OPTICAL STRUCTURE AND METHOD FOR MANUFACTURING OPTICAL STRUCTURE

    公开(公告)号:US20240402484A1

    公开(公告)日:2024-12-05

    申请号:US18262265

    申请日:2022-07-25

    Inventor: Jian ZHOU

    Abstract: The disclosure relates to an optical structure and a method for manufacturing an optical structure. The optical structure includes: a substrate layer; a first isolation layer on the substrate layer and having a first opening on a side away from the substrate layer; a second isolation layer on the first isolation layer and having a second opening on a side away from the substrate layer, wherein a projection of the first opening on the substrate layer overlaps at least partially with a projection of the second opening on the substrate layer, and wherein a ratio of a refractive index of the first isolation layer to a refractive index of the second isolation layer is in a range of 0.95 and 1.05; and a first conductive portion in the second isolation layer and filling at least the second opening.

    Antenna and Antenna System
    12.
    发明公开

    公开(公告)号:US20240079783A1

    公开(公告)日:2024-03-07

    申请号:US18273787

    申请日:2022-07-01

    CPC classification number: H01Q9/0407 H04B1/40

    Abstract: An antenna and an antenna system. The antenna includes: a first dielectric layer (1) having a first surface and a second surface, which are arranged opposite each other in a thickness direction thereof; a radiation patch (2), which is arranged on the first surface of the first dielectric layer; and a first electrode layer (3), which is arranged on the second surface of the first dielectric layer, and at least partially overlaps with the orthographic projection of the radiation patch on the second surface, wherein the first electrode layer has inner recesses (31, 32), and openings of the inner recesses face the radiation patch. The orthographic projection of at least part of a radiation edge of the radiation patch on the first dielectric layer at least partially overlaps with the orthographic projections of the inner recesses on the first surface.

    ANTENNA AND METHOD FOR MANUFACTURING THE SAME, AND ANTENNA SYSTEM

    公开(公告)号:US20240047878A1

    公开(公告)日:2024-02-08

    申请号:US17637546

    申请日:2021-04-29

    CPC classification number: H01Q9/0407 H01Q1/38 H01Q1/48

    Abstract: The present disclosure provides an antenna, a method for manufacturing an antenna and an antenna system. The antenna according to the present disclosure includes: a dielectric layer having a first surface and a second surface which are oppositely disposed along a thickness direction of the dielectric layer; a radiation patch disposed on the first surface of the dielectric layer; and a reference electrode layer disposed on the second surface of the dielectric layer and having an orthographic projection on the second surface at least partially overlapping an orthographic projection of the radiation patch on the second surface. The reference electrode layer has an opening penetrating therethrough along a thickness direction of the reference electrode layer, and an orthographic projection of at least a part of a radiation edge of the radiation patch on the first surface is located within an orthographic projection of the opening on the first surface.

    METHOD FOR MANUFACTURING CONDUCTIVE MESH, THIN FILM SENSOR AND METHOD FOR MANUFACTURING THE SAME

    公开(公告)号:US20240241610A1

    公开(公告)日:2024-07-18

    申请号:US18016707

    申请日:2022-02-28

    CPC classification number: G06F3/0446 G06F2203/04103 G06F2203/04112

    Abstract: The present disclosure provides a method for manufacturing a conductive mesh, a thin film sensor and a method for manufacturing the thin film sensor. The method for manufacturing the conductive mesh includes: providing a dielectric substrate; forming a first pattern layer having a first trench portion in a mesh shape on the dielectric substrate; forming a first dielectric layer formed with a second trench portion in a mesh shape on a side of the first pattern layer away from the dielectric substrate, one of the first dielectric layer and the first pattern layer is made of an organic material, and the other of the first dielectric layer and the first pattern layer is made of an inorganic material; forming a conductive material in the second trench portion on a side of the first dielectric layer away from the dielectric substrate so as to form a conductive mesh.

    CUTTING PLATFORM AND CUTTING EQUIPMENT

    公开(公告)号:US20210001457A1

    公开(公告)日:2021-01-07

    申请号:US16908823

    申请日:2020-06-23

    Abstract: The present application relates to the field of cutting technology, specifically, to a cutting platform and cutting equipment. The cutting platform may include a first bonding surface, a second bonding surface, and a cutting groove. The second bonding surface is opposite to the first bonding surface, and is used for bonding with a piece to be cut. The cutting groove penetrates the first bonding surface and the second bonding surface, and corresponds to the cutting path of a cutting device, and the cutting groove includes a first groove wall surface and second groove wall surface opposite to each other. A distance between the first groove wall surface and the second groove wall surface increases in a direction from the second bonding surface to the first bonding surface. The solution of the present application can improve product quality and equipment production efficiency.

Patent Agency Ranking