch coupled and parallel to the main branch via a first connecting trace, and a second parallel branch coupled and parallel to the main branch via a second connecting trace. The first connecting trace intersects the main branch and the first parallel branch, and the second connecting trace intersects the main branch and the second parallel branch.

公开(公告)号：US11784394B2

公开(公告)日：2023-10-10

申请号：US17544262

申请日：2021-12-07

Applicant: Apple Inc.

Inventor： Xiaofang Mu ,  Annie Manuja ,  Christopher D. Guichet ,  Erik G. de Jong ,  Jorge L. Rivera Espinoza ,  Patrick J. Crowley ,  Steven C. Roach ,  Venkatesh Rajendran ,  William C. Lukens ,  Woojin Jung ,  Yue Chen ,  Zhiwei Gu ,  Derek Iwamoto ,  Siddharth Nangia ,  Scott D. Morrison ,  Kevin A. Klenk ,  Neeloy Roy

IPC: H01Q1/24 ,  H01Q1/52 ,  H01Q9/04 ,  H01Q1/22

CPC classification number: H01Q1/24 ,  H01Q1/22 ,  H01Q1/2283 ,  H01Q1/52 ,  H01Q1/526 ,  H01Q9/04 ,  H01Q9/0457

Abstract: A wireless communication system may include an electronic device having a wireless communication module. The wireless communication module may include an antenna radiating element on a first surface, a ground ring surrounding the antenna radiating element on the first surface, and a radio component mounted to a second surface. The wireless communication module may be incorporated into a system package that also includes other components. Encapsulation material may cover the wireless communication module and other components. A shielding material may cover the encapsulation material and be coupled to the ground ring. An opening in the shielding material may be aligned with the antenna radiating element. If desired, the wireless communication system may include external equipment having a wireless communication module communicatively coupled to the wireless communication module to convey firmware testing, debugging, restore, and/or other data.