公开(公告)号：US20230361460A1

公开(公告)日：2023-11-09

申请号：US17738787

申请日：2022-05-06

Applicant: Apple Inc.

Inventor： Xiaofang Mu ,  Chi V Pham ,  Mingjuan Zhu ,  Bo Tong Deng ,  Bo Zhang ,  Srinivasa Yasasvy Sateesh Bhamidipati ,  Vineet Nayak ,  Daniel C Kong

IPC: H01Q1/52 ,  H01L23/552 ,  H01L23/498 ,  H01Q1/48 ,  H01Q1/22

CPC classification number: H01Q1/526 ,  H01L23/552 ,  H01L23/49827 ,  H01Q1/48 ,  H01Q1/2283 ,  H01L2223/6677

Abstract: Techniques to reduce signal interference between wired signals communicated within an electronic device and wireless signals transmitted to or received from antennas of the electronic device are disclosed. The electronic device includes an interposer with an inner fence and an outer fence having offset gaps to prevent a pathway otherwise formed by overlapping tabs, where the pathway allows noise leakage from the wired signals. In some embodiments, the electronic device (e.g., in a main logic board package) includes a ground fencing of ground vias to prevent the noise leakage from harmonics associated with signal vias communicating the wired signals. The spacing between the ground vias is based on frequencies of signals that the ground vias are intended to block.

公开(公告)号：US20170062379A1

公开(公告)日：2017-03-02

申请号：US14836859

申请日：2015-08-26

Applicant: Apple Inc.

Inventor： Bo Zhang ,  Sang Ha Kim ,  Cyrus Y. Liu ,  Kuo-Hua Sung

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/32227 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2924/2075

Abstract: Anisotropic conductive film (ACF) structures and manufacturing methods for forming the same are described. The manufacturing methods include preventing clusters of conductive particles from forming between adjacent bonding pads and that are associated with electrical shorting of ACF structures. In some embodiments, the methods involve use of multiple layered ACF materials that include a non-electrically conductive layer that reduces the likelihood of formation of conductive particle clusters between bonding pads. In some embodiment, the methods include the use of ultraviolet sensitive ACF material combined with lithography techniques that eliminate conductive particles from between neighboring bonding pads. In some embodiments, the methods involve the use of insulation spacers that block conductive particles from entering between bonding pads. Any suitable combination of the described methods can be used.

Abstract translation: 描述各向异性导电膜（ACF）结构及其制造方法。 制造方法包括防止在相邻焊盘之间形成导电颗粒簇并且与ACF结构的电短路相关联。 在一些实施方案中，该方法涉及使用包含非导电层的多层ACF材料，其降低在接合焊盘之间形成导电颗粒簇的可能性。 在一些实施方案中，所述方法包括使用紫外线敏感的ACF材料与光刻技术相结合，从而消除相邻接合焊盘之间的导电颗粒。 在一些实施例中，该方法涉及使用阻挡导电颗粒进入接合焊盘之间的绝缘间隔物。 可以使用所述方法的任何合适的组合。

公开(公告)号：US12230879B2

公开(公告)日：2025-02-18

申请号：US17738787

申请日：2022-05-06

Applicant: Apple Inc.

Inventor： Xiaofang Mu ,  Chi V Pham ,  Mingjuan Zhu ,  Bo Tong Deng ,  Bo Zhang ,  Srinivasa Yasasvy Sateesh Bhamidipati ,  Vineet Nayak ,  Daniel C Kong

IPC: H05K1/02 ,  H01L23/498 ,  H01L23/552 ,  H01Q1/22 ,  H01Q1/48 ,  H01Q1/52

Abstract: Techniques to reduce signal interference between wired signals communicated within an electronic device and wireless signals transmitted to or received from antennas of the electronic device are disclosed. The electronic device includes an interposer with an inner fence and an outer fence having offset gaps to prevent a pathway otherwise formed by overlapping tabs, where the pathway allows noise leakage from the wired signals. In some embodiments, the electronic device (e.g., in a main logic board package) includes a ground fencing of ground vias to prevent the noise leakage from harmonics associated with signal vias communicating the wired signals. The spacing between the ground vias is based on frequencies of signals that the ground vias are intended to block.

公开(公告)号：US20240297672A1

公开(公告)日：2024-09-05

申请号：US18658606

申请日：2024-05-08

Applicant: Apple Inc.

