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    PIXEL CIRCUIT, ITS DRIVING METHOD, OLED DISPLAY PANEL AND OLED DISPLAY DEVICE
    11.
    发明申请
    PIXEL CIRCUIT, ITS DRIVING METHOD, OLED DISPLAY PANEL AND OLED DISPLAY DEVICE 有权
    像素电路，其驱动方法，OLED显示面板和OLED显示装置

    公开(公告)号：US20160253953A1

    公开(公告)日：2016-09-01

    申请号：US14646258

    申请日：2014-09-30

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Fei YANG ,  Chen ZHANG ,  Yue WU

    IPC: G09G3/3208 ,  G09G3/20

    CPC classification number: G09G3/3208 ,  G09G3/2074 ,  G09G3/3233 ,  G09G2300/0852 ,  G09G2320/045

    Abstract: The present disclosure provides a pixel circuit, its driving method, an OLED display panel and an OLED display device. The pixel circuit includes row pixel units each including subpixel units. The row pixel unit includes an auxiliary compensating circuit, which is configured to generate a switching control signal inputted to a subpixel driving circuit according to a scanning signal from a gate driving circuit, and generate a compensating control signal inputted to the subpixel driving circuit according to a control signal from the gate driving circuit. The subpixel driving circuit is configured to receive a data voltage from a data line accordance to the switching control signal, control a driving transistor to drive an OLED to emit light according to the data voltage, and compensate for a threshold voltage of the driving transistor according to the compensating control signal when the driving transistor drives the OLED to emit light.

    Abstract translation: 本公开提供了像素电路，其驱动方法，OLED显示面板和OLED显示装置。 像素电路包括各自包括子像素单元的行像素单元。 行像素单元包括辅助补偿电路，其被配置为根据来自栅极驱动电路的扫描信号生成输入到子像素驱动电路的切换控制信号，并且根据来自栅极驱动电路的扫描信号生成输入到子像素驱动电路的补偿控制信号 来自栅极驱动电路的控制信号。 子像素驱动电路被配置为根据开关控制信号从数据线接收数据电压，控制驱动晶体管以根据数据电压驱动OLED发光，并且根据数据电压补偿驱动晶体管的阈值电压， 到驱动晶体管驱动OLED发光时的补偿控制信号。

    SUPPORT DEVICE, DISPLAY DEVICE
    12.
    发明申请
    SUPPORT DEVICE, DISPLAY DEVICE 有权
    支持设备，显示设备

    公开(公告)号：US20160178113A1

    公开(公告)日：2016-06-23

    申请号：US14436226

    申请日：2014-09-26

    Applicant: BOE Technology Group Co., Ltd.

    Inventor： Zifeng WANG ,  Yan REN ,  Yue WU

    IPC: F16M11/22 ,  H05K5/00

    CPC classification number: F16M11/22 ,  F16M11/16 ,  H05K5/0017

    Abstract: A support device (01) comprises a base (10) and at least one support member (20) disposed on an upper surface of the base (10), the support member (20) each at least comprises a support portion (210) contacting a back shell to be supported. The support portion (210) comprises: a contact surface (211) facing the back shell; the contact surface (211) comprising a first subarea (211a) parallel with a plane where the back shell is located and a second subarea (211b) which intersects a side, away from the upper surface, of the first subarea (211a), and the second subarea (211b) being angled in a direction away from the plane where the back shell is located; and a first retainer portion (212) disposed at a position where the first subarea (211a) intersects the second subarea (211b), and a second retainer portion (213) disposed at the second subarea (211b). The support device (01) may reduce the forward/downward inner stress of the back shell per se and improve the stability and strength of the overall structure of the back shell.

    Abstract translation: 支撑装置（01）包括基部（10）和设置在基部（10）的上表面上的至少一个支撑构件（20），所述支撑构件（20）至少包括支撑部分（210） 一个后壳被支撑。 支撑部分（210）包括：面向后壳的接触表面（211）; 所述接触表面（211）包括与所述后壳所在的平面平行的第一子区域（211a）和与所述第一子区域（211a）的远离所述上表面的一侧相交的第二子区域（211b），以及 所述第二子区域（211b）在远离所述背壳所在的平面的方向成角度; 以及设置在第一子区域（211a）与第二子区域（211b）相交的位置处的第一保持器部分（212）和设置在第二子区域（211b）处的第二保持器部分。 支撑装置（01）可以减小后壳本身的向前/向下内应力，并提高后壳整体结构的稳定性和强度。

    Heat Sinking Pad and Printed Circuit Board
    14.
    发明申请
    Heat Sinking Pad and Printed Circuit Board 有权
    散热垫和印刷电路板

    公开(公告)号：US20150351284A1

    公开(公告)日：2015-12-03

    申请号：US14442171

    申请日：2014-09-26

    Applicant: BOE TECHNOLOGY GROUP CO., LTD.

    Inventor： Yue WU ,  Hongjun XIE ,  Yan REN ,  Zifeng WANG

    IPC: H05K7/20 ,  H05K1/02

    CPC classification number: H05K7/20509 ,  H05K1/0203 ,  H05K1/0206 ,  H05K1/0209 ,  H05K2201/09663 ,  H05K2201/10969

    Abstract: The present invention relates to a heat sinking pad and a printed circuit board. The surface of the heat sinking pad on which electronic components are placed comprises a solder loading area and a solder non-loading area, wherein the solder loading area is used for being coated with solder; and the solder non-loading area comprises heat collection passages for collecting heat on the heat sinking pad and heat dissipation passages communicated with the heat collection passages. Openings of the heat dissipation passages are positioned at edges of the heat sinking pad so as to discharge the heat collected by the heat collection passages to the outside of the heat sinking pad. The heat dissipation to the edges of the heat sinking pad along the heat collection passages and the heat dissipation passages is faster than along the solder loading area, so the heat sinking pad has higher heat dissipation speed.

    Abstract translation: 本发明涉及散热垫和印刷电路板。 放置电子部件的散热垫的表面包括焊料加载区域和焊料非加载区域，其中焊料加载区域用于涂覆焊料; 并且无焊接区域包括用于在散热垫上收集热量的热收集通道和与集热通道连通的散热通道。 散热通道的开口位于散热垫的边缘处，以将由热量收集通道收集的热量排出到散热垫的外部。 散热垫沿着集热通道和散热通道的边缘的散热比沿着焊料加载区域的散热更快，所以散热垫具有较高的散热速度。

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