公开(公告)号：US20160293642A1

公开(公告)日：2016-10-06

申请号：US15070265

申请日：2016-03-15

Applicant: BOE Technology Group Co., Ltd. ,  Beijing BOE Optoelectronics Technology Co., Ltd.

Inventor： Pengju Zhang ,  Zhilong Peng ,  Hao Wang ,  Mengxiao Pan ,  Huanping Liu

IPC: H01L27/12 ,  H01L29/417 ,  H01L29/423 ,  H01L23/522

CPC classification number: H01L29/42384 ,  H01L27/0251 ,  H01L27/124 ,  H01L27/1259 ,  H01L29/41733

Abstract: A method of manufacturing the TFT array substrate includes steps of: forming a first electrically conductive layer on the substrate, the first electrically conductive layer including a first electrically conductive pattern and a first signal line connected electrically to the first electrically conductive pattern located in a pixel region, and a first lead wire connected electrically to the first signal line; forming an insulation layer on the substrate formed with the first electrically conductive layer, the insulation layer including a first via-hole through which the first lead wire is exposed; and forming a second electrically conductive film on the substrate formed with the insulation layer, the second electrically conductive film being connected electrically to the first lead wire through the first via-hole in the insulation layer.

Abstract translation: 制造TFT阵列基板的方法包括以下步骤：在基板上形成第一导电层，第一导电层包括第一导电图案和与位于像素中的第一导电图案电连接的第一信号线 和与第一信号线电连接的第一引线; 在形成有所述第一导电层的所述基板上形成绝缘层，所述绝缘层包括第一导电孔暴露的第一通孔; 以及在形成有所述绝缘层的所述基板上形成第二导电膜，所述第二导电膜通过所述绝缘层中的所述第一通孔与所述第一引线电连接。

公开(公告)号：US11986249B2

公开(公告)日：2024-05-21

申请号：US17433219

申请日：2021-02-08

Applicant: BOE Technology Group Co., Ltd.

Inventor： Hao Wang

IPC: A61B34/10 ,  A61B6/00 ,  A61B6/50 ,  G06T7/00 ,  G06T7/73 ,  G16H30/40 ,  G16H50/20

CPC classification number: A61B34/10 ,  A61B6/4441 ,  A61B6/505 ,  G06T7/0012 ,  G06T7/73 ,  G06T7/97 ,  G16H30/40 ,  G16H50/20 ,  G06T2207/10116 ,  G06T2207/30008

Abstract: Provided are a computer-aided method and apparatus for fracture reduction, and an electronic device. The method includes: acquiring an anteroposterior image and a lateral image of a fracture site in process 101, wherein the anteroposterior image includes an anteroposterior image of a first bone (22) and an anteroposterior image of a second bone (24), and the lateral image includes a lateral image of the first bone (22) and a lateral image of the second bone (24); determining a vector of an axis of the first bone (22) in space based on the anteroposterior image of the first bone (22) and the lateral image of the first bone (22), and determining a vector of an axis of the second bone (24) in space based on the anteroposterior image of the second bone (24) and the lateral image of the second bone (24) in process 102; and determining an included angle between the first bone and the second bone in the spatial coordinate system based on the vector of the axis (222) of the first bone (22) in space and the vector of the axis (242) of the second bone (24) in space in process 103.

公开(公告)号：US10280502B2

公开(公告)日：2019-05-07

申请号：US15191622

申请日：2016-06-24

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Dejiang Zhao ,  Hao Wang

IPC: C23C16/00 ,  C23C14/24

Abstract: A crucible structure including a crucible body and a crucible cover. The crucible body includes a crucible bottom wall and a crucible side wall. One end of the crucible side wall is connected to the crucible bottom wall, and the other end of the crucible side wall is provided with the crucible cover. An included angle between the crucible cover and an axial direction of the crucible is an acute angle. The crucible cover is provided with an opening structure.

公开(公告)号：US09874673B2

公开(公告)日：2018-01-23

申请号：US14785762

申请日：2015-03-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Lin Zhu ,  Yanbing Wu ,  Hao Wang

IPC: G02F1/1335 ,  F21V8/00

CPC classification number: G02B6/0021 ,  G02B6/003 ,  G02B6/0055 ,  G02B6/0068

Abstract: Embodiments of the disclosure provide a backlight module and display device. The backlight module comprises: a light guide plate (1), a PCB substrate (2) disposed at a side of the light guide plate (1); wherein a side of the PCB substrate (2) facing the light guide plate (1) is provided with a plurality of groups of light source devices (3); a side of the light guide plate (1) facing the PCB substrate (2) is provided with a plurality of recesses for accommodating the light source devices; a plurality of projections (111) disposed on an inner surface of the recess (11).

公开(公告)号：US20160238315A1

公开(公告)日：2016-08-18

申请号：US14741611

申请日：2015-06-17

Applicant: BOE Technology Group Co., Ltd.

Inventor： Hao Wang

IPC: F26B5/04

CPC classification number: F26B5/042 ,  F26B5/04 ,  F26B11/049 ,  F26B17/128 ,  F26B25/08 ,  H01L21/67034 ,  H01L21/67051 ,  H01L2224/75102

Abstract: An embodiment of the present invention provides a vacuum drying apparatus and a vacuum drying method. The vacuum drying apparatus includes a chamber in which a substrate table is arranged, the chamber being provided with a wind deflector therein, wherein the wind deflector comprises a top opening, a bottom opening and a body part connecting the top opening with the bottom opening. During the vacuum drying, the bottom opening is in tight contact with a surface of the substrate table, and there is a gap between the top Opening and the top of the chamber and a material on the substrate table is covered by the wind deflector.

Abstract translation: 本发明的一个实施例提供一种真空干燥装置和真空干燥方法。 所述真空干燥装置包括：室，其中布置有基板台，所述室在其中设置有导流器，其中所述导流器包括顶部开口，底部开口和连接所述顶部开口与所述底部开口的主体部分。 在真空干燥期间，底部开口与衬底台的表面紧密接触，并且在顶部开口和顶部之间存在间隙，衬底台上的材料被挡风板覆盖。