DEBRIS CLEANING DEVICE AND ELECTROPLATING SYSTEM

    公开(公告)号:US20220098752A1

    公开(公告)日:2022-03-31

    申请号:US17398980

    申请日:2021-08-10

    Abstract: A debris cleaning device includes: a process treatment tank for containing a liquid medicine and a substrate to be treated, wherein the bottom of the tank body of the process treatment tank is provided with a liquid medicine discharge port, and the side wall of the tank body of the process treatment tank is provided with a liquid medicine inlet port; and a self-circulation debris removal system, the self-circulation debris removal system comprising a circulation pipeline communicating between the liquid medicine discharge port and the liquid medicine inlet port, the circulation pipeline being provided with a control valve for controlling the on-off state of the circulation pipeline, a debris filtering and collecting device for filtering the debris in the circulation pipeline, and a power pump for providing circulation driving force for the liquid medicine in the circulation pipeline.

    SUBSTRATE CARRIER AND ELECTROCHEMICAL DEPOSITION SYSTEM

    公开(公告)号:US20220170173A1

    公开(公告)日:2022-06-02

    申请号:US17401167

    申请日:2021-08-12

    Abstract: A substrate carrier includes: a carrier body, wherein the carrier body includes at least one carrying surface, and a first conductive sheet is provided on the carrying surface; a cover plate, wherein the cover plate is a frame structure with a hollow interior, the cover plate is opposite to the carrying surface and is detachably fixed on the carrying surface, the shape of the frame structure matches the shape of a substrate to be coated, the cover plate includes an inner side surface facing the carrying surface, and a second conductive sheet is provided on the inner side surface; an elastic connector is provided between the first conductive sheet and the second conductive sheet, and when the substrate to be coated is fixed on the carrying surface, the second conductive sheet is respectively in electrical communication with the conductive film layer and the first conductive sheet via the elastic connector.

    FILLING DEVICE AND APPARATUS, ELECTROCHEMICAL DEPOSITION SYSTEM AND FILLING METHOD

    公开(公告)号:US20220290321A1

    公开(公告)日:2022-09-15

    申请号:US17514971

    申请日:2021-10-29

    Abstract: The present disclosure relates to a filling device and apparatus, an electrochemical deposition system, and a filling method. The filling device includes: a feeding structure including a first feed port and a first discharge port; a container including a second feed port and a second discharge port; a weighing means disposed on the container; a conveying structure disposed between the first discharge port and the second feed port, the second feed port being in communication with the first discharge port via the conveying structure, and the conveying structure being configured to convey a material output from the first discharge port to the second feed port; and a control structure connected to the weighing means and the conveying structure, respectively, and configured to control a conveying speed of the conveying structure according to the weight detected by the weighing means.

    SUBSTRATE TRANSFER DEVICE
    8.
    发明申请

    公开(公告)号:US20220168888A1

    公开(公告)日:2022-06-02

    申请号:US17516269

    申请日:2021-11-01

    Abstract: The present application relates to a substrate transfer device, comprising a horizontally arranged cross beam, and support beams longitudinally arranged at two ends of the cross beam, wherein a substrate carrier is suspended on the cross beam, the substrate carrier is located between the two support beams, and the substrate carrier is parallel to a plane where the two support beams are located, the substrate carrier comprises two side walls oppositely arranged in a horizontal direction, and each of the support beams is provided with an auxiliary clamping structure for clamping the substrate carrier during transferring of the substrate carrier.

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