Inventor： Xiaofang Mu ,  Bo Zhang ,  Mingjuan Zhu ,  Chi V. Pham ,  Berke Cetinoneri ,  Timothy B. Ogilvie

IPC: H04B1/04 ,  H04B1/00 ,  H04B1/52

CPC classification number: H04B1/0483 ,  H04B1/0057 ,  H04B1/52 ,  H04B2001/0408

Abstract: Frequency-filtering circuitry is disclosed that rejects power of a wireless signal having an undesired frequency while causing a decreased power loss to a wireless signal having a desired frequency using distributed elements, rather than lumped elements. The frequency-filtering circuitry may reject at least 5 decibels of power of a wireless signal having a frequency over 32 gigahertz, while causing a power loss of at most 1.1 decibels to a wireless signal having a frequency lower than 29.5 gigahertz. The frequency-filtering circuitry may include a main branch, a first parallel branch coupled and parallel to the main branch via a first connecting trace, and a second parallel branch coupled and parallel to the main branch via a second connecting trace. The first connecting trace intersects the main branch and the first parallel branch, and the second connecting trace intersects the main branch and the second parallel branch.

公开(公告)号：US12009849B2

公开(公告)日：2024-06-11

申请号：US17411892

申请日：2021-08-25

Applicant: Apple Inc.

Inventor： Xiaofang Mu ,  Bo Zhang ,  Mingjuan Zhu ,  Chi V. Pham ,  Berke Cetinoneri ,  Timothy B. Ogilvie

IPC: H04B1/04 ,  H04B1/00 ,  H04B1/52

CPC classification number: H04B1/0483 ,  H04B1/0057 ,  H04B1/52 ,  H04B2001/0408

Abstract: Frequency-filtering circuitry is disclosed that rejects power of a wireless signal having an undesired frequency while causing a decreased power loss to a wireless signal having a desired frequency using distributed elements, rather than lumped elements. The frequency-filtering circuitry may reject at least 5 decibels of power of a wireless signal having a frequency over 32 gigahertz, while causing a power loss of at most 1.1 decibels to a wireless signal having a frequency lower than 29.5 gigahertz. The frequency-filtering circuitry may include a main branch, a first parallel branch coupled and parallel to the main branch via a first connecting trace, and a second parallel branch coupled and parallel to the main branch via a second connecting trace. The first connecting trace intersects the main branch and the first parallel branch, and the second connecting trace intersects the main branch and the second parallel branch.

公开(公告)号：US20230064458A1

公开(公告)日：2023-03-02

申请号：US17411892

申请日：2021-08-25

Applicant: Apple Inc.

Inventor： Xiaofang Mu ,  Bo Zhang ,  Mingjuan Zhu ,  Chi V. Pham ,  Berke Cetinoneri ,  Timothy B. Ogilvie

IPC: H04B1/04 ,  H04B1/00 ,  H04B1/52

Abstract: Frequency-filtering circuitry is disclosed that rejects power of a wireless signal having an undesired frequency while causing a decreased power loss to a wireless signal having a desired frequency using distributed elements, rather than lumped elements. The frequency-filtering circuitry may reject at least 5 decibels of power of a wireless signal having a frequency over 32 gigahertz, while causing a power loss of at most 1.1 decibels to a wireless signal having a frequency lower than 29.5 gigahertz. The frequency-filtering circuitry may include a main branch, a first parallel branch coupled and parallel to the main branch via a first connecting trace, and a second parallel branch coupled and parallel to the main branch via a second connecting trace. The first connecting trace intersects the main branch and the first parallel branch, and the second connecting trace intersects the main branch and the second parallel branch.

公开(公告)号：US09653425B2

公开(公告)日：2017-05-16

申请号：US14836859

申请日：2015-08-26

Applicant: Apple Inc.

Inventor： Bo Zhang ,  Sang Ha Kim ,  Cyrus Y. Liu ,  Kuo-Hua Sung

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/00

CPC classification number: H01L24/83 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/32227 ,  H01L2224/83203 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2924/2075

Abstract: Anisotropic conductive film (ACF) structures and manufacturing methods for forming the same are described. The manufacturing methods include preventing clusters of conductive particles from forming between adjacent bonding pads and that are associated with electrical shorting of ACF structures. In some embodiments, the methods involve use of multiple layered ACF materials that include a non-electrically conductive layer that reduces the likelihood of formation of conductive particle clusters between bonding pads. In some embodiment, the methods include the use of ultraviolet sensitive ACF material combined with lithography techniques that eliminate conductive particles from between neighboring bonding pads. In some embodiments, the methods involve the use of insulation spacers that block conductive particles from entering between bonding pads. Any suitable combination of the described methods can be used.