公开(公告)号：US20190207160A1

公开(公告)日：2019-07-04

申请号：US16333059

申请日：2018-08-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Dawei WANG ,  Song ZHANG

IPC: H01L51/52 ,  H01L51/56

Abstract: The present disclosure provides an OLED display motherboard and a method for manufacturing the same, a method for manufacturing the OLED display panel, and an OLED display device thereof. The OLED display motherboard includes a base substrate having a display region and a non-display region surrounding the display region, a TFT and an OLED device located within the display region of the base substrate, at least two crack stop slits located within the non-display region of the base substrate, an extending direction of the crack stop slit being the same as an extending direction of an edge of the display region of the base substrate, and adjacent crack stop slits being separated by a crack stop slit step, and an encapsulation layer covering the crack stop slit and the OLED device. A portion of the encapsulation layer has a non-uniform thickness.

公开(公告)号：US20170214001A1

公开(公告)日：2017-07-27

申请号：US15321518

申请日：2016-03-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Tao WANG ,  Tao SUN ,  Song ZHANG

IPC: H01L51/52

CPC classification number: H01L51/5259 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5253

Abstract: The present disclosure discloses an organic light emitting diode substrate, comprising: a base substrate and a device layer formed in a middle part thereon, a region on the base substrate other than the device layer being divided into an inner ring region that surrounds the device layer and an outer ring region outside the inner ring region; a first adhesive layer adhered on the device layer and the inner ring region and covering the device layer and the inner ring region, the first adhesive layer being used to block moisture and oxygen for the device layer; a second adhesive frame adhered on the outer ring region and the first adhesive layer and covering a portion of the first adhesive layer over the inner ring region, the second adhesive frame having a higher adhesive strength than the first adhesive layer.

公开(公告)号：US20170090280A1

公开(公告)日：2017-03-30

申请号：US14894147

申请日：2015-07-20

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Seiji FUJINO ,  Song ZHANG ,  Tao WANG ,  Jing GAO ,  Xiaobo DU

IPC: G03F1/76 ,  G03F7/20 ,  G03F1/38

CPC classification number: G03F1/76 ,  G03F1/38 ,  G03F1/50 ,  G03F7/70058 ,  H01L27/1288

Abstract: The present disclosure provides a mask plate, a mask exposure device and a mask exposure method, belongs to the field of display technology. The mask plate includes a tray with at least one mask locating slot, and a mask is arranged in each mask locating slot. By the mask plate, the mask exposure device and the mask exposure method provided by the present disclosure, an effective mask with a closed-loop shaped opening may be provided, thereby improving a quality of a film formed on a substrate.

公开(公告)号：US20240015997A1

公开(公告)日：2024-01-11

申请号：US18371323

申请日：2023-09-21

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Youwei WANG ,  Song ZHANG ,  Peng CAI

IPC: H10K59/80 ,  H10K71/00

CPC classification number: H10K59/873 ,  H10K71/00

Abstract: Provided are a display substrate, a method for manufacturing the display substrate, and a display device. The display substrate has a display area, an opening area being provided in the display area, and the display substrate includes: a base substrate; at least one isolation structure provided on the base substrate and surrounding the opening area, and the isolation structure includes a first sidewall; a first filling structure provided on a side of the first sidewall away from the opening area, the first filling structure includes a second sidewall facing the first sidewall and a third sidewall facing away from the first sidewall; a first inorganic thin film disposed between the isolation structure and the filling structure; and a second inorganic thin film covering the isolation structure and the first filling structure.

公开(公告)号：US20230189627A1

公开(公告)日：2023-06-15

申请号：US17429609

申请日：2021-01-06

Applicant: BOE Technology Group Co., Ltd.

Inventor： Chengjie QIN ,  Fangxu CAO ,  Tao WANG ,  Tao SUN ,  Song ZHANG

IPC: H10K77/10 ,  H10K59/122 ,  H10K59/80

CPC classification number: H10K77/111 ,  H10K59/122 ,  H10K59/873 ,  H10K2102/311

Abstract: The present disclosure provides a display panel, a display device and a method for manufacturing a display panel. The display panel includes: a base, wherein the base includes a plurality of island regions and at least one perforated region, and the perforated region has an opening that penetrate through the base; and pixel units disposed in the island regions and an elastic filling layer disposed in each of the at least one perforated region.

公开(公告)号：US20230157136A1

公开(公告)日：2023-05-18

申请号：US17995383

申请日：2021-10-11

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Chunyan XIE ,  Song ZHANG ,  Penghao GU ,  Ziang HAN

IPC: H10K59/80 ,  H10K59/124 ,  H10K59/12

CPC classification number: H10K59/8731 ,  H10K59/124 ,  H10K59/1201 ,  H10K2102/311

Abstract: The present disclosure provides a display panel, a display device, and a manufacturing method. The display panel includes: a substrate including a display area and a non-display area and having a first groove in the non-display area; a driver circuit layer on a side of the display area of the substrate; a display function layer on a side of the driving circuit layer away from the substrate; an encapsulation layer on a side of the display function layer away from the driver circuit layer, the encapsulation layer including an inorganic encapsulation layer extending to the non-display area, and a part of the inorganic encapsulation layer being in the first groove; and a dam on the non-display area, an orthographic projection of the dam on the substrate being between the first groove and the display area, and the dam being covered by the inorganic encapsulation layer.

公开(公告)号：US20220037611A1

公开(公告)日：2022-02-03

申请号：US17501004

申请日：2021-10-14

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Tao WANG ,  Song ZHANG

IPC: H01L51/52 ,  H01L51/56

Abstract: The present disclosure discloses an OLED package structure, a display panel and a method for preparing a package structure. The OLED package structure includes a substrate, an OLED disposed on the substrate, and a reinforcement hole disposed on at least one of the substrate and the OLED and extending along a side of the OLED towards the substrate; and an encapsulation layer covering the OLED, and at least a portion of the encapsulation layer extending into the reinforcement hole. Therefore, the reliability of the package structure can be increased, the adhesive strength of the package layer can be increased, peeling or package failure can be prevented, and the service life of the package structure can be improved.

公开(公告)号：US20200035944A1

公开(公告)日：2020-01-30

申请号：US16414224

申请日：2019-05-16

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Tao WANG ,  Ziyu ZHANG ,  Song ZHANG

IPC: H01L51/52 ,  H01L27/32 ,  H01L51/00

Abstract: The present disclosure provides a substrate, a display panel and a display device. The substrate includes a body provided with an opening, and guiding protrusions arranged on the body at a position adjacent to the opening.

公开(公告)号：US20200020752A1

公开(公告)日：2020-01-16

申请号：US16335567

申请日：2018-08-30

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Ling SHI ,  Song ZHANG ,  Li WANG

IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

Abstract: An organic electroluminescent display substrate including: a substrate; a display region; a transitional region; a packing film that extends from the display region to the transitional region; and a through hole. The display region includes an insulating layer on the substrate with an organic electroluminescent component thereon. The transitional region includes: a recessed portion and a redundant layer on the substrate and in the recessed portion. An opening size of one side of at least one part of the recessed portion away from the substrate is not greater than an opening size of another side of the at least one part of the recessed portion adjacent the substrate. The packing film covers the organic electroluminescent component and at least one part of the recessed portion. The through hole extends through the packing film, the redundant layer and the substrate in a region where the recessed portion is located.

公开(公告)号：US20190326529A1

公开(公告)日：2019-10-24

申请号：US16212754

申请日：2018-12-07

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Chunyan XIE ,  Paoming TSAI ,  Song ZHANG

IPC: H01L51/00 ,  H01L51/56

Abstract: The present disclosure provides a display motherboard and a method for manufacturing the same, a display substrate and a method for manufacturing the same, and a display device, and belongs to the field of display technology. In the method for manufacturing the display motherboard of the present disclosure, the display motherboard includes a plurality of display substrate areas each including a sub display area and a sub bending area; and the method for manufacturing the display motherboard includes: forming an adhesive force variable back film material having a first adhesive force on a flexible underlying substrate; removing the back film material in positions above the sub bending areas; and treating the remaining back film material to form a back film having a second adhesive force, wherein the second adhesive force is greater than the first adhesive force.