公开(公告)号：US20230205721A1

公开(公告)日：2023-06-29

申请号：US18145013

申请日：2022-12-21

Applicant: BEIJING TUSEN ZHITU TECHNOLOGY CO., LTD.

Inventor： Yu ZHANG ,  Jianan HAO

IPC: G06F13/42

CPC classification number: G06F13/4221 ,  G06F2213/0026

Abstract: The present disclosure provides a data distribution device, a computing system and a data distribution method. The data distribution device comprises: a plurality of interfaces at least comprising a first interface, a second interface and a third interface, wherein the first interface is configured for receiving first data comprising sensor data, the second interface is configured for outputting the first data, and the third interface is configured for communicating with a first computing unit; and a data transmission unit configured for providing the sensor data from the first interface to the second interface and providing a subset of the sensor data meeting a predetermined condition to the third interface. According to the above technical solution, efficiency and flexibility of data processing can be improved by utilizing the plurality of interfaces and the data transmission unit of the data distribution device.

公开(公告)号：US20220256741A1

公开(公告)日：2022-08-11

申请号：US17650074

申请日：2022-02-04

Applicant: Beijing Tusen Zhitu Technology Co., Ltd.

Inventor： Weiwei HUANG ,  Yu ZHANG ,  Jianan HAO

IPC: H05K7/20 ,  H05K1/02

Abstract: The present disclosure discloses a control device, which comprises: a circuit board; a heat dissipation cover comprising a heat dissipation cover plate and a plurality of heat dissipation fins arranged on the heat dissipation cover plate, wherein the heat dissipation cover plate covers the circuit board, and a groove is formed between the plurality of heat dissipation fins; a thermally conductive strip disposed between the circuit board and the heat dissipation cover plate; and a fan arranged in the groove. The heat dissipation cover disclosed herein covers the circuit board as a holistic upper cover, the heat of the circuit board is conducted to the heat dissipation cover through the thermally conductive strip, and the fan in the through groove generate an airflow to dissipate heat, thereby realizing sealing, dustproof and heat dissipation of the circuit board simultaneously.