公开(公告)号：US12230879B2

公开(公告)日：2025-02-18

申请号：US17738787

申请日：2022-05-06

Applicant: Apple Inc.

Inventor： Xiaofang Mu ,  Chi V Pham ,  Mingjuan Zhu ,  Bo Tong Deng ,  Bo Zhang ,  Srinivasa Yasasvy Sateesh Bhamidipati ,  Vineet Nayak ,  Daniel C Kong

IPC: H05K1/02 ,  H01L23/498 ,  H01L23/552 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q1/52

Abstract: Techniques to reduce signal interference between wired signals communicated within an electronic device and wireless signals transmitted to or received from antennas of the electronic device are disclosed. The electronic device includes an interposer with an inner fence and an outer fence having offset gaps to prevent a pathway otherwise formed by overlapping tabs, where the pathway allows noise leakage from the wired signals. In some embodiments, the electronic device (e.g., in a main logic board package) includes a ground fencing of ground vias to prevent the noise leakage from harmonics associated with signal vias communicating the wired signals. The spacing between the ground vias is based on frequencies of signals that the ground vias are intended to block.

公开(公告)号：US20230361460A1

公开(公告)日：2023-11-09

申请号：US17738787

申请日：2022-05-06

Applicant: Apple Inc.

Inventor： Xiaofang Mu ,  Chi V Pham ,  Mingjuan Zhu ,  Bo Tong Deng ,  Bo Zhang ,  Srinivasa Yasasvy Sateesh Bhamidipati ,  Vineet Nayak ,  Daniel C Kong

IPC: H01Q1/52 ,  H01L23/552 ,  H01L23/498 ,  H01Q1/48 ,  H01Q1/22

CPC classification number: H01Q1/526 ,  H01L23/552 ,  H01L23/49827 ,  H01Q1/48 ,  H01Q1/2283 ,  H01L2223/6677

Abstract: Techniques to reduce signal interference between wired signals communicated within an electronic device and wireless signals transmitted to or received from antennas of the electronic device are disclosed. The electronic device includes an interposer with an inner fence and an outer fence having offset gaps to prevent a pathway otherwise formed by overlapping tabs, where the pathway allows noise leakage from the wired signals. In some embodiments, the electronic device (e.g., in a main logic board package) includes a ground fencing of ground vias to prevent the noise leakage from harmonics associated with signal vias communicating the wired signals. The spacing between the ground vias is based on frequencies of signals that the ground vias are intended to block.