Electronic Device Substrate, Manufacturing Method Thereof, and Electronic Device

    公开(公告)号:US20210408078A1

    公开(公告)日:2021-12-30

    申请号:US16959398

    申请日:2019-08-27

    Abstract: An electronic device substrate, a manufacturing method thereof, and an electronic device are provided. The electronic device substrate includes a base substrate, a first insulating layer, and light-emitting sub-units, a first conductive member and a second conductive member, which are on a side of the first insulating layer away from the base substrate. The light-emitting sub-units and the first conductive member are respectively in array region and periphery region, and the second conductive member is between the first conductive member and the array region; orthogonal projections of the first and second conductive members on the base substrate are spaced apart; each light-emitting sub-unit includes first and second driving electrodes, second driving electrodes of the light-emitting sub-units are integrated to form a first common electrode layer; the periphery region further includes a second common electrode layer electrically connected to the first conductive member and the first common electrode layer.

    Curved display panel and curved display device

    公开(公告)号:US10656473B2

    公开(公告)日:2020-05-19

    申请号:US15995659

    申请日:2018-06-01

    Abstract: A curved display panel includes a first substrate and a second substrate cell-assembled to each other, a spacer layer disposed between the first substrate and the second substrate and configured to support the first substrate and the second substrate so as to form a gap, and a liquid crystal layer disposed in the gap, wherein the spacer layer includes a plurality of spacer groups, each of the plurality of spacer groups includes a first spacer provided on the first substrate and a second spacer provided on the second substrate, the plurality of spacer groups have supporting area on the first substrate as same as supporting area on the second substrate. A curved display device is further provided.

    COA substrate and manufacturing method thereof as well as display device

    公开(公告)号:US10585317B2

    公开(公告)日:2020-03-10

    申请号:US15822694

    申请日:2017-11-27

    Abstract: The present disclosure relates to a COA substrate and a manufacturing method thereof, a display device. The COA substrate includes the following layers in a wiring region: a first conduction layer including a signal wire lead; an insulation layer having a first via to expose the signal wire lead; a second conduction layer including a first metal pattern with a second via; a flat layer having a hollowed-out region; and a connection pattern. The second via is at least in part located within the hollowed-out region, and orthographic projections of a border of a portion of the second via which is located within the hollowed-out region and a border of the first via on the base substrate overlap. The connection pattern extends through the first via and the second via and connects to the signal wire lead.

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