公开(公告)号：US20220406749A1

公开(公告)日：2022-12-22

申请号：US17638703

申请日：2020-02-28

Applicant: BOE Technology Group Co., Ltd.

Inventor： Zhanfeng CAO ,  Jiushi WANG ,  Ke WANG ,  Guocai ZHANG ,  Junwei YAN ,  Yingwei LIU ,  Haitao HUANG ,  Guangcai YUAN

IPC: H01L23/00 ,  H01L33/62 ,  H01L25/075 ,  H01L25/16

Abstract: Disclosed are an electrical connection method for an electronic element, and a backlight module, a display panel, and a display apparatus which include an electronic element to which the electrical connection method is applied. The electrical connection method comprises: providing a driving back plane, wherein the driving back plane comprises multiple contact electrodes; forming an anti-oxidation protection film on the contact electrodes; coating a position of the anti-oxidation protection film corresponding to each contact electrode with a binding material; and transferring multiple electronic elements to the positions of the corresponding contact electrodes, binding each electronic element to the corresponding contact electrode, and removing the anti-oxidation protection film at the position of each contact electrode before completing the binding of each electronic element to the corresponding contact electrode.

公开(公告)号：US20220170173A1

公开(公告)日：2022-06-02

申请号：US17401167

申请日：2021-08-12

Applicant: BOE Technology Group Co., Ltd.

Inventor： Shihao DONG ,  Junwei YAN ,  Guocai ZHANG ,  Chengfei WANG ,  Shaodong SUN ,  Pengcheng DONG

IPC: C25D17/06 ,  H01R13/24 ,  C25D7/12

Abstract: A substrate carrier includes: a carrier body, wherein the carrier body includes at least one carrying surface, and a first conductive sheet is provided on the carrying surface; a cover plate, wherein the cover plate is a frame structure with a hollow interior, the cover plate is opposite to the carrying surface and is detachably fixed on the carrying surface, the shape of the frame structure matches the shape of a substrate to be coated, the cover plate includes an inner side surface facing the carrying surface, and a second conductive sheet is provided on the inner side surface; an elastic connector is provided between the first conductive sheet and the second conductive sheet, and when the substrate to be coated is fixed on the carrying surface, the second conductive sheet is respectively in electrical communication with the conductive film layer and the first conductive sheet via the elastic connector.

公开(公告)号：US20220097010A1

公开(公告)日：2022-03-31

申请号：US17409013

申请日：2021-08-23

Applicant: BOE Technology Group Co., Ltd.

Inventor： Shaodong SUN ,  Junwei YAN ,  Guangcai YUAN ,  Guocai ZHANG ,  Shihao DONG ,  Lilei ZHANG ,  Haoran GAO ,  Wenyue FU ,  Chengfei WANG ,  Xiaojie PAN

IPC: B01F15/00 ,  C25D21/14 ,  C25D21/04 ,  B01F3/12 ,  B01F15/02 ,  C25D3/38 ,  B01D45/04

Abstract: The present disclosure provides a gas-solid separation structure including: a feeding pipeline including a first feeding part, a second feeding part and a first valve disposed between the first and second feeding parts; a discharge pipeline having a first opening and a second opening opposite to each other, the second feeding part extending into the discharge pipeline via the first opening; wherein an exhaust channel is formed between the second feeding part and the discharge pipeline, exhaust holes are formed in a portion of the discharge pipeline opposite to the second feeding part, and the exhaust channel is in communication with the exhaust holes. The present disclosure further provides a feeding device and an electrochemical deposition apparatus. The present disclosure can improve the problem of interference with medicine powder release caused by gases entering the discharge pipeline